DSA00505761.pdf by National Semiconductor

Partial File Text Plastic Packages National Semiconductor offers a wide variety of plastic packages for through-hole and surface mount applications. Many of these plastic packages provide cost-effective solutions to
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00505761.pdf preview

Download Datasheet

User Tagged Keywords

CERAMIC LEADLESS CHIP CARRIER ceramic pin grid array package lead finish footprint dip PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC TQFP 80 PACKAGE footprint TSOP 86 Package