DSADA0016305.pdf by OKI Electric Industry

Partial File Text SDIP64-P-750-1.778 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (5µm) 8.70 TYP. 2/Dec. 11, 1996
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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