2042162-1
Abstract: 2042088-1 50 pin slim connector 1982738-1 via antipad pitch connector pin contact Tyco amp 1.25 catalog
Text: 1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 1 Z-PACK Slim UHD Connector Platform RoHS Ready 1-Z-PACK Slim UHD.qxd 13.09.2008 11:18 Uhr Seite 2 Z-PACK Slim UHD Connector Platform Catalog 1654261-5 Issued 9-2008 www.tycoelectronics.com Introduction Key Features
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114-1103 tyco
Abstract: 114-13059 Loctite 472 20GC015-1 LOCTITE 307 1469287-1 hmzd connector loctite 3616
Text: High Speed Backplane Connectors Table of Contents Z-PACK HM-Zd Connector 1 Product Line Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Z-PACK HM-Zd Connector 4, 3, and 2 Pair Right Angle Receptacle Assemblies . . . . . . . . . . . . . .7-9
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raychem high voltage cable termination kit
Abstract: SM 630 finger print module mini pci connector 124 pin din mount 35mm ferrule wire end 24awg 8mm pull strength LOCTITE 307 20 pin Polarized IDC Male Headers with Latch raychem termination kit VME P0 COnnector din mount 96 pin right angle pcb connector
Text: AMP Z-PACK 2mm HM Hard Metric Interconnection System AMP Z-PACK 2mm HM Hard Metric Interconnection System Tyco Electronics — Committed to Customer Service Disclaimer While Tyco Electronics Corporation and its affiliates referenced herein “Tyco Electronics” have made every
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438051-1
Abstract: 438002 91327-1 354687-1 SM-10 Z-PACK 438001-1 122561-1
Text: Data downloaded from http://www.anglia.com - the website of Anglia - tel: 01945 474747 Catalogue 1654741 METRIC Z-PACK 2mm HM Connectors Revised 1-04 Dimensions are millimetres over inches Z-PACK 2mm HM Connector Insertion Tooling — Flat Rock Style There are two styles of
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125mm
438051-1
438002
91327-1
354687-1
SM-10
Z-PACK
438001-1
122561-1
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TB62501F
Abstract: tb62501 tb6808f TA78033LS TA1319AP TB62207BFG TD62C854AF ta1319 TA7804LS TB62207
Text: General-Purpose Linear ICs Operational Amplifier ICs & Comparator ICs z 118 Intelligent Power Devices IPD z 122 Interface Drivers z 125 Motor Drivers z 130 Power Supply ICs z 134 Small-Signal MMICs (High-Frequency Cell-pack) z 142 117 Operational Amplifier ICs & Comparator ICs
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TA75S393F
TA75S01F
TA75S558F
22dBmW
TG2213S
17dBmW
TG2214S
TG2213S.
TG2216TU
TB62501F
tb62501
tb6808f
TA78033LS
TA1319AP
TB62207BFG
TD62C854AF
ta1319
TA7804LS
TB62207
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FD040H02A5P
Abstract: MIL-HDBK-263 S1025 for IR hexfet die
Text: Bulletin I0164J FD040H02A5F FRED Die in Wafer Form z z z 200V VF = 1.0V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VRRM IRM trr RthJC
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I0164J
FD040H02A5F
12-Mar-07
FD040H02A5P
MIL-HDBK-263
S1025
for IR hexfet die
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Untitled
Abstract: No abstract text available
Text: Bulletin I0533J 12/05 FD080H02A5F FRED Die in Wafer Form z z z 200V VF = 0.9V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VFM VFM VRRM
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I0533J
FD080H02A5F
25life.
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MIL-HDBK-263
Abstract: S1025 FD080H02A5F
Text: Bulletin I0533J rev. A 04/06 FD080H02A5F FRED Die in Wafer Form z z z 200V VF = 0.9V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request) Chip Pack, and Sawn on Film d Electrical Characteristics (@ TJ = 25°C) Parameter VFM VFM
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I0533J
FD080H02A5F
12-Mar-07
MIL-HDBK-263
S1025
FD080H02A5F
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CX506
Abstract: MA506
Text: CARDINAL COMPONENTS Surface Mount Crystal Series CX506 Fits Epson MA506 footprint. Part Numbering Example: CX506 Z - A1 B2 C2 200 - 3.579545 D18 - 3 CX506 Z A1* B2 SERIES ADDED FEATURES OPERATING TEMP. CX506 BLANK = BULK PACK A0 = -10°C ~ +60°C Z = TAPE AND REEL A1 = -10°C ~ +70°C
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CX506
MA506
CX506
C-090414-11
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z-pack fb 24 pin connector
Abstract: LR7189 E28476 ISO 9001
Text: Products Commerce About Support Home General Information Part Number Search Alphabetical Search Product Type Search Z-PACK 2mm FB Futurebus+ Connectors Product Family Search Picture Search Industry Product Search Competitor Cross Reference Document Number
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1076-4-0X
SP3179
z-pack fb 24 pin connector
LR7189
E28476 ISO 9001
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Untitled
Abstract: No abstract text available
Text: CARDINAL COMPONENTS Ceramic Surface Mount Series CX5 • Lowest maximum drive level available • Widest frequency range • Very tight stabilities Part Numbering Example: CX5 Z - A1 - B2 - C2 60 - 10.0 D18 - 3 CX5 Z A1* SERIES ADDED FEATURES CX5 BLANK = BULK PACK
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C-090414-11
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Untitled
Abstract: No abstract text available
Text: CARDINAL COMPONENTS Ceramic Surface Mount Series CX5 • Lowest maximum drive level available • Widest frequency range • Very tight stabilities Part Numbering Example: CX5 Z - A1 - B2 - C2 60 - 10.0 D18 - 3 CX5 Z A1* SERIES ADDED FEATURES CX5 BLANK = BULK PACK
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C-090414-11
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CX5Z
Abstract: No abstract text available
Text: CARDINAL COMPONENTS Ceramic Surface Mount Series CX5 • Lowest maximum drive level available • Widest frequency range • Very tight stabilities Part Numbering Example: CX5 Z - A1 - B2 - C2 60 - 10.0 D18 - 3 CX5 Z A1* SERIES ADDED FEATURES CX5 BLANK = BULK PACK
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Untitled
Abstract: No abstract text available
Text: CARDINAL COMPONENTS Low Profile Surface Mount Crystals Series CSM4 CSM5 • 3.0 mm Maximum SMD profile • Very cost competitive • Fast delivery Part Numbering Example: CSM4 Z - A1 B2 C2 200 - 3.579545 D18 - 3 CSM4 Z A1* SERIES ADDED FEATURES CSM4 BLANK = BULK PACK
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C-090414-11
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FD087H02A5B
Abstract: MIL-HDBK-263 MUR820 S1025 0519J
Text: I - 0519J revB FD087H02A5B FRED Die in Wafer Form z z 200V VF = 0.975V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage
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0519J
FD087H02A5B
12-Mar-07
FD087H02A5B
MIL-HDBK-263
MUR820
S1025
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FD120W06A5B
Abstract: for IR hexfet die 15ETX06 MIL-HDBK-263 S1025 FD120W06A5
Text: PD - 20988 rev. B FD120W06A5B FRED Die in Wafer Form z z 600V VF = 3.2 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel, Chip Pack, and Sawn on Film d (upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD120W06A5B
350nC
12-Mar-07
FD120W06A5B
for IR hexfet die
15ETX06
MIL-HDBK-263
S1025
FD120W06A5
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FD120T06A5B
Abstract: 15ETL06 MIL-HDBK-263 S1025
Text: PD - 20987 rev. B FD120T06A5B FRED Die in Wafer Form z z 600V VF = 1.1 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel, Chip Pack, and Sawn on Film d (upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD120T06A5B
190ns
12-Mar-07
FD120T06A5B
15ETL06
MIL-HDBK-263
S1025
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Untitled
Abstract: No abstract text available
Text: PD - 20988 rev. A FD120W06A5B FRED Die in Wafer Form z z 600V VF = 3.2 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel, Chip Pack, and Sawn on Film d (upon request) Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD120W06A5B
350nC
60due
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FD059
Abstract: No abstract text available
Text: I - 0513J rev.B FD059U06A5B FRED Die in Wafer Form z z 600V VF = 1.25V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage
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0513J
FD059U06A5B
FD059
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8ETU04
Abstract: No abstract text available
Text: I - 0523J rev.A FD090U04A5B FRED Die in Wafer Form z z 400V VF = 1.3V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage
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0523J
FD090U04A5B
8ETU04
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Untitled
Abstract: No abstract text available
Text: PD - 20533 revE FD160H06A5B FRED Die in Wafer Form z z 600V VF = 2.6 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD160H06A5B
345nC
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FD160H06A5B
Abstract: 30EPH06 30ETH06 FD160H06A5F FD160H06A5P S1025
Text: PD - 20533 revE FD160H06A5B FRED Die in Wafer Form z z 600V VF = 2.6 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD160H06A5B
345nC
125ability,
12-Mar-07
FD160H06A5B
30EPH06
30ETH06
FD160H06A5F
FD160H06A5P
S1025
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FD120H06A5B
Abstract: 15ETH06 FD120H06A5F FD120H06A5R MIL-HDBK-263 S1025
Text: PD - 20183 rev.D FD120H06A5B FRED Die in Wafer Form z z 600V VF = 2.2 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD120H06A5B
580nC
12ability,
12-Mar-07
FD120H06A5B
15ETH06
FD120H06A5F
FD120H06A5R
MIL-HDBK-263
S1025
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Untitled
Abstract: No abstract text available
Text: HV202 HV203 Supertex inc. M Low Charge Injection 8-Channel High Voltage Analog Switch Ordering Information_ < z z TJ T I < Package Options 20-pin plastic DIP 28-lead plastic chip carrier 48-lead TQFP Die In waffle pack 200V
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HV202
HV203
20-pin
HV20220P
28-lead
HV20220PJ
HV20320PJ
48-lead
HV20220FG
HV20220X
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