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XPN1300ANC
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF) |
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54112-109401300LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch. |
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54121-407061300LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch. |
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54112-107241300LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch. |
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54121-112041300LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch. |
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