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    infineon x-gold

    Abstract: MIPI csi-2 x-gold eMMC X-GOLD613 MIPI CSI-2 Parallel MIPI csi ARM11 infineon gold arm1176 lpddr1
    Text: Product Brief X-GOLD 613 TM 3G Low-Cost Solution for Mobile Internet Browsing & Messaging Main Features The Infineon X-GOLD 613 is a cellular System-on-Chip comprising of 2G/3G digital and analog baseband plus power management functionality, all monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd


    Original     		PDF X-GOLDTM213, X-GOLDTM613 B153-H9352-X-X-7600 NB08-1348 infineon x-gold MIPI csi-2 x-gold eMMC X-GOLD613 MIPI CSI-2 Parallel MIPI csi ARM11 infineon gold arm1176 lpddr1

    X-GOLD 110

    Abstract: Infineon X-GOLD 110 XGOLD110 X-GOLDTM110 XMM1100 X-GOLD XMMTM1100 infineon x-gold eWLB-184 B153-H9349-X-X-7600
    Text: Product Brief X-GOLDTM110 Ultra-Low Cost GSM/GPRS Single-Chip for Voice, SMS and basic Multimedia Main Features THE X-GOLD 110 brings the Infineon GSM single-chip ULC family to the next level of integration based on a 65nm technology node. X-GOLDTM110 is an ideal solution for ULC Music Phones supporting key features such as


    Original     		PDF X-GOLDTM110 X-GOLDTM110 XMMTM1100 B153-H9349-X-X-7600 NB08-1340 X-GOLD 110 Infineon X-GOLD 110 XGOLD110 XMM1100 X-GOLD infineon x-gold eWLB-184 B153-H9349-X-X-7600

    Infineon X-GOLD 110

    Abstract: Infineon X-GOLD 618 infineon x-gold xmm 6180 X-GOLD 618 MIPI CSI-2 Parallel X-GOLD 110 smarti UE MIPI csi-2 MIPI csi
    Text: Product Brief X-GOLD 618 TM Cost efficient HSPA Baseband for Multimedia enabled Cellular Phones Main Features THE Infineon X-GOLD 618 is a cellular system on chip comprising the 2G/3G digital and analog baseband and the power management functions monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd


    Original     		PDF 384kbps MSC33 B153-H9353-G1-X-7600 NB09-1000 Infineon X-GOLD 110 Infineon X-GOLD 618 infineon x-gold xmm 6180 X-GOLD 618 MIPI CSI-2 Parallel X-GOLD 110 smarti UE MIPI csi-2 MIPI csi

    Infineon X-GOLD 102

    Abstract: PG-VF2BGA-189 infineon x-gold X-GOLD 102 X-GOLD C166V2 XMMTM1020 xgoldtm102 infineon gold teaklite
    Text: Product Brief X-GOLDTM102 Single-Chip Solution for ULC color and music phones Main Features The X-GOLD 102 is an extension of the Infineon single-chip family providing entertainment features to ULC handsets at lowest cost. The singlechip is an ideal solution for ULC Music Phones supporting key features such


    Original     		PDF X-GOLDTM102 C166V2 X-GOLDTM102 XMMTM1020 B153-H9338-G1-X-7600 NB08-1343 Infineon X-GOLD 102 PG-VF2BGA-189 infineon x-gold X-GOLD 102 X-GOLD C166V2 xgoldtm102 infineon gold teaklite

    infineon x-gold

    Abstract: Infineon X-GOLD 113 ARM11 processor arm1176 block diagram of mp3 player digital with fm radio receiver X-GOLD x-gold 113 x-goldtm101 FM stereo wireless headset GSM transmitter receiver
    Text: Product Brief X-GOLDTM113 Ultra-low cost GSM/GPRS Single-Chip Solution for Music Phones Main Features THE Infineon X-GOLD 113 is the first Single-Chip in 65nm CMOS technology that integrates Baseband, RF Transceiver, Power Management Unit and FM Radio. After the successful market introduction of the 2nd generation


    Original     		PDF X-GOLDTM113 X-GOLDTM101 X-GOLDTM113 ARM11 B153-H9151-G1-X-7600 NB08-1329 infineon x-gold Infineon X-GOLD 113 ARM11 processor arm1176 block diagram of mp3 player digital with fm radio receiver X-GOLD x-gold 113 x-goldtm101 FM stereo wireless headset GSM transmitter receiver

    LF2BGA-189

    Abstract: PG-VF2BGA-189 X-GOLDTM101 Infineon E-GOLDradio handsfree chip infineon gsm gsm baseband E-GOLD XMMTM1020 IF Single-Chip Transceiver
    Text: Product Brief X-GOLDTM101 & X-GOLDTM102 Single-Chip Ultra-Low Cost Solution T H E I N F I N E O N X - G O L D TM 1 0 1 formerly E-GOLDTMvoice sets a new industry standard in System-on-Chip (SoC) integration by being the first GSM single-chip with integrated Power Management Unit. After successful integration


    Original     		PDF X-GOLDTM101 X-GOLDTM102 X-GOLDTM101 B153-H9149-X-X-7600 LF2BGA-189 PG-VF2BGA-189 Infineon E-GOLDradio handsfree chip infineon gsm gsm baseband E-GOLD XMMTM1020 IF Single-Chip Transceiver

    PIMD3

    Abstract: No abstract text available
    Text: BGS22WL10 DPDT Dual-Pole / Double-Throw Differential RF Switch Data Sheet Revision 1.6 - May 27, 2014 Power Management & Multimarket Edition May 27, 2014 Published by Infineon Technologies AG 81726 Munich, Germany c 2011 Infineon Technologies AG All Rights Reserved.


    Original     		PDF BGS22WL10 TSLP-10-1-PO TSLP-10-1 TSLP-10-1-FP TSLP-10-1 TSLP-10-1-TP PIMD3

    infineon X-GOLD SDR 20

    Abstract: infineon X-GOLD SDR 20 LTE X-GOLDTM lte RF Transceiver MIMO 2x2 X-GOLD infineon baseband processor 1176JZ 2x2 MIMO teaklite polar modulator
    Text: Product Brief X-GOLD SDR 20 TM Programmable Baseband Processor for Multi-Standard Cell Phones Main Features To address the “multi-standard challenge” where an increasing number of cellular, connectivity, broadcast, and multimedia standards co-exist in a


    Original     		PDF B119-H9160-G1-X-7600 NB09-1053 infineon X-GOLD SDR 20 infineon X-GOLD SDR 20 LTE X-GOLDTM lte RF Transceiver MIMO 2x2 X-GOLD infineon baseband processor 1176JZ 2x2 MIMO teaklite polar modulator

    x-gold 101 pmb7880

    Abstract: mobile phone basic block diagram infineon x-gold x-gold x-gold 101 sip voip Antenna Factor gsm 900 sim 900 RTC gsm modem block diagram sim gsm modem circuit diagram
    Text: Solution Brief XMM 1013 Low-Cost Dual-Mode GSM/Wi-Fi Platform THE INFINEON XMM™1013 is the first low-cost mobile device platform that introduces Voice-over-IP capability in voice-centric phones. In addition to providing the user with the basic ability to make GSM telephone calls, to send and receive SMS


    Original     		PDF XMMTM1013 XMMTM1013 X-GOLDTM101, B153-H9168-X-X-7600 x-gold 101 pmb7880 mobile phone basic block diagram infineon x-gold x-gold x-gold 101 sip voip Antenna Factor gsm 900 sim 900 RTC gsm modem block diagram sim gsm modem circuit diagram

    Infineon X-GOLD 213

    Abstract: X-GOLDTM213 xgold 213 infineon x-gold X-GOLD 208 INFINEON infineon baseband processor x-gold 208 X-GOLD 213 INFINEON xgold X-GOLD x-gold 213
    Text: Product Brief X-GOLDTM213 Lowest-cost EDGE Single-Chip Solution for Mobile Internet Browsing & Messaging Main Features THE Infineon X-GOLD 213 is the first Single-Chip in 65nm CMOS technology that integrates Baseband, RF Transceiver, Power Management Unit


    Original     		PDF X-GOLDTM213 X-GOLDTM101 X-GOLDTM213 ARM11nces. B153-H9150-G1-X-7600 NB08-1329 Infineon X-GOLD 213 xgold 213 infineon x-gold X-GOLD 208 INFINEON infineon baseband processor x-gold 208 X-GOLD 213 INFINEON xgold X-GOLD x-gold 213

    xgold dual sim

    Abstract: No abstract text available
    Text: Product Brief X-GOLDTM102 DS GSM Single-Chip for Dual-SIM support Main Features The X-GOLD 102 DS is an extension of the Infineon single-chip family providing entertainment features to ULC handsets at lowest cost. The singlechip is an ideal solution for dual SIM ULC Music Phones, supporting key


    Original     		PDF X-GOLDTM102 C166V2 104MHz XMMTM1028 B153-H9339-X-X-7600 NB08-1293 xgold dual sim

    infineon x-gold

    Abstract: C166 X-GOLD xgold dual sim
    Text: Product Brief X-GOLDTM102 DS GSM Single-Chip for Dual-SIM support Main Features The X-GOLD 102 DS is an extension of the Infineon single-chip family providing entertainment features to ULC handsets at lowest cost. The singlechip is an ideal solution for dual SIM ULC Music Phones, supporting key


    Original     		PDF X-GOLDTM102 C166V2 104MHz XMMTM1028 B153-H9339-G1-X-7600 NB08-1343 infineon x-gold C166 X-GOLD xgold dual sim

    PIMD3

    Abstract: No abstract text available
    Text: BGS22W2L10 DPDT Dual-Pole / Double-Throw Differential RF Switch Data Sheet Revision 1.4 - October 12, 2012 Power Management & Multimarket Edition October 12, 2012 Published by Infineon Technologies AG 81726 Munich, Germany c 2011 Infineon Technologies AG


    Original     		PDF BGS22W2L10 TSLP-10-1-PO TSLP-10-1 TSLP-10-1-FP TSLP-10-1 TSLP-10-1-TP PIMD3

    Untitled

    Abstract: No abstract text available
    Text: BGS12PL6 General purpose RF CMOS power SPDT Switch in ultra small package with 0.77mm2 footprint Preliminary Data Sheet Revision 1.9, 2013-04-04 Preliminary Power Management & Multimarket Edition April 4, 2013 Published by Infineon Technologies AG 81726 Munich, Germany


    Original     		PDF BGS12PL6 77mm2

    Infineon X-GOLD 616

    Abstract: XGOLD616 infineon x-gold tx 2G 3g modem ic X-GOLDTM616 "x-gold 616" infineon baseband processor MSC33 X-GOLD 616
    Text: Product Brief X-GOLDTM616 High Performance Modem Solution for Smart Phones Main Features The Infineon X-GOLD 616 is a cellular system on chip comprising of the 2G/3G digital and analogue baseband plus the power management function all monolithically integrated in 65nm CMOS technology. It is


    Original     		PDF X-GOLDTM616 386kbps MSC33 B153-H9337-X-X-7600 NB08-1293 Infineon X-GOLD 616 XGOLD616 infineon x-gold tx 2G 3g modem ic X-GOLDTM616 "x-gold 616" infineon baseband processor MSC33 X-GOLD 616

    X-GOLD 118

    Abstract: xgold 118 ARM11 processor Infineon X-GOLD 116 X-GOLD x-goldtm ARM11 baseband block diagram of wireless gsm camera infineon x-gold gsm modem block diagram
    Text: Product Brief X-GOLDTM116 Ultra-low cost GSM/GPRS Single-Chip Solution for Messaging Phones Main Features THE Infineon X-GOLD 116 is the first Single-Chip in 65nm CMOS technology that integrates Baseband, RF Transceiver, Power Management Unit and FM Radio. After the successful market introduction of the 2nd generation


    Original     		PDF X-GOLDTM116 X-GOLDTM101 X-GOLDTM116 ARM11ances. B153-H9348-X-X-7600 NB08-1333 X-GOLD 118 xgold 118 ARM11 processor Infineon X-GOLD 116 X-GOLD x-goldtm ARM11 baseband block diagram of wireless gsm camera infineon x-gold gsm modem block diagram

    PIMD3

    Abstract: No abstract text available
    Text: BGS22WL10 DPDT Dual-Pole / Double-Throw Differential RF Switch Data Sheet Revision 1.2 - September 14, 2012 Power Management & Multimarket Edition September 14, 2012 Published by Infineon Technologies AG 81726 Munich, Germany c 2011 Infineon Technologies AG


    Original     		PDF BGS22WL10 TSLP-10-1-PO TSLP-10-1 TSLP-10-1-FP TSLP-10-1 TSLP-10-1-TP PIMD3