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351nF DesignCon 2010 Analysis FPGA Noise Propagation Package Modeling Altera Corporation

Abstract: 400um XCItepi powersi 50GHZ 351nF Design Seminar Signal Transmission Fabrication process steps metal core pcb
Text: DesignCon 2010 Analysis of FPGA PDN Noise Propagation by Die & Package 3D Modeling Zhe Li, Altera Corporation ZLI@altera.com Dr. Hong Shi, Altera Corporation hshi@altera.com Kenneth Kwan, Altera Corporation kkwan@altera.com Dr. John Y. Xie, Altera Corporation