X 13 V Search Results

CCD143A

Contextual Info: Linear Image Sensor Selection Guide CCD Device Maximum Number Pixel Size Pixel Pitch Data Rate of Pixels pm (MHz) 0*m) CCD111 256 13 x 17 13 10.0 CCD112- 256 13 x 17 13 10.0 CCD153A 512 13 x 13 13 20.0 CCD133A 1024 13 x 13 13 20.0 CCD134 1024 13 x 13 13

Contextual Info: Low Voltage Supplementary Fuses 13 ⁄32” x 13⁄8” Fast-acting fuses BBS KTQ Specifications Class: Supplemental Description: Fast-acting supplementary fuse. Dimensions: 13⁄32” x 13⁄8” 10.3 x 34.9mm . Construction: Fiber cartridge. Ratings: Volts — 600Vac (1⁄10-5A)

PEAK tray drawing

Abstract: 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0908-03 DATE: 9/16/2009 Product Affected: 13 mm x 13 mm PBGA-144 & 13 mm x 13 mm CABGA-144 Date Effective: Contact: Title: Phone #:

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: eMMC 4.51 Samsung eMMC 4.41 emmc 4.5 spec Samsung eMMC 4.51 emmc 4.41 spec eMMC PoP samsung lpddr2 153 ball eMMC memory 0.8 emmc spec samsung
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Samsung eMMC 4.51

Abstract: samsung eMMC 4.5
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 2, 05/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: Samsung eMMC 4.41 lpddr2 emmc emmc 4.41 spec emmc 4.5 spec 153 ball eMMC memory Samsung eMMC 4.51 samsung* lpddr2* pop package emmc Pin assignment eMMC 4.4
Contextual Info: Freescale Semiconductor Data Sheet: Advanced Information Document Number: IMX50CEC Rev. 2, 04/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

samsung eMMC 4.5

Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51
Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

Contextual Info: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch

spec RG-179

Abstract: spec RG-178 59 8483 042
Contextual Info: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8

20 8484 024 001 025

Contextual Info: Style M Connectors Board Layouts STYLE 1/2 M 48.3 1.902 7.62 (0.300) 13 x 2.54 = 33.02 (13 x 0.100 = 1.300) 7.62 (0.300) 7.62 (0.300) 12 x ø1.00 (12 x ø0.039) 2.54 (0.100) 2 x ø2.80 (2 x ø0.110) c 5.08 (0.200) b a 5.30 (0.209) 16 15 14 13 12 11 10 9 8

Fuse 250V 2A G20

Abstract: weidmuller fuse 1.6A fuse 5AF10
Contextual Info: Fuse terminals 10 mm2 KSKM 1 10 mm2 KSKM 2 5 x 20 1 x 1/4 13 x 69 x 63 6.3 / 16 0.33 . 16 13 x 69 x 63 13 / 16 0.33 . 16 TS 32 / PA TS 32 / PA When using ATEX certified components in hazardous area applications the installation instructions and the rated data for

Contextual Info: Low Voltage Supplementary Fuses 13 ⁄32” x 11⁄2” Time-delay fuses FNQ Specifications Class: Supplemental Description: Time-delay supplementary fuse. Dimensions: 13⁄32” x 11⁄2” 10.3 x 38.1mm . Construction: Fiber tube. Ratings: Volts — 250Vac (or less)

Weidmuller TS35x7.5

Abstract: Fuse 0430900000 0430700000 04-4630 043050 5AF10
Contextual Info: Fuse terminals 10 mm2 KSKM 1 10 mm2 KSKM 2 5 x 20 1 x 1/4 13 x 69 x 63 6.3 / 16 0.33 . 16 13 x 69 x 63 13 / 16 0.33 . 16 TS 35 / PA TS 35 / PA When using ATEX certified components in hazardous area ap- A plications the installation instructions and the rated data for

BXY10

Abstract: BXY13D BXY10C Z6 DIODE BXY13 BXY11 BXY10D BXY11E BXY13C DIODE G06
Contextual Info: B X Y 10 C, 10 D, 11 E, 13 C, 13 D, 14 E Charge storage varactors for frequency multiplication Epitaxial silicon mesa diodes in a ceramic microwave case T yp e B X Y 10 C BXY10D BXY11E BXY13C B X Y 13 D B X Y 14 E T h e rm a l r e s is t a n c e Junction to case

Contextual Info: IBM0325404 IBM0325804 IBM0325164 IBM03254B4 256Mb Synchronous DRAM - Die Revision A APPLICATION SPEC # 29L0000.E36980 Engineering Change Number 13 ROW /1 1 COL / 2 BS 16Mb x 4 I/O x 4 Bank 13 ROW /1 0 COL / 2 BS (8Mb x 8 I/O x 4 Bank) Date E36980 13 ROW / 9 COL / 2 BS (4Mb x 16 I/O x 4 Bank)

FSG-30A

Abstract: ul 248 fuse 20A FSG-20A FSG-40A FSG-10A 40A fuse automotive Fuse 30A FSG-15A FSG-25A FSG-35A
Contextual Info: Type FSG Automotive Glass Fuse 13/32" x 1-1/2" 10.3 x 38.1mm www.optifuse.com Fuse Size: 13/32” x 1 ½” (10.3 x 38.1mm) Ampere Rating: 500mA ~ 80A Voltage Rating: 32V AC/DC Time Characteristics: 100% Rated Current Min. 500mA – 30A 4h 35A-80A 4h 135%

Contextual Info: 2.54 A Male headers soldering technique  0,635 mm, Sandwich B 2,54 3,3 2,8 L S = 6 mm C A 2,8 n x 2,54 2,5 11 S n - 1 x 2,54 0,635 art. no. D 13 13 13 13 13 071 097 122 147 187 . . . . . A 7.10 9.70 12.20 14.70 18.70 art. no. L 21.40 24.00 26.50

CM508

Abstract: Z0904
Contextual Info: X Kontaktanordnung contact I 32 E i n l ö t - K o n t a k t e 32 s o l d e r - c o n t a c t s arrangement 32 28 30 24 26 20 22 16 18 12 U 8 10 6 2 13 13 13 13 13 13 13 13 13 13 13 13 13 13 H o o B 1 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 ? Bl solder-contac t

RDJ11

Abstract: FU633 of blown fuse indicator BJS131 FEM13U TH91 56102 PR30 0168 013.10
Contextual Info: T01089 020128 MU 10/13.SF2 Fuse holder terminal blocks for 6,35 x 25,4 mm 1/4 x 1 in. and 6,35 x 32 mm 1/4 x 1 1/4 in. fuses Compression clamp MU 10/14,5.SF2 Spacing 13 mm .512" Spacing 14,5 mm (.571") 13 mm block for blown fuse indicator (to be ordered separately).

Contextual Info: X Kontaktanordnung contact Z 2: 1 32 E in l ö t - K o n t a k t e 32 s o l d e r - c o n t a c t s arrangement 32 28 30 24 26 20 22 16 18 12 U 8 10 4 6 2 Bl solder-contac t _ a 13 13 13 13 13 13 13 13 13 13 13 13 13 13 H o o B 1 13 13 13 13 13 13 13 13 13 13 13 13 13 13 13 ?

Contextual Info: 5 X K o n t a k t a n o r d n u n g / contact arrangement 15 Kontakte 15 contacts 32 28 24 20 16 12 8 4 I 30 | 26 | 22 | 18 | U | 10 | 6 | IX I IX I X I X X I X X IX I ^1IX 13^ X 13^1 X I 13 X L ochbi I d / board drillings 32 I 7x 10,16 4 4 — d I (=71,12)