AWM 20267
Abstract: AWG 28
Text: 3M Round, Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond
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TS-0070-22
AWM 20267
AWG 28
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AWM 20267
Abstract: TS-0070-C MARKING EU
Text: 3M Round, Jacketed, Flat Cable .050" 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows
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TS-0070-C
RIA-2217B-E
AWM 20267
TS-0070-C
MARKING EU
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E118773
Abstract: AWM 20267
Text: 3M Round, Jacketed, Flat Cable .050" 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows
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RIA-2217B-E
E118773
AWM 20267
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AWM 20267
Abstract: MARKING EU
Text: 3M Round, Jacketed, Flat Cable .050" 26 AWG Stranded, Mass-Term, PVC/PVC 3758 Series • Round construction permits easier routing • 26 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows
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TS-2200-B
RIA-2217B-E
AWM 20267
MARKING EU
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nsmd smd
Abstract: AND8195 SO8FL Solder paste stencil life AND8195/D 020C 1505C
Text: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat
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AND8195/D
nsmd smd
AND8195
SO8FL
Solder paste stencil life
AND8195/D
020C
1505C
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SO8FL
Abstract: FOOTPRINT PCB nsmd smd stencil tension WS3060 so8 pcb pattern 1505C 020C
Text: AND8195/D Board Mounting Notes for SO8−Flat Lead Prepared by: Steve St. Germain, Phil Celaya, and Isauro Amaro ON Semiconductor http://onsemi.com APPLICATION NOTE INTRODUCTION Wire Bond Various ON Semiconductor devices are packaged in an advanced power leadless package named Quad Flat
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AND8195/D
SO8FL
FOOTPRINT PCB
nsmd smd
stencil tension
WS3060
so8 pcb pattern
1505C
020C
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Untitled
Abstract: No abstract text available
Text: G•SiC Technology XBright® Plus LEDs CxxxXB290-S0100-A-Plus Features • • • Applications XBright® Plus Performance – 15.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting Single Wire Bond Structure • White LEDs
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CxxxXB290-S0100-A-Plus
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Untitled
Abstract: No abstract text available
Text: G•SiC Technology XBright® LEDs Cxxx-XB290-S0100-A Features • Applications XBright® Performance – 12.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting • Single Wire Bond Structure • Class II ESD Rating • White LEDs
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Cxxx-XB290-S0100-A
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Untitled
Abstract: No abstract text available
Text: G•SiC Technology XBright® Plus LEDs CxxxXB290-S0100-A-Plus Features • Applications XBright® Plus LED Performance – 15.0 mW min Blue • Single Wire Bond Structure • Class II ESD Rating • Outdoor LED Video Displays • Automotive Dashboard Lighting
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CxxxXB290-S0100-A-Plus
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Untitled
Abstract: No abstract text available
Text: G•SiC Technology XBright LEDs CxxxXB290-S0100-A Features • XBright Applications • Outdoor LED Video Displays LED Performance – 12.0 mW min Blue 460nm and 470nm • Automotive Dashboard Lighting – 7.0 mW min Green (527nm) • White LEDs • Single Wire Bond Structure
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CxxxXB290-S0100-A
460nm
470nm)
527nm)
527nm
470nm
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awm style 3239 vw-1 24 awg
Abstract: MARKING EU 101XX-8X00EE 20596
Text: 3M Round, Jacketed, Flat Cable .025" 30 AWG Stranded, Mass-Term, PVC/PVC 3896 Series • Round construction permits easier routing • 30 AWG wire on .025 inch centers permits mass termination • Continuous split/bond allows for mass termination on 2.4 inch centers approximate
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82XXX-600X,
101XX-8X00EE,
P25E-XXXs-XXX
RIA-2217B-E
awm style 3239 vw-1 24 awg
MARKING EU
101XX-8X00EE
20596
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Cxxx-XB290-S0100-A-Plus
Abstract: C460XB290-0105-A C460XB290-0106-A C460XB290-0107-A C460XB290-0108-A C470XB290-0105-A C470XB290-0106-A C470XB290-0107-A OS4000
Text: G•SiC Technology XBright® Plus LEDs Cxxx-XB290-S0100-A-Plus Features • Applications XBright® Plus Performance – 15.0 mW min Blue • Outdoor LED Video Displays • Automotive Dashboard Lighting • Single Wire Bond Structure • Class II ESD Rating
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Cxxx-XB290-S0100-A-Plus
Cxxx-XB290-S0100-A-Plus
C460XB290-0105-A
C460XB290-0106-A
C460XB290-0107-A
C460XB290-0108-A
C470XB290-0105-A
C470XB290-0106-A
C470XB290-0107-A
OS4000
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AWM 20267
Abstract: E118773
Text: 3M Round, Shielded/Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series • Round construction permits easier routing • 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors • Continuous split/bond repeat allows for mass
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TS-0083-18
AWM 20267
E118773
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3m 3659
Abstract: 365914300sf
Text: 3M Round, Shielded/Jacketed, Flat Cable .050" 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series • Round construction permits easier routing • 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors • Continuous split/bond repeat allows for mass
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TS-0083-B
Physi16100SF
3659/16300SF
3659/20SO
3659/25300SF
3659/36100SF
3659/36300SF
3659/37300SF
3659/40300SF
3659/60300SF
3m 3659
365914300sf
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AWM 20267
Abstract: No abstract text available
Text: 3M Round, Shielded/Jacketed, Flat Cable .050" 28 AWG Stranded, Mass Terminatable, PVC/PVC 3659 Series • Round construction permits easier routing • 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors • Continuous split/bond repeat allows for mass
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TS-0083-OT
RIA-2217B-E
AWM 20267
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AWM 20267
Abstract: AWM IIA/B
Text: 3M Round, Shielded/Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass-Term, PVC/PVC 3659 Series S Round construction permits easier routing S 28 AWG wire on .050 inch pitch permits mass termination to broad line of IDC connectors S Continuous split/bond repeat allows for mass
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TS-0083-17
AWM 20267
AWM IIA/B
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AuSn eutectic
Abstract: wire bond recommendations Die Attach and Bonding Guidelines Gan on silicon transistor Gan on silicon substrate AN008 DIE BONDER
Text: Application Note AN-008 Die Attach and Bonding Recommendations Introduction While Nitronex’s core market is packaged RF products, we sell die to select customers for use in modules and subsystems. One benefit of Nitronex GaN devices is they are fabricated on industry standard silicon wafers so
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AN-008
AuSn eutectic
wire bond recommendations
Die Attach and Bonding Guidelines
Gan on silicon transistor
Gan on silicon substrate
AN008
DIE BONDER
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GaAs MMIC ESD, Die Attach and Bonding Guidelines
Abstract: RDE capacitor HMMC-5021 HMMC-5022 HMMC-5025 HMMC-5026 HMMC-5027
Text: Agilent GaAs MMIC TWA Users Guide Application Note # 56 - Revision A January 2001 Includes: 1. Device Schematic, Topology, and Theory of Operation Descriptions 2. Assembly, Bonding, & Biasing Recommendations 3. Extended Low-Frequency Operation Assembly Guidelines
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HMMC-5021,
HMMC-5022,
HMMC-5026,
HMMC5027
HMMC-5025
HMMC-5021/22/26
HMMC-5021/22/26
GaAs MMIC ESD, Die Attach and Bonding Guidelines
RDE capacitor
HMMC-5021
HMMC-5022
HMMC-5026
HMMC-5027
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transistor tip 1050
Abstract: HBT transistor PH ON 823 0728 tip 410 transistor
Text: MMT501 InGaP HBT Transistor DEVICE HANDLING RECOMMENDATIONS ESD These devices are Class 1 devices 0–500 V for Electrostatic Discharge Sensitivity (ESD) and must be handled accordingly to prevent damage. Proper ESD precautions should be observed during all
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MMT501
MIL-HDBK-263
MIL-STD-1686.
transistor tip 1050
HBT transistor
PH ON 823
0728
tip 410 transistor
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asm eagle
Abstract: WHP-002 flux-eutectic 2151-HTV21-CT-series CPR3-AN03 EZ290 bonding wire cree UP78 EZ1000 1572-17-437GM-20D
Text: EZBright LED Handling and Packaging Recommendations This applications note provides the user with a basic understanding of Cree’s EZBright LED chips, as well as recommendations on handling and packaging. Cree’s EZBright LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials
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EZ290TM
EZR260TM
EZ290,
EZR260
EZ1000
CPR3AN04
asm eagle
WHP-002
flux-eutectic
2151-HTV21-CT-series
CPR3-AN03
EZ290
bonding wire cree
UP78
1572-17-437GM-20D
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1N23 diode
Abstract: SINGLE ENDED MIXER 1N23 ALPHA 1N23 Diode Holder surface mount zero-bias detector diode silicon di for microwave diode mixer x-band motion detector metal diode Silicon Point Contact Mixer Diodes zero bias diode
Text: Application Note 80800: Mixer and Detector Diodes 2. BONDED CONTACT This construction features a gold wire bonded from the rim of the package to a bonding pad on the chip and then to the rim opposite the first bond. A cap is then soldered to this rim thus completing the assembly and
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84-1 CONDUCTIVE EPOXY
Abstract: copper bond wire
Text: RECOMMENDATIONS FOR MOUNTING AND BONDING GaAs MMIC CHIPS Die or Chip Mounting It is important that GaAs chips are mounted correctly to avoid significant increase in thermal impedance and to avoid consequent damage during wire bonding. This is particularly important for large area chips such as MMIC's
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BT22
Abstract: No abstract text available
Text: RECOMMENDATIONS FOR MOUNTING AND BNDING GaAs MMIC CHIPS Die or Chip Mounting It is important that GaAs chips are mounted correctly to avoid significant increase in thermal impedance and to avoid consequent damage during wiring bonding. This is particularly important for large area chips such as MMIC’s
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Ablestick36-2
BT22
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bond wire copper
Abstract: copper bond wire
Text: 0 O P T E K Application Bulletin 211 July 1989_ Recommendations for Soldering T-1 3/4 Plastic Encapsulated Discrete Components_ Plastic encapsulated components such as T-1 3/4
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Texas75006
bond wire copper
copper bond wire
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