C18070
Abstract: Atotech c14415 Cu6Sn5 C18090 olin 194 Olin-194 CuCrSiTi Cu3Sn FeNi42
Text: Whisker Formation on Tin Plated Cu based Leadframes Results and Conclusion 29 October 2004 Content • • • • • Introduction Experience E4 Main cause whisker growth on Cu LF Countermeasures Conclusions Introduction Period of potential whisker growth
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FeNi42
ST-150
ST-200
150oC
C18070
Atotech
c14415
Cu6Sn5
C18090
olin 194
Olin-194
CuCrSiTi
Cu3Sn
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DE-AC03-76SF00098
Abstract: Cu3Sn Cu6Sn5 sncu0.7
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
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DE-AC03-76SF00098
Abstract: Cu3Sn sncu0.7 Cu6Sn5 Ortec Cu6Sn5 formation whisker Cu base b110c
Text: Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish *W. J. Choi, T. Y Lee, and K. N. Tu Dept. of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595 N. Tamura, R. S. Celestre, and A. A. MacDowell Advanced Light Source, LBNL, Berkeley, CA 94720
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ALLOY leadframe C7025
Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
Text: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,
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D-93009
ALLOY leadframe C7025
ALLOY leadframe C7025 material property
C19400
leadframe materials
C18070
leadframe C7025
Cu6Sn5
MF202
C7025
c14415
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Infineon diffusion solder
Abstract: Cu6Sn5 C1870 equivalent transistor of C1870 Olin-194 C70250 C19400 C14415 F-38019 OLIN194
Text: Tin Whiskers on Lead-free Platings P.J.T.L. Oberndorff1, M. Dittes2, L. Petit3, C.C. Chen4, J. Klerk1 and E.E. de Kluizenaar1 Philips, Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 1000944, D-93009 Regensburg, Germany, marc.dittes@infineon .com
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D-93009
F-38019
Infineon diffusion solder
Cu6Sn5
C1870
equivalent transistor of C1870
Olin-194
C70250
C19400
C14415
OLIN194
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murata mlcc
Abstract: Au Sn eutectic murata, whisker SEM 2004 AN-450 surface mounting methods
Text: Whiskering Evaluation of Capacitors Mounted with Lead Free Solders Abhijit Gurav and Bruce Stacy KEMET Electronics Corporation Greenville, SC Abstract Capacitors with matte tin termination finishes were tested for tin whisker growth. The study incorporated two types of
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leadframe Cu C194
Abstract: ALLOY leadframe C7025 ALLOY leadframe C7025 material property SEM 2004 SEM 2006 leadframe C7025 SO044 electronics nasa study of alloy C194
Text: Matte Tin Sn Plating Of Semiconductor Devices – Whisker Growth Study Anocha Sriyarunya Spansion (Thailand) Limited Pakkerd, Nonthaburi, Thailand Dhiraj Bansal Spansion LLC (US) Sunnyvale, CA, USA Abstract In the industry’s drive towards becoming lead free (Pb-free) by July 1, 2006, as dictated by the WEEE Directive, several Pbfree terminal finishes have been proposed and evaluated. Some of them were rejected as soon as evaluations began. Others
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smema
Abstract: smema control STR223 smema wiring electronics nasa smema specifications Phoenix contact subcon 9 connector tamura solder paste tamura tin lead solder paste Telcon
Text: TND311 Tin Whisker Info Brief" http://onsemi.com APPLICATION NOTE acceleration test with quantified acceleration factors is unknown. This is complicated further by the highly variable “incubation” period during which stress builds before whiskers grow. However, ON has completed testing using
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TND311
TND311/D
smema
smema control
STR223
smema wiring
electronics nasa
smema specifications
Phoenix contact subcon 9 connector
tamura solder paste
tamura tin lead solder paste
Telcon
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JESD22A121
Abstract: IC SEM 2005 SZZA051B chopin JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes SZZA031
Text: Application Report SZZA051B – August 2005 – Revised August 2005 Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm . SLL Logic ABSTRACT Integrated circuits ICs with both tin-lead (SnPb) and Pb-free finished leads were
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SZZA051B
JESD22A121
IC SEM 2005
SZZA051B
chopin
JEDEC no 21 environmental acceptance requirements for tin whiskers susceptibility of tin and tin al
JESD22a121 measuring whisker growth on tin and tin alloy surfaces finishes
SZZA031
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IMCS 700
Abstract: No abstract text available
Text: STRATEGIES TO MITIGATE THE TIN WHISKER PHENOMENON Patrick Lavery, Principal Process Engineer, Vicor Corporation The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting point elements e.g., Sn, Cd, In in operations such as
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CHA capacitor Series
Abstract: hc 2000h tantalum capasitor GKHH Series film capasitor CAPASITOR TANTALUM
Text: Corresponding to RoHS Directive A lu m in u m e lec tro lytic ca p a cito r C orresp onding to R oH S m aterial D irective T he p ortion of the com p onents Platin g on term in als In sulatin g Slee ves S M D typ e L ead w ire term in al typ e Available Available
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J-STD-020C)
CHA capacitor Series
hc 2000h
tantalum capasitor
GKHH Series
film capasitor
CAPASITOR TANTALUM
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Cu6Sn5
Abstract: 22A121 AN2035 Cu3Sn an2035 st Cu6Sn5 surface energy 176L FeNi42 SO36L
Text: AN2035 Application note Control of whisker growth in Tin alloy coatings 1 Nature of whiskers and whisker mitigation techniques Some metals show an unusual metallurgical phenomenon: a single, microscopic crystal filament of the metal grows “spontaneously” from its surface. The metals concerned include
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AN2035
Cu6Sn5
22A121
AN2035
Cu3Sn
an2035 st
Cu6Sn5 surface energy
176L
FeNi42
SO36L
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M705-221BM5-32-11
Abstract: M705 solder paste ET-7403 ET740 221bm solder paste m705 7403 not M705 SN30 test SOt23
Text: Elimination of Lead Pb from Lead Plating in Semiconductor Packages 2005 Semiconductor Division Seiko Instruments Inc. − Ver.1.0 − PP TMPL001 Background of Trend Toward Lead-Free Products A large number of electronic parts are usually used in electronic devices. These
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TMPL001
M705-221BM5-32-11
M705 solder paste
ET-7403
ET740
221bm
solder paste m705
7403 not
M705
SN30
test SOt23
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FeNi42
Abstract: C18070 LF-304 53RD J-STD-004 leadframe materials CuCrSiTi FeNi42-leadframe lf304 Cu6Sn5
Text: Whisker Root Cause and Respective Test Conditions Dittes, M*.; Oberndorff, P*.; Crema, P.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com paolo.crema@st.com Abstract Electroplated Tin on leadframe components is the leadfree alternative to SnPb plating of widest use worldwide.
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LF-304,
FeNi42
C18070
LF-304
53RD
J-STD-004
leadframe materials
CuCrSiTi
FeNi42-leadframe
lf304
Cu6Sn5
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C18070
Abstract: C1807 smema C70250 FeNi42 Cu6Sn5 CuCrSiTi Infineon diffusion solder C19400 C1441
Text: Tin Whisker Formation – Results, Test Methods and Countermeasures Dittes, M*.; Oberndorff, P*.; Petit, L.* *Infineon Technologies, * Philips CFT, * STMicroelectronics marc.dittes@infineon.com pascal.oberndorff@philips.com luc.petit@st.com Abstract
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible RoHS* compliant platings available
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TS-1125-03
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Stacking Socket 2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • High-profile/high pin count • Ideal for parallel stacking applications • Vertical receptacle
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TS-1118-04
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AUS308
Abstract: AUS308 thermal kester 256 AUS303 AUS-308 aus5 kester 245 solder wire Lead Free reflow soldering profile BGA
Text: Challenges in Manufacturing Reliable Lead-Free and RoHS-Compliant Components WP-CHMFGRELLDFR-2.0 White Paper The push for lead-free or RoHS-compliant products is resulting in significant changes in packaging materials. Manufacturers of electronic equipment require materials that
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Socket 2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle MP2 Series • • • • • • • • End-to-end stackable Offset dual-beam contact minimizes insertion force Expanded pin counts Protective Push-Cap Monoblockable
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TS-1115-05
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Socket 2 mm 5-Row, Right Angle, Solder or Press-Fit Tail, Guide Fingers MP2 Series • End-to-end stackable • Offset dual-beam contact minimizes insertion force • Molded guide fingers provide integrated alignment • Alignment wafer for true position
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TS-1117-05
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TG30
Abstract: TR30 TS-1125-B
Text: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA) in
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TS-1125-B
RIA-2217B-E
TG30
TR30
TS-1125-B
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bi 240
Abstract: SnAgCu NA200 NA200 flux QFP-208 NA-200 paste profile SMD Packages QFP 128 bonding QFP PACKAGE thermal resistance
Text: Quality Evaluation Data for Lead-free SMD Peripheral Packages Sn-Bi plating August 30, 2002 Seiko Epson Corporation Contents 1. Observation of Surface Condition of Sn-Bi Type Lead Plating 2. Soldering Evaluation for Lead Plating 2-1 Solderability test results for stand-alone packages
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NA200)
bi 240
SnAgCu
NA200
NA200 flux
QFP-208
NA-200
paste profile
SMD Packages
QFP 128 bonding
QFP PACKAGE thermal resistance
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Untitled
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder Tail MP2 Series • Three levels of early mate, late break EMLB sequencing or selective loading options • Footprint compatible with standard Futurebus+ • Solder tail with true-position wafer
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TS-1122-03
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TS-1125-B
Abstract: No abstract text available
Text: 3M MetPak™ 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail • • • • • MP2 Series 6.50 Amps per contact End-to-end stackable Press or heat stake peg solder tail Futurebus+ compatible See the Regulatory Information Appendix (RIA) in
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TS-1125-B
RIA-2217B-E
517-MP2-SP08-41M1TR
MP2-SP08-41M1-TR
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