Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! E4WC Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! E3WC Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! ES51F5 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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ES51F5
Sensiti50
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EB71F72 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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EB71F72
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! ES52F3 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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ES52F3
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EB52F5 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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EB52F5
Sensiti50
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PDF
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EB51F3 Series Recommended Solder Reflow Methods Low Temperature Solder Bath Wave Solder High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Solder Bath (Wave Solder)
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EB51F3
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EU Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page
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HC-49/U
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Untitled
Abstract: No abstract text available
Text: Return to Specification Page Search! EP11 Series Recommended Solder Reflow Methods High Temperature Solder Bath Wave Solder Low Temperature Solder Bath (Wave Solder) Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering
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Soldering Conditions
Abstract: soldering
Text: Recommended soldering conditions of EOREX Pb-Free products 1 Surface Mount Type SMD IR reflow with a peak temperature of 260°C Wave soldering with molten solder in a 260°C soldering bath Partial lead heating via a 350°C solder iron tip 2 Through Hole Type (THD) Wave soldering with molten solder in a 260°C soldering bath
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EN29453
Abstract: 680102 68010 183C
Text: SOLDERING WAVE / FLOW SOLID SOLDER BARS EXTRUDED SOLDER Solid bars of high purity extruded solder, each polythene protected, with a choice of tin/lead alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars. ◆ High purity extruded solder made from virgin
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45A50ns.
45A501A
45A102C
EN29453,
45B501A
45B102C
EN29453
680102
68010
183C
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EN29453
Abstract: bar led 68011 EN294
Text: SOLDERING SOLID SOLDER BARS WAVE / FLOW LEAD-FREE EXTRUDED SOLDER Solid bars of high purity lead-free extruded solder alloy, each polythene protected, with a choice of alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars.
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45E501A
45E102C
PG/0526
EN29453
bar led
68011
EN294
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Untitled
Abstract: No abstract text available
Text: Assembly Hardware ELECTRONIC ASSEMBLY HARDWARE Printed Circuit Board Hole Plugs Prevents solder from reaching top of PCBs. Simple press-in use without tools, easy to remove by hand. Withstands wave, dip or hand soldering temperatures; will not contaminate solder.
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Untitled
Abstract: No abstract text available
Text: pcb assembly aids Printed Circuit Board Hole Plugs • • • • • Prevents solder from reaching top of PCBs Simple press-in use without tools, easy to remove by hand Withstands wave, dip or hand soldering temperatures; will not contaminate solder Low in cost, re-usable, available from stock
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Untitled
Abstract: No abstract text available
Text: Tantalum Capacitor SCS Series The product is smaller version of the SCN series products. The SCS series have fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave ), conductive adhesive or thermal compression bonding techniques.
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535BAAC
RCR-2368,
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Untitled
Abstract: No abstract text available
Text: Tantalum Capacitor SVS Series The product is smaller version of the SVN series products. The SVS series have fully molded, compliant leadframe construction designed for use in applications utilizing solder (Reflow, Wave ), conductive adhesive or thermal compression bonding techniques.
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535BAAC
RCR-2368,
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EIA-RS-198
Abstract: No abstract text available
Text: Surface Mounting Guide MLC Chip Capacitors Component Pad Design Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave
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MIL-STD202
EIA-RS-198.
EIA-RS-198
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Untitled
Abstract: No abstract text available
Text: Surface Mounting Guide Chip Thermistor – Application Notes STORAGE Wave Good solderability is maintained for at least twelve months, provided the components are stored in their “as received” packaging at less than 40°C and 70% RH. 300 Preheat Solder Temp.
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60-90s
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CRA06P
Abstract: No abstract text available
Text: CRA06P Vishay Dale Thick Film Resistor Array FEATURES • Concave terminal array with square corners • 8 terminal package with isolated resistors • Single component reduces board space and component counts • Automatic placement capability • Wave and solder paste reflow compatible
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CRA06P
IS-30A-3
05-Sep-03
CRA06P
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CRA04S
Abstract: No abstract text available
Text: CRA04S Vishay Dale Thick Film, Resistor Array FEATURES • Convex terminal array with square corners • 4 or 8 terminal package with isolated resistors • Single component reduces board space and component counts • Automatic placement capability • Wave and solder paste reflow compatible
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CRA04S
03-Sep-03
CRA04S
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SO14W
Abstract: siemens rotating diode assembly SO24W MELF 0207 PLCC20 SO16W SO20W SO28W VSO40 VSO56
Text: Data Pack H Issued November 2005 1502325569 An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering
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220 Tantalum Capacitor 10v B4
Abstract: No abstract text available
Text: TAZ Series Including CWR09 and COTS-Plus The TAZ part has fully molded, compliant leadframe construction designed for use in applications utilizing solder Reflow, Wave or Vapor Phase , conductive adhesive or thermal compression bonding techniques. Each chip is marked with polarity, capacitance code and rated voltage.
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CWR09
220 Tantalum Capacitor 10v B4
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reflow profile 00802
Abstract: sod323 reflow sod323 wave soldering
Text: SIEM EN S Notes on Processing Table 1 Solderability Test to Siemens Standard Test criterion Solder bath temperature °C Dwell time in bath s Components for wave and reflow soldering Wetting 215 ± 3 3 ±0.3 Dewetting and leaching 260 ± 5 30 ±1 Components for reflow soldering only
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OCR Scan
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OT-89
OT-143
HLG05515
OT-223
reflow profile 00802
sod323 reflow
sod323 wave soldering
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PDF
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Untitled
Abstract: No abstract text available
Text: SlUllllliFiitEmffillflSi General Thick Film Chip Fixed Resistor • • Features m / K m &m Miniature and light weight Suit for reflow and wave flow solder Stable electrical capability,high r e lia b ility Low assembly cost,suit for automatic SMT equipment
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OCR Scan
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-30X3,
4BMJK30%
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