Untitled
Abstract: No abstract text available
Text: CHEMTRONICS TDS #CW 8300 Technical Data Sheet CircuitWorks Water Soluble Flux Pen PRODUCT DESCRIPTION CircuitWorks Water Soluble Flux Pen is designed specifically to apply water soluble flux with precision control. The Water Soluble Flux consists of a neutral pH organic
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SN100C
Abstract: Water soluble
Text: WS482 Water Soluble Cored Wire Solder Features: - Halide-Free - High Activity Level - Good Thermal Transfer - Good Wetting Properties - For Standard and High-Temperature Applications - Extended Cleaning Times, Safe Up to 2 to 3 Days Description: WS482 is a water soluble, halide-free flux cored wire that is highly active and compatible with water soluble solder paste
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WS482
WS482
ISO9001
45-micron
SN100C
Water soluble
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solder paste 63sn alpha metal
Abstract: failure of heating element in hot air gun making hot air gun 63SN 37PB SOLDER reworking guidelines
Text: Document 362-1 Soldering Surface Mount Components Types of Solder Concerns regarding the use of water-soluble flux Water soluble fluxes can leave weak organic acid WOA residues that must be thoroughly removed from all pc board components. All fine wire components, like many
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2331-ZX
Abstract: Sn62Pb36Ag02 sn63pb37 solder wire Kester LIQUID FLUX IPC-TM650 sn63pb37 solder wire shelf life ZX 650
Text: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than
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2331-ZX
2331-ZX.
J-STD-004,
IPC-TM-650,
04Jun07
Sn62Pb36Ag02
sn63pb37 solder wire
Kester LIQUID FLUX
IPC-TM650
sn63pb37 solder wire shelf life
ZX 650
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2331-ZX
Abstract: IPC-TM-650 Sn62Pb36Ag02 IPC-TM650 Kester LIQUID FLUX
Text: 331 Organic Cored W ire For Lead-bearing and Lead-free alloys Product Description Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than
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2331-ZX
2331-ZX.
J-STD-004,
IPC-TM-650,
12Jul06
IPC-TM-650
Sn62Pb36Ag02
IPC-TM650
Kester LIQUID FLUX
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Untitled
Abstract: No abstract text available
Text: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning
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Murata ultrasonic
Abstract: No abstract text available
Text: !Notice other 1. Cleaning Conditions: The total cleaning time of soaking, ultrasonic and steam methods should be within 5 minutes. Consult with Murata concerning the cleaning solvent. In order to totally abolish ODC (Freon, Trichrolethan), Murata has carried out testing on non-cleaning and water cleaning (watersoluble flux, water-soluble cream solder, water-based cleaning
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IEC-695
Abstract: TM9916 2741G2 2741H2 2745AF2 2745CA2 T130 T131 2745CA
Text: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformers TM9916 • Designed for DS1, DS1C, and CEPT applications • Compatible with water-soluble flux, total-immersion cleaning and machine insertion • Electrostatic shield provides improved longitudinal
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TM9916
TR-TSY-000357-1
IEC-695,
2741H2
IEC-695
TM9916
2741G2
2741H2
2745AF2
2745CA2
T130
T131
2745CA
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multicore solder wire
Abstract: henkel solder Loctite multicore multicore solder J-STD-006 Water soluble flux Loctite multicore solder wire
Text: Technical Data Sheet Multicore Hydro-X September 2007 HIGH ACTIVITY WATER SOLUBLE CORED SOLDER WIRE Properties of Multicore Hydro-X solid flux cored solder wires: x Rapid soldering of most difficult to solder parts x Fast wetting x Water washable, no need for added neutralisers
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J-STD-006
multicore solder wire
henkel solder
Loctite multicore
multicore solder
Water soluble flux
Loctite multicore solder wire
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SN63PB37
Abstract: No abstract text available
Text: 2009 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 EnviroMark™ 828 Application No-Clean Stencil Printing Water-Soluble Stencil Printing Alloys Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Product
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EM907
EM828
SN63PB37
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2664AM
Abstract: No abstract text available
Text: HIGH FREQUENCY MAGNETICS T1/E1 Single THT Shielded Hardened Transformer TM00122 • Designed for T1 carrier applications at 1.544 Mbps • Compatible with water-soluble flux, total-immersion cleaning, and machine insertion • Typical application is to isolate telecom equipment
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TM00122
IEC-695,
TR-TSY-000357-1
140mA
280mA
T1-50
2664AM
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IEC-695
Abstract: t127
Text: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformer TM9914 • Designed for T1 carrier applications at 1.544 Mbps • Compatible with water-soluble flux, total-immersion cleaning, and machine insertion • Typical application is to isolate telecom equipment
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TM9914
140mA
280mA
IEC-695,
TR-TSY-000357-1
IEC-695
t127
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2741G2
Abstract: 2741H2 2745AF2 2745AJ2 2745AK2 2745CA2 2745G3 T7288 CEPT
Text: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Transformers • • Operate as pulse transformers at DS1 and CEPT rates • Perform impedance matching and voltage transformation • for line transceivers • TM9913 Compatible with water-soluble flux, total-immersion
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TM9913
IEC-695,
TR-TSY-000357-1
2745AJ2
2745CA2
2741G2
2741H2
2745AF2
2745AJ2
2745AK2
2745CA2
2745G3
T7288
CEPT
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Multicore Solders
Abstract: No abstract text available
Text: TEMPORARY SOLDER RESISTS SPOT-ON, COPPER SPOT-ON & AQUA SPOT-ON Multicore Temporary Solder Resists are designed to be used on printed circuit boards prior to soldering and will withstand fluxing and wave soldering operations. l Peelable and water soluble versions available
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Untitled
Abstract: No abstract text available
Text: HIGH FREQUENCY MAGNETICS T1/E1 Single Surface Mount Shielded Tranformers • Operate at the DS1 and CEPT rates of 1.544 and 2.048 Mbps • Shielded transformers reduce EMI • Meets IEC-695, 2-2 flammability requirements TM9920 • Compatible with water-soluble flux, total-immersion
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TM9920
TR-TSY-00357-1
IEC-695,
2771D
2795B
2771E
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T129
Abstract: IEC-695 2745AK2 2745G3
Text: HIGH FREQUENCY MAGNETICS T1/E1 Single Through Hole Shielded Transformer • Designed to operate at the DS1 rate of 1.544 Mbps • Shielded transformer reduces EMI • Qualified per Bellcore TR-TSY-000357-1 TM9915 • Compatible with water-soluble flux and total-immersion
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TM9915
TR-TSY-000357-1
IEC-695,
2745AK2
2745G3
T129
IEC-695
2745AK2
2745G3
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Untitled
Abstract: No abstract text available
Text: Push Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.
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Alps Tact Switch
Abstract: Small Slide Switch alps
Text: Rotary Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.
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alps encoder
Abstract: Alps Tact Switch alps rotary switch alps switch alps encoder 12 TACT Switch
Text: Dual In-line Package Type Switches Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.
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Alps Tact Switch
Abstract: No abstract text available
Text: Switch Type Multi Control Devices Cautions 1. Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation. 2. Avoid use of water-soluble soldering flux, since it may corrode the switches. 3. Check and conform to soldering requirements under actual mass production conditions.
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GR-78-CORE
Abstract: ROSIN FLUX TYPE ROL0 sn63pb37 Sn62Pb36Ag2 J-STD-006A RF771 bellcore GR-78 sn63pb37 solder wire 959T TC-527
Text: 2010 RECOMMENDED Electronics Assembly Materials Page 4 Kester Lead-Free Lead-Free Solder Pastes Formula EnviroMark 907 Application EnviroMark™ 828 No-Clean Stencil Printing Water-Soluble Stencil Printing Sn96.5Ag3.0Cu0.5 Sn96.5Ag3.0Cu0.5 Designed to exceed customers' expectations for high yield lead-free manufacturing. EM907 is engineered for the high thermal demands of assembling with
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65-0n-Tien
GR-78-CORE
ROSIN FLUX TYPE ROL0
sn63pb37
Sn62Pb36Ag2
J-STD-006A
RF771
bellcore GR-78
sn63pb37 solder wire
959T
TC-527
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bga socket
Abstract: A814
Text: GHZ BGA Socket and SMT adaptor Page 1 of 2 Assembly Instructions 1. Apply water soluble or no clean flux on the target PCB lands. 2. Apply a small amount of TAC flux on opposite corners of the PCB lands. 3. Note the target board land pattern orientation and the adaptor's orientation mark. Place SMT adaptor solder ball side down onto
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Untitled
Abstract: No abstract text available
Text: FASTECH SYSTEMS THROUGH-HOLE, THREE-ROW, PIN & SOCKET CONNECTORS 963M FEATURES • Right-angle interconnection • 24 pinouts per board-inch • Through the board tail • Approved for water-soluble-flux/totalimmersion-cleaning (WSF/TIC) • Available with 75 cavities completely
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963M-75
963M-161-150
963M-161-157
963M-161-150*
963M-161-157*
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Untitled
Abstract: No abstract text available
Text: FASTECH SYSTEMS THROUGH-HOLE, TWO-ROW, PIN & SOCKET CONNECTOR 963G *• FEATURES • Right-angle interconnections • 16 pinouts per board-inch • Through the board tail • Attached to the PCB by heat staking • Wave-soldered terminals • Approved for water-soluble-flux/totalimmersion-cleaning (WSF/TIC)
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50-cavity
82-cavity
114-cavity
on-104-100AAÂ
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