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    WAFER MAP Search Results

    WAFER MAP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10114828-10108LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 8 Positions Visit Amphenol Communications Solutions
    10114829-11109LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 9 Positions Visit Amphenol Communications Solutions
    10114829-11111LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 11 Positions Visit Amphenol Communications Solutions
    10114829-11113LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions Visit Amphenol Communications Solutions
    10114829-10107LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer, Vertical, Through Hole, 7 Positions Visit Amphenol Communications Solutions
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    Microchip Technology Inc FPGA-WAFER_MAP

    WAFER MAP, Projected EOL: 2049-02-04
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    Microchip Technology Inc FPGA-WAFER_MAP 28 Weeks
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    Generic Manufacturer ELECTRONIC WAFER MAPPING

    ELECTRONIC WAFER MAPPING
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    ES Components ELECTRONIC WAFER MAPPING 1
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    WAFER MAP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    2x14

    Abstract: No abstract text available
    Text: Wafer and Die Infosheet Memory Products Features • Async SRAMs, Dual-Ports, FIFOs, MicroPower SRAMs, PROMs, and Sync SRAMs wafer and die • Wafer — Standard Wafer 25–30 mil thick — Background Wafer to 14 mil thick — Background Wafer to 11 mil thick


    Original     		PDF

    CYXXXX

    Abstract: No abstract text available
    Text: Wafer and Die Infosheet Memory Products Features • Async SRAMs, Dual-Ports, FIFOs, MicroPower SRAMs, PROMs, and Sync SRAMs wafer and die • Wafer — Standard Wafer 25–30 mil thick — Background Wafer to 14 mil thick — Background Wafer to 11 mil thick


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 1 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Wafer and Die Information Sheet Memory and Wireless / RF Products Features Level 2 • Async SRAMs, dual ports, FIFOs, micropower SRAMs, PROMs, sync SRAMs wafer and die, WirelessUSB LP wafer ■ Wafer ❐ Standard wafer 25 to 30 mil thick ❐ Background wafer to 14 mil thick


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: R Silicon Wafer Mapping Sensor F3M-S825-1 Allows Simultaneous Mapping of Up to 25 Silicon Wafers H Economical—one sensor detects most wafer types H 200 mm wafer size H Automatic and remote teaching capability H Self-diagnostic functions reduce downtime Ordering Information


    Original     		F3M-S825-1 35-mm F3M-S825-1 F3M-S825-1, 1-800-55-OMRON D063-E3-825 PDF

    G85-0703

    Abstract: g85 wafer G81-0703 G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2
    Text: TN-00-21: SEMI-Defined Wafer Map Format Introduction Technical Note SEMI -Defined Wafer Map Format Introduction Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International SEMI® . Using a mapping format defined by a worldwide


    Original     		TN-00-21: G81-0703 G85-0703 09005aef81d8ff80/Source: 09005aef81d8ff52 TN0021 g85 wafer G85 wafer format XML G85 TN-00-21 wafer map format G81 wafer format substrate 123456705F2 PDF

    Untitled

    Abstract: No abstract text available
    Text: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability


    Original     		76-mm F3M-S625 F3M-S626 F3M-S825 F3M-S826 F3M-S1213 F3M-S1225 35-roperties 1-800-55-OMRON PDF

    OCI 531

    Abstract: m1b marking s1225 IEC60529 F3M-S1213 F3M-S1225
    Text: R Silicon Wafer Mapping Sensor F3M-S Allows Simultaneous Mapping of up to 25 Silicon Wafers H Economical, one sensor detects most wafer types, including dummy wafers H Models match wafer sizes of 300 mm, 200 mm and 150 mm H Automatic and remote teaching capability


    Original     		76-mm F3M-S625 35-mm F3M-S626 F3M-S825 F3M-S826 F3M-S1213 1-800-55-OMRON OCI 531 m1b marking s1225 IEC60529 F3M-S1213 F3M-S1225 PDF

    E5-1101

    Abstract: wafer prober AN115013 WM-40X0 SECS II wafer map format wafer map format wafer map 3d01
    Text: AN115013 SECS II wafer map format Rev. 1.3 — 1 July 2009 Application note Document information Info Content Keywords wafer mapping, SECS II format, electronic inking Abstract This document gives a short guideline how to interpret wafer maps in SECS II format delivered with wafers by Business Line Identification.


    Original     		AN115013 E5-1101 wafer prober AN115013 WM-40X0 SECS II wafer map format wafer map format wafer map 3d01 PDF

    amkor RDL

    Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
    Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    DS-L10H

    Abstract: DS-L24H DS-L10 AP3822K RELAY SOCKET DIAGRAM CK-100 SH-72 DIODE MSDS CK100 transistor DIAGRAM ck100 transistor npn silicon ck100
    Text: SERIES Wafer Detection Sensor SH-72 DS FD-L41/L42 Glass Sheet / Wafer Sensing PARTICULAR USE SENSORS DS GD Optimum for Wafer Detection Reliable Fixed-focus Sensing A Variety of Objects The sensor can reliably detect wafers irrespective of their glossiness or color.


    Original     		SH-72 FD-L41/L42 CK-100 DS-L24H 2-M30 DS-L10H DS-L24H DS-L10 AP3822K RELAY SOCKET DIAGRAM CK-100 SH-72 DIODE MSDS CK100 transistor DIAGRAM ck100 transistor npn silicon ck100 PDF

    amkor flip

    Abstract: wlcsp inspection amkor RDL amkor Sip dS721
    Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    CSPNL

    Abstract: amkor RDL wafer map format amkor amkor flip amkor Sip amkor polyimide FCCSP wafer map
    Text: data sheet wafer level packaging CSPnl RDL Features: Packaging CSPnl Bump on Redistribution RDL (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression special type Wafer mapping sensor light source pulsed red laser diode


    Original     		30consumption 16N5651 16P5651 PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis sample picture general data type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 PDF

    range of laser sensor

    Abstract: laser sensor accuracy laser temperature sensor
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 range of laser sensor laser sensor accuracy laser temperature sensor PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 PDF

    OHDM

    Abstract: 16P56
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis general data sample picture type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 OHDM 16P56 PDF

    Untitled

    Abstract: No abstract text available
    Text: Photoelectric sensors OHDM 16 Laser, wafer mapping sensor Diffuse sensors with background suppression sample drawing * emitter axis sample picture general data type background suppression version wafer mapping sensor light source pulsed red laser diode sensing distance Tw


    Original     		16N5651 16P5651 PDF

    scfm 50 10 kv

    Abstract: No abstract text available
    Text: APS/SPS200TESLA 200 mm Fully-Automated On-Wafer Probing Solution for High-Power Devices DATA SHEET The APS/SPS200TESLA is the industry’s irst fully-automated on-wafer probing solution focused on production performance for high-power semiconductors. The APS/SPS200TESLA improves productivity and yield at inal test by enabling production wafer


    Original     		APS/SPS200TESLA APS/SPS200TESLA APS/SPS200TESLA-DS-1113 scfm 50 10 kv PDF

    LB-412

    Abstract: ICODE SLI ICS20 SL2ICS20 IBIS wafer map format
    Text: INTEGRATED CIRCUITS ADDENDUM SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification Product Specification Revision 3.0 Public Philips Semiconductors December 2002 Philips Semiconductors Product Specification Rev.3.0 December 2002 Bumped Wafer Specification


    Original     		SCA74 LB-412 ICODE SLI ICS20 SL2ICS20 IBIS wafer map format PDF