TRAY TSOP
Abstract: No abstract text available
Text: Packing NEC Tray JEDEC Tray Name LA-1006B-1 TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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LA-1006B-1
400MIL18
S28G5-50-7JD1-1
TRAY TSOP
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E P detail of lead end 1 14 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S28G5-50-7KD4
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 1 P E F detail of lead end 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7JF5
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PDF
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TSOP 54 tray
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL22 Mounting Pad 54 pin TSOP (II) (400 mil) 54 28 detail of lead end F E 1 P 27 A H J I G C D M L N K M B NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL22
S54G5-80-9JF
TSOP 54 tray
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PDF
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S44G5-80-7KF2
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7KF2
S44G5-80-7KF2
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0038 tsop
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 1 P E F detail of lead end 16 A H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7JD2
0038 tsop
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44PINTSOP
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7JF2
44PINTSOP
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 P F E detail of lead end 1 22 A D M M N L B G K C I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7KF3
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E P detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
00Each
S50G5-80-7KF1
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 E P F detail of lead end 1 22 A H I K G J C D N M B L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL18
S44G5-80-7JF3
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 32 17 F P E detail of lead end 1 16 A D M M C L B G K N I H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S32G5-50-7KD2
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7KF2
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL21
005Each
S50G5-80-7JF1
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL18
S28G5-50-7JD4
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 1 P E F detail of lead end 14 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL18
S28G5-50-7JD5
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 44 pin TSOP (II) (400 mil) 44 23 F E P detail of lead end 1 22 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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Original
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400MIL18
S44G5-80-7KF5
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF2
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 28 pin TSOP (II) (400 mil) 28 15 E 3°±3° F detail of lead end 1 14 A H I K G J N C D B L M M S28G5-50-7JD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL18
S28G5-50-7JD-2
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 E 5°±5° F detail of lead end 1 16 A H J K G I N C D M B L M S32G5-50-7JD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7JD1-1
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AD14
Abstract: TRAY TSOP S28G5-50-7KD2
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 15 28 3°±3° F E detail of lead end 1 A D 14 M M C L B G K N I H J S28G5-50-7KD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL18
S28G5-50-7KD-2
AD14
TRAY TSOP
S28G5-50-7KD2
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PDF
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TSOP 54 tray
Abstract: tsop 0038
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 32 pin TSOP (II) (400 mil) 17 32 F E 5°±5° detail of lead end 1 16 A D M M C L B G K N I J H S32G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL21
S32G5-50-7KD1-1
TSOP 54 tray
tsop 0038
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 F E 3°±3° detail of lead end 1 14 A D M M C B L G K N I J H S28G5-50-7KD1-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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400MIL18
S28G5-50-7KD1-1
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S28G5-50-7JD2-1
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL18 Mounting Pad 28 pin TSOP (II) (400 mil) 28 15 E 5°±5° F detail of lead end 1 14 A H I K G J N B C D M L M S28G5-50-7JD2-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at
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Original
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400MIL18
S28G5-50-7JD2-1
S28G5-50-7JD2-1
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PDF
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tsop 0038
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL18 44 pin TSOP (II) (400 mil) 44 23 F E 3°±3° detail of lead end 1 22 A D M M C N L G K B I J H S44G5-80-7KF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at
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Original
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400MIL18
S44G5-80-7KF-1
tsop 0038
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PDF
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