TSOP PACKAGE DIMENSIONS Search Results

Contextual Info: c Mounting pad of TSOP (type I) The nominal dimensions of the TSOP (thin small outline package) (type I) are determined by the combination of the width of the plastic body (E) and the total length (HD). For example, “32-pin 8 x 20 TSOP (type I)” means that the package width is 8 mm, and that the total

cel-9200

Abstract: Cypress 140C 8361H CEL9200 JESD22 128H copper bond wire
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97175 VERSION 1.0 June, 1997 28 Ld TSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97175, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

Contextual Info: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

140C

Abstract: 8361H CEL9200 JESD22 copper bond wire
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97173 VERSION 2.0 February, 1998 28 Ld TSOP Package 150 x 150 Pad Size Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97173, V. 2.0 Page 2 of 4 February, 1998

EME-7351

Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4

NTGS3455T1

Abstract: NTGS3455T1G
Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available http://onsemi.com Applications V(BR)DSS

NTGS3433T1

Abstract: NTGS3433T1G
Contextual Info: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

NTGS3455T1

Abstract: NTGS3455T1G
Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

Contextual Info: NTGS3443T1 Power MOSFET 4.4 Amps, 20 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available 4.4 AMPERES 20 VOLTS

NTGS4111P

Contextual Info: NTGS4111P Power MOSFET −30 V, −4.7 A, Single P−Channel, TSOP−6 Features • • • • • Leading −30 V Trench Process for Low R DS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space Pb−Free Package Available (G Suffix)

2fu smd transistor

Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
Contextual Info: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR

T-944

Contextual Info: TAPE & REEL SPECIFICATIONS 32-pin TSOP Package Carrier Tape Critical Dimensions 2.0±0.1 Ø1.55±0.05 0.3±0.05 4.0±0.1 Y E F Ø1.6 ±0.1 W B2 B0 R 0.3 Typical Y K1 K0 P1 K B1 SECTION Y-Y Lead Count Package 32 TSOP Carrier Tape Dimensions mm W F E B0 B1

Contextual Info: NTGS3455T1 MOSFET −3.5 Amps, −30 Volts P−Channel TSOP−6 Features • • • • http://onsemi.com Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

Contextual Info: NTGS3433T1 MOSFET −3.3 Amps, −12 Volts P−Channel TSOP−6 http://onsemi.com Features • • • • Ultra Low RDS on Higher Efficiency Extending Battery Life Miniature TSOP−6 Surface Mount Package Pb−Free Package is Available V(BR)DSS RDS(on) TYP

m14 transistor

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14) * : Resin protrusion. (Each side : 0.15 (.006) Max) 28-pin plastic TSOP (II)

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)

400MIL

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)

A37 diode

Contextual Info: NTGS4111P, NVGS4111P Power MOSFET −30 V, −4.7 A, Single P−Channel, TSOP−6 Features • • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space

BGA and QFP Package mounting

Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Contextual Info: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,

Contextual Info: NVGS4111P Product Preview Power MOSFET −30 V, −6.2 A, Single P−Channel, TSOP−6 Features • • • • • • Leading −30 V Trench Process for Low RDS on Low Profile Package Suitable for Portable Applications Surface Mount TSOP−6 Package Saves Board Space

TSOP 54 Package

Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)

TSOP 44 Package

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)