TSOP 28 PACKAGE Search Results

Contextual Info: PA28TSOP3 Data Sheet 28 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA28TSOP3 adapter converts the pinout of a 28 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. Several Flash EEPROM memories

Contextual Info: PA32-28-3TS Data Sheet 32 pin TSOP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32-28-3TS adapter converts the pinout of a 32 pin TSOP device to its 28 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket. The AMD 27C256, and others

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M16 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M16) 28-pin plastic TSOP (II) (FPT-28P-M16) 28 * : Resin protrusion.(Each side 0.15 (.006) Max)

m14 transistor

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M14 28-pin plastic TSOP II Lead pitch 50mil Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-28P-M14) * : Resin protrusion. (Each side : 0.15 (.006) Max) 28-pin plastic TSOP (II)

ZA104

Abstract: zu107 p028
Contextual Info: SONY CXK58257CTM/CYM/CM/CP -70LLX 32768-word x 8-bit High Speed CMOS Static RAM Description CXK58257CTM CXK58257CYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) CXK58257CM CXK58257CP 28 pin SOP (Plastic) 28 pin DIP (Plastic) The CXK58257CTM/CYM/CM/CP is 262,144 bits

FPT-28P-M03

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M03 Lead pitch 0.55mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Normal bend 28-pin plastic TSOP I (FPT-28P-M03) 28-pin plastic TSOP (I) (FPT-28P-M03) 22 21 Details of "A" part

BGA and QFP Package mounting

Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
Contextual Info: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC FPT-28P-M04 Lead pitch 0.55mm Lead shape Gullwing Sealing method Plastic mold Lead bend direction Reverse bend 28-pin plastic TSOP I (FPT-28P-M04) 28-pin plastic TSOP (I) (FPT-28P-M04) 22 21 Details of "A" part

EME-7351

Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4

2420

Abstract: TSOP 48 thermal resistance 140C JESD22
Contextual Info: Qualification Report October 1996, QTP #95072/95516, Version 2.1 Thin Small Outline Package 28 Lead TSOP Type 1 CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 28 Lead TSOP Alloy 42 Hyundai, Korea

Contextual Info: M O SEL VITELIC PRELIM INARY V62C318256 2 .7 VOL T 3 2 K X 8 STA TIC RAM Features • Packages - 28-pin TSOP Standard - 28-pin TSOP (Reverse) - 28-pin 600 mil PDIP - 28-pin 300 mil SOP (450 mil pin-to-pin) ■ High-speed: 35, 45, 55, 70 ns ■ Ultra low DC operating current of 3mA (max.)

Contextual Info: HN58V256A Series, HN58V257A Series Ordering Information Type No. Access time Package HN58V256AFP-12 120 ns 400 mil 28-pin plastic SOP FP-28D HN58V256AT-12 120 ns 28-pin plastic TSOP (TFP-28DB) HN58V257AT-12 120 ns 8 x 14 mm2 32-pin plastic TSOP (TFP-32DA)

051C

Contextual Info: ISSI PACKAGING INFORMATION Plastic TSOP - 24/28-pins Package Code: T Type II N N/2+1 E 1 N/2 D SEATING PLANE H A e B L A1 α C Plastic TSOP (T—Type II) Millimeters Inches Min Max Min Max Symbol Ref. Std. No. Leads 24/28 A 1.00 1.20 A1 0.05 0.20 B 0.36

cel-9200

Abstract: Cypress 140C 8361H CEL9200 JESD22 128H copper bond wire
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97175 VERSION 1.0 June, 1997 28 Ld TSOP Package Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97175, V. 1.0 Page 2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

Contextual Info: ISSI PACKAGING INFORMATION Plastic TSOP - 28-pins Package Code: V Type I 1 E H N D SEATING PLANE A B e Symbol Ref. Std. No. Leads A A1 B C D E H e L α PRELIMINARY PK001-1A α C Plastic TSOP (V—Type I) Millimeters Inches Min Max Min Max 28 1.00 1.20 0.05 0.20

140C

Abstract: 8361H CEL9200 JESD22 copper bond wire
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97173 VERSION 2.0 February, 1998 28 Ld TSOP Package 150 x 150 Pad Size Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: TSOP QTP# 97173, V. 2.0 Page 2 of 4 February, 1998

EME-7351

Abstract: Ablestik 8361 140C JESD22 JESD22-A112
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97098 VERSION 1.0 April, 1997 28 Ld Thin Small Outline Package TSOP Anam, Philippines Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP QTP# 97098, V. 1.0 Page 2 of 4 April, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION

TSOP 86 Package

Abstract: MBH32A MBS28A MDA44 MDB44
Contextual Info: Thin Small Outline Package TSOP 28 Lead Molded Thin Small Outline Package NS Package Number MBS28A 1999 National Semiconductor Corporation MS101177 www.national.com Thin Small Outline Package (TSOP) May 1999 32 Lead Molded Thin Small Outline Package, EIAJ, Type I

cxk58257btm

Contextual Info: SONY CXK58257BTM/BYM -7 0 L L X /1 0 L L X 32768-word x 8-bit High Speed CMOS Static RAM Description CXK582S7BTM The CXK58257BTM/BYM is 262.144 bits high CXK58257BYM 28 pin TSOP Plastic 28 pin TSOP (Plastic) speed CMOS static RAM organized as 32,768 words by 8 bits.

Contextual Info: SONY CXK58257BTM/BYM - 7 0 L L X /1 0 L L X 32768-word x 8-bit High Speed CMOS Static RAM Description The CXK58257BTM/BYM is 262.144 bits high speed C M O S static RAM organized as 3 2,768 CXK58257BTM CXK58257BYM 28 pin TSOP Plastic 28 pin TSOP (Plastic)

TSOP package tray

Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
Contextual Info: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)

Contextual Info: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ

TSOP package tray

Abstract: TRAY DIMENSIONS TSOP 62 Package TSOP TRAY tray tsop 1220 JEDEC tray standard tsop
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF 7 12.20 18.80 A' 20.42 14.56 285.88 315.0 322.6 SECTION A-A' 18.80 5.62 (6.35) 15.00 7.62 135.9 PPE NEC 135°C MAX 13.67 13.27 TSOP(2)400MIL18 109.36 9x15=135 A Applied Package Quantity (pcs) 28-pin Plastic TSOP (II)

JEDEC tray standard tsop

Abstract: TSOP 28 Package TSOP package tray JEDEC TRAY DIMENSIONS
Contextual Info: UNIT : mm HEAT PROOF 7 109.36 PPE NEC 135°C MAX 13.67 13.27 TSOP 2 400MIL18 18.8 A' 20.42 14.56 285.88 315.0 (322.6) SECTION A-A' 18.8 5.62 (6.35) 15.0 7.62 135.9 9x15=135 12.2 A Applied Package Quantity (pcs) 28-pin Plastic TSOP(II)(400mil) MAX. 135 Material