10190N
Abstract: tsmc Activation Energy
Text: Cypress Semiconductor Technology Qualification Report QTP# 99285 VERSION 1.3 July, 2000 L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor L28-TSMC Technology in TSMC-2A
|
Original
|
L28-TSMC
CY2280
CY2280PVC
100-MHz
CY2280-OC
85C/85
10190N
tsmc Activation Energy
|
PDF
|
XPC823ZT66B2T
Abstract: XPC823ZT81B2T XPC823 XPC823ZT75B2T motorola tsmc XPC823ZT66B2 KXPC823ZT81B2T MPC823 MOS11 xpc823zt66
Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for
|
Original
|
MPC823
XPC823
MOS11
W90913
W90904
W90912
XPC823ZT66B2T
XPC823ZT81B2T
XPC823ZT75B2T
motorola tsmc
XPC823ZT66B2
KXPC823ZT81B2T
xpc823zt66
|
PDF
|
XPC823ZT66B2T
Abstract: XPC823 XPC823ZT75B2T XPC823ZT81B2T KXPC823ZT81B2T MPC823 W90913 XPC823ZT
Text: M Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC823 XC Qualification in TSMC/WaferTech Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for
|
Original
|
MPC823
XPC823
MOS11
W90913
W90904
W90912
XPC823ZT66B2T
XPC823ZT75B2T
XPC823ZT81B2T
KXPC823ZT81B2T
W90913
XPC823ZT
|
PDF
|
MIL-STD-883 Method 3015.7
Abstract: tsmc design rule L28-TSMC tsmc Activation Energy tsmc cmos tsmc Ea CY2037-2WAF CY2037AWAF CY5037
Text: Cypress Semiconductor Fab Transfer Qualification Report QTP# 001103 VERSION 2.0 July, 2000 CY2037A Wafer L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor
|
Original
|
CY2037A
L28-TSMC
CY5037AWAF/CY2037-2WAF
CY2037AWAF/CY2037-2WAF,
CY2037AWAF
CY2037-2WAF
CY2280-OC
85C/85
MIL-STD-883 Method 3015.7
tsmc design rule
tsmc Activation Energy
tsmc cmos
tsmc Ea
CY2037-2WAF
CY5037
|
PDF
|
L28-TSMC
Abstract: tsmc cmos 7C80380A tsmc Activation Energy tsmc Ea tsmc design rule TSMC-2A
Text: Cypress Semiconductor Technology Qualification Report QTP# 000402VERSION 1.1 July, 2000 CY5037A Wafer L28-TSMC Technology in TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7069 Cypress Semiconductor
|
Original
|
000402VERSION
CY5037A
L28-TSMC
CY5037A
CY5037A,
CY5037AWAF
CY2280-OC
85C/85
tsmc cmos
7C80380A
tsmc Activation Energy
tsmc Ea
tsmc design rule
TSMC-2A
|
PDF
|
3248L
Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 6/8/05 QUALITY ENG : PART NUMBER MICREL KS8001L/KSZ8001L KS8001LD/KSZ8001LD PROJECT # PACKAGE TYPE : ASSEMBLY LOC LOT # FAB LOC D/C # PROCESS KS8001S 48L SSOP OSE GD64047MEA TSMC 0437A 0.18 um KS8001LD 48L QFP ASE GD64047MEK TSMC 0503A
|
Original
|
KS8001L/KSZ8001L
KS8001LD/KSZ8001LD
KS8001S
GD64047MEA
KS8001LD
GD64047MEK
10BASE-T/100BASE-TX/FX
KS8001L
KS8001S
KSZ8001L
3248L
|
PDF
|
Untitled
Abstract: No abstract text available
Text: QUALIFICATION REPORT Date: 11/4/13 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ9031XXXX Product Family PACKAGE TYPE : LOT # ASSEMBLY LOC FAB LOC PROCESS KSZ9031GQ 128L QFP Q2A38072 TICP TSMC 0.065 um KSZ9031RNX 48L QFN MLF GPKH888.00MEA TICP TSMC 0.065 um
|
Original
|
KSZ9031XXXX
KSZ9031GQ
Q2A38072
KSZ9031RNX
GPKH888
00MEA
KSZ9031MNX
GP6H923
00MEF
065um:
|
PDF
|
XPC850SRZT50BT
Abstract: XPC850ZT50BT XPC850DEZT50BT XPC850SRZT80BT XPC850DEZT66BT XPC850SRZT66A SPB25 SC5302 MPC850 XPC850SRCZT50B
Text: Semiconductor Products Sector Networking and Computing Systems Group Networking and Communications System Division PCN: MPC850 XC Qualification in TSMC/WaferTech EFFECTIVE DATE: 30-SEPT-00 Motorola is pleased to announce an additional wafer fabrication facility, TSMC/WaferTech, for
|
Original
|
MPC850
30-SEPT-00
MOS11
C850ZT66A,
PPC850SRZT50A,
SC530206ZT50B,
XPC850CZT50A,
XPC850SRZT50BT
XPC850ZT50BT
XPC850DEZT50BT
XPC850SRZT80BT
XPC850DEZT66BT
XPC850SRZT66A
SPB25
SC5302
XPC850SRCZT50B
|
PDF
|
JESD22
Abstract: No abstract text available
Text: RELIABILITY REPORT Date: 7/27/11 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8842PMBL AM QUAL VEHICLES PACKAGE TYPE : ASSEMBLY FAB PROCESS KSZ8842PMBL AM 100 LFBGA OSE TSMC 0.15 um KSZ8842PMQL AM 128L PQFP ASE TSMC 0.15 um AEC Q100 GROUP A QUALIFICATION RESULTS:
|
Original
|
KSZ8842PMBL
KSZ8842PMQL
JESD22
121C/100%
-50C/
KSZ8842PMBL
GFS0028
JESD22
|
PDF
|
130nm CMOS
Abstract: tsmc cmos model tsmc cmos silicon footprint ESD
Text: Data sheet IO ESD protection Low capacitive IO protection for TSMC 130nm CMOS technology Sofics has verified its TakeCharge ESD protection clamps on TSMC 130nm CMOS technology. The devices are product proven in several hundreds mass produced 130nm products. The cells provide competitive advantage
|
Original
|
130nm
130nm
B-9880
130nm CMOS
tsmc cmos model
tsmc cmos
silicon footprint ESD
|
PDF
|
Untitled
Abstract: No abstract text available
Text: RELIABILITY REPORT Date: 10/17/08 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8841/42 PMQL Qual vehicles KSZ8841/42PMQL PACKAGE TYPE : ASSEMBLY FAB LOC 128L QFP ASE/TICP TSMC ESD RATINGS FIT RATE ESD-HBM: +/- 1500V TSMC 0.15 um process: 6.6 FIT PROCESS 0.15 um
|
Original
|
KSZ8841/42
KSZ8841/42PMQL
KSZ8841
KSZ8842
KSZ8841/42
JESD22-A108
1000HRS
2000HRS
GFS7975
GFS0028
|
PDF
|
Untitled
Abstract: No abstract text available
Text: RELIABILITY REPORT Date:7/24/08 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ8893MQL/FQL Qual vehicles PACKAGE TYPE : ASSEMBLY 128L QFP OSE KSZ8893MQL FAB LOC PROCESS TSMC 0.15 um ESD RATINGS LATCH-UP RATING FIT +/- 1000V HBM I/O Trigger @ 200 mA TSMC 0.15 um : 6.6 FIT
|
Original
|
KSZ8893MQL/FQL
KSZ8893MQL
KSZ8893MQL)
KSZ8893FQL)
168HRS
1000HRS
KSZ8893
GFS7975
GFP2177
|
PDF
|
Untitled
Abstract: No abstract text available
Text: QUALIFICATION REPORT Date: 5/31/11 QUALITY ENG : PART NUMBER MICREL QA/REL KSZ9021RL/GQ/GN/RN PACKAGE TYPE : LOT # ASSEMBLY LOC FAB LOC PROCESS KSZ9021RL 64L QFP GF63838.1 MEB TICP TSMC 0.15 um KSZ9021GQ 128L QFP GF63838.1 MEA TICP TSMC 0.15 um KSZ9021RN 48L MLF
|
Original
|
KSZ9021RL/GQ/GN/RN
KSZ9021RL
GF63838
KSZ9021GQ
KSZ9021RN
GF0S174
KSZ9021GN
GF0S283
10E08
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TSMC 0.25 micron Process OPERATING LIFE @ Tj = +130-150c at rated Voltage Q302-Q104 Family Device Lot. Pkg Qty Physical Tranciver KS8721B KS8721BL KS8721BL KS8721BL KS8721BL KS8721BL KS8721SL KS8721SL KS8721BT KS8Z8721SL KS8995 KS8995E KS8993/KS8081 D62873
|
Original
|
130-150c
Q302-Q104)
KS8721B
KS8721BL
KS8721SL
|
PDF
|
|
|
tsmc design rule
Abstract: tsmc cmos tsmc Activation Energy tsmc L28-TSMC
Text: Cypress Semiconductor Product Qualification Report QTP# 001205 VERSION 1.2 July, 2000 Low Cost Three-PLL Clock Generator CY2081SC/CY2081SL TSMC-2A, Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7069 Cypress Semiconductor
|
Original
|
CY2081SC/CY2081SL
L28-TSMC
CY2081SC/CY2081SL
CY2280-OC
85C/85
tsmc design rule
tsmc cmos
tsmc Activation Energy
tsmc
|
PDF
|
tsmc cmos 0.13 um
Abstract: "embedded dram" tsmc
Text: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank
|
Original
|
|
PDF
|
16 bit Array multiplier code in VERILOG
Abstract: 8 bit Array multiplier code in VERILOG vhdl code for lvds driver i7 processor history verilog code for 128 bit AES encryption verilog code for aes encryption EP3CLS150 fpga based Numerically Controlled Oscillator freescale m9k E144 package
Text: 1. Cyclone III Device Family Overview July 2012 CIII51001-2.4 CIII51001-2.4 Cyclone III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company TSMC low-power (LP) process technology, silicon optimizations and software
|
Original
|
CIII51001-2
16 bit Array multiplier code in VERILOG
8 bit Array multiplier code in VERILOG
vhdl code for lvds driver
i7 processor history
verilog code for 128 bit AES encryption
verilog code for aes encryption
EP3CLS150
fpga based Numerically Controlled Oscillator
freescale m9k
E144 package
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TSMC 0.18 micron Process OPERATING LIFE @ Tj = + 130-150c at rated Voltage Family Device Lot. Pkg Qty Act Hrs Rej Act Hrs Rej PHYs KS8001LD KS8001S KSZ8001S KSZ8001L GD64047MEL GD64047MEC GD64047MEQ GDP0833.02 QFP-48 SSOP-48 SSOP-48 QFP-48 116 116 77 77 168
|
Original
|
130-150c
KS8001LD
KS8001S
KSZ8001S
KSZ8001L
GD64047MEL
GD64047MEC
GD64047MEQ
GDP0833
QFP-48
|
PDF
|
i7 processor history
Abstract: cyclone III datasheet freescale m9k altera cyclone 3 8 bit Array multiplier code in VERILOG verilog code for 128 bit AES encryption Altera Cyclone III EP3CLS200 E144 EP3C120
Text: 1. Cyclone III Device Family Overview CIII51001-2.2 Cyclone III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company TSMC low-power (LP) process technology, silicon optimizations and software
|
Original
|
CIII51001-2
i7 processor history
cyclone III datasheet
freescale m9k
altera cyclone 3
8 bit Array multiplier code in VERILOG
verilog code for 128 bit AES encryption
Altera Cyclone III
EP3CLS200
E144
EP3C120
|
PDF
|
PCN0304
Abstract: altera date code format TSMC 0.13um process specification altera Date Code Formats EP1S60 EP1C12
Text: Page 1 of 2 PROCESS CHANGE NOTIFICATION PCN0304 300 MM WAFER SCHEDULE Change Description Effective September 2003, Altera will begin manufacturing the Stratix and Cyclone™ product families on 300 mm wafers using 0.13µm process technology at TSMC. The
|
Original
|
PCN0304
EP1S25
PCN0304
altera date code format
TSMC 0.13um process specification
altera Date Code Formats
EP1S60
EP1C12
|
PDF
|
TSMC embedded Flash
Abstract: NT410 tsmc 0.18 flash TSMC Flash cmos tsmc 0.18 TSMC Flash memory 0.18 TSMC Flash IP tsmc cmos NT1208 NT1115
Text: Taiwan Semiconductor Manufacturing Company Ltd. January 27, 2000 Page 1 FOR IMMEDIATE RELEASE CONTACT IN TAIWAN CONTACT IN NEW YORK Derek Tien or Julie Chan Finance Division TSMC invest@tsmc.com.tw 886/3/567-2664 Mami Ogawa Thomson Financial Investor Relations
|
Original
|
|
PDF
|
tsmc cmos 0.13 um
Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
Text: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank
|
Original
|
|
PDF
|
JESD22-A114F
Abstract: JESD47 JESD-47 JEDEC JESD22-B116 free download JESD22-A102C JESD22-A108B JESD22-B116A JESD22-A114-F JESD78B JESD22-A102-C
Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: W-1002-01(R4) DATE: October 4, 2010 Affected Products: Refer to the attached list of products transferring from IDT Fab 4 to TSMC
|
Original
|
JESD22-A115B,
JESD78B
AV265
JESD22-B116-A,
EIA/JESD22-A110B,
EIA/JESD22-A102C,
168hrs
JESD22-A113
JESD22-A114F
JESD47
JESD-47
JEDEC JESD22-B116 free download
JESD22-A102C
JESD22-A108B
JESD22-B116A
JESD22-A114-F
JESD78B
JESD22-A102-C
|
PDF
|
TSMC 0.35Um
Abstract: No abstract text available
Text: RELIABILITY REPORT DATE: 11/16/11 QUALITY ENG : PRODUCT : Micrel Rel/QA MIC3003GFL QUAL VEHICLES PACKAGE TYPE : ASSEMBLY LOC. FAB LOC. PROCESS 24L FC-MLF 3mmx3mm UNISEM TSMC TMSC 0.35 um MIC3003GFL ESD RATINGS LATCH-UP RATING FIT +/- 3000V HBM (Human Body Model)
|
Original
|
MIC3003GFL
MIC3003GML
MIC3003GFL
1000H
GC68500
CV6209
JESD22-103
1000cyc
TSMC 0.35Um
|
PDF
|