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    TRAYS DRAW Search Results

    TRAYS DRAW Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R7F701412EABG Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701428EABG Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701404EAFB Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701442EAFB Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation
    R7F701432EABG Renesas Electronics Corporation High-end Automotive Microcontrollers for Instrument Cluster Supporting Basic or Low-level 2D Drawing Visit Renesas Electronics Corporation

    TRAYS DRAW Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    FMD1

    Abstract: FT1W12DSC Panduit splice tray FST24S FMT1 panduit 389.5mm panduit 4 RU FT1W24ST FT1W12ST
    Text: O PTICOM ® Trays, Drawers and Preloaded Trays SPECIFICATION SHEET specifications Trays, drawers and pre-loaded trays shall be constructed of steel material. Drawers shall have built-in bend radius control clips. Trays and drawers shall have removable top cover


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    PDF FT1W12DSC: FT1W12ST: FT1W24ST: FT124MC: 60mmS WW-RKSP14 FMD1 FT1W12DSC Panduit splice tray FST24S FMT1 panduit 389.5mm panduit 4 RU FT1W24ST FT1W12ST

    DAEWON tray drawing

    Abstract: 124-48LD-119 DAEWON JEDEC TRAY daewon 1EC-08LD-919 Kostat tray daewon tray FBGA tray kostat Kostat TSOP Tray KS8503
    Text: ‹ Chapter 5 Trays CHAPTER 5 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers Tray Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 5-1 ‹ Chapter 5 Trays INTRODUCTION Trays are used instead of tubes to protect


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    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


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    PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    daewon

    Abstract: Trays DAEWON drawing 453-Pin
    Text: u Chapter 7 Trays Ceramic Pin Grid Array: 321-Pin, 453-Pin CGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 65°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging Co.


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    PDF 321-Pin, 453-Pin daewon Trays DAEWON drawing

    daewon

    Abstract: DAEWON drawing
    Text: u Chapter 7 Trays Organic Pin Grid Array: 453-Pin OGF Notes: See next page for detailed views 1 All dimensions are in millimeters. 2 Trays can withstand continuous operation at temperatures up to 60°C. 3 This drawing is for trays manufactured by DaeWon Semiconductor Packaging C


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    PDF 453-Pin daewon DAEWON drawing

    EPX10

    Abstract: corrugated cardboard EPCOS LABEL
    Text: Packing Packing Survey of packing modes Ferrites Type Packing Para. RM cores RM 4 to RM 10 RM 12, RM 14 Blister tapes Standard trays 3.2 2.2.1 170 168 PM cores PM 50/39 to PM 114/93 Standard trays 2.2.1 168 P cores all P cores P 9 x 5 to P 22 × 13 Standard trays


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    L142

    Abstract: M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.2 TRAYS 1 TRAYS M095(MATERIAL : M095-01~06 : PS COMPOUND) M095-14B~ : PP COMPOUND W : 152.6 MITSUBISHI M095-40 ZW eW NW 160P6E-A HEAT PROOF L : 300.0 H ZL eL NL Pocket Pitch(mm)


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    PDF M095-01 M095-14B~ M095-40 160P6E-A M095-01 M095-04 M095-06 M095-13B M095-14B M095-17 L142 M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095

    elastomeric splice

    Abstract: 1435-83
    Text: Instruction Sheet 408-4302 RIBBONMASTER* Splice Tray Assemblies 559308-[ ] and 1435839-[ ] 20 OCT 08 Rev B Cover End Cap Top For Discrete Fiber 4 Included with Retention Trays 1435839-[ ] Only Tab End Cap Top For Ribbon Fiber (4 Included with Trays 559308-[ ] and


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    motorola transistor 5332

    Abstract: AN 5218 C 5388 AEM 1002 R2 atm header error checking CI 6268 CMOS 4002 SARS 03 5252 F 1004 14AF7
    Text: MT90528 28-Port Primary Rate Circuit Emulation AAL1 SAR Data Sheet August 2006 Features • • • • • • • • • Ordering Information MT90528AG 456 PBGA Trays MT90528AG2 456 PBGA* Trays *Pb Free Tin/Silver/Copper -40 to +85°C AAL1 Segmentation and Reassembly device


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    PDF MT90528 28-Port MT90528AG MT90528AG2 af-vtoa-0078 af-vtoa-0089 motorola transistor 5332 AN 5218 C 5388 AEM 1002 R2 atm header error checking CI 6268 CMOS 4002 SARS 03 5252 F 1004 14AF7

    63B4

    Abstract: intel 6264 SARS 03 CI 6268 LS 5208 pinout MO-151 MT9042 MT9044 MT90528 MT90528AG
    Text: MT90528 28-Port Primary Rate Circuit Emulation AAL1 SAR Data Sheet August 2006 Features • • • • • • • • • Ordering Information MT90528AG 456 PBGA Trays MT90528AG2 456 PBGA* Trays *Pb Free Tin/Silver/Copper -40 to +85°C AAL1 Segmentation and Reassembly device


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    PDF MT90528 28-Port MT90528AG MT90528AG2 af-vtoa-0078 af-vtoa-0089 63B4 intel 6264 SARS 03 CI 6268 LS 5208 pinout MO-151 MT9042 MT9044 MT90528 MT90528AG

    Untitled

    Abstract: No abstract text available
    Text: REVISION AB AB DO NOT SCALE FROM THIS PRINT NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. PARTS SHALL BE ROHS COMPLIANT. 3. PARTS TO BE PACKAGED IN TRAYS, TAIL SIDE DOWN. LESS THAN FULL TRAY QUANTITIES ARE TO BE PACKAGED IN COVERED TRAYS TRIMMED TO MATCH QUANTITY ORDERED


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    PDF HDMR-19-01-X-TH-PF-L, HDMR-29-01-X-TH-PF-L, HDMR-19-01-X-TH-PF-L) HDMR-29-01-X-TH-PF-L

    15 pin through hole d sub connector

    Abstract: RCCC-12-14 RCCC 3055 6g flat ribbon cable 2mm Richco efa04 63 dust cap fc st coupler wire ferrule crimp ptfe tape
    Text: DISTRIBUTION BOX/DRAWER-FIBER OFST-1-L Optical Fiber Splice Tray Lid Miniflex technology manufactured by Richco Features • Stackable to any number of trays • Inter-tray fiber routing possible through slots along one of the long sides • Color coded hinges indicates


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    PDF RMS-105 EFB02 EFB02 15 pin through hole d sub connector RCCC-12-14 RCCC 3055 6g flat ribbon cable 2mm Richco efa04 63 dust cap fc st coupler wire ferrule crimp ptfe tape

    Untitled

    Abstract: No abstract text available
    Text: REVISION T DPAF-XX-03.0-X-X-X-XX NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. 2. MINIMUM PUSHOUT FORCE: .75 LBS. 3. PARTS TO BE PACKAGED IN TRAYS. 4. MUST BE CHECKED ON EVERY 6 CONSECUTIVE PINS. 5. SEE RECOMMENDED FOOTPRINT DRAWING FOR STENCIL REQUIREMENTS.


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    PDF DPAF-XX-03 DPAF-23-03 \DWG\MISC\MKTG\DPAF-XX-03

    Untitled

    Abstract: No abstract text available
    Text: Quality Products. Service Excellence. Economy Server Cabinet RB-DC Series Features Constructed in 16-gauge steel. Meets PCI DSS Payment Card Industry Data Security Standard compliance requirements. Inside rear of cabinet includes two (2) toolless PDU cable trays for


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    PDF 16-gauge RB-DC4242 DC2004242

    Untitled

    Abstract: No abstract text available
    Text: ZL40220 Precision 2:6 LVDS Fanout Buffer with Glitch-free Input Reference Switching Data Sheet February 2013 Features Ordering Information ZL40220LDG1 32 Pin QFN Trays ZL40220LDF1 32 Pin QFN Tape and Reel Inputs/Outputs • Accepts two differential or single-ended inputs


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    PDF ZL40220 ZL40220LDG1 ZL40220LDF1 -40oC

    Untitled

    Abstract: No abstract text available
    Text: ZL40200 Precision 1:2 LVPECL Fanout Buffer Data Sheet April 2014 Features Ordering Information ZL40200LDG1 ZL40200LDF1 Inputs/Outputs • Two precision LVPECL outputs • Operating frequency up to 750 MHz Trays Tape and Reel Matte Tin Accepts differential or single-ended input


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    PDF ZL40200 ZL40200LDG1 ZL40200LDF1 -40oC

    Untitled

    Abstract: No abstract text available
    Text: ZL40220 Precision 2:6 LVDS Fanout Buffer with Glitch-free Input Reference Switching Data Sheet April 2014 Features Ordering Information ZL40220LDG1 32 Pin QFN Trays ZL40220LDF1 32 Pin QFN Tape and Reel Inputs/Outputs • Accepts two differential or single-ended inputs


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    PDF ZL40220 ZL40220LDG1 ZL40220LDF1 -40oC

    ASTMD412

    Abstract: cafe
    Text: Description: Natural dissipative shock resistant foam rubber. This resilient non-skid foamed rubber provides an effective means of eliminating static charges. It was designed to line “cafeteria” style dissipative trays. For use on mobile process carts, and as liners for shelves, bins, and drawers or other areas where ESD


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    Untitled

    Abstract: No abstract text available
    Text: NOTES: REVISION R Q 1. C REPRESENTS A CRITICAL DIMENSION. 2. MINIMUM PUSHOUT FORCE: .75 LBS. 3. PARTS TO BE PACKAGED IN TRAYS. 4. MUST BE CHECKED ON EVERY 6 CONSECUTIVE PINS. 5. SEE RECOMMENDED FOOTPRINT DRAWING FOR STENCIL REQUIREMENTS. 6. MEASURE ON ALL 4 CORNERS OF THE ASSEMBLY.


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    PDF DPAF-XX-03 DPAF-23-03

    coto relay

    Abstract: 5v ceramic reed relay active and passive electronic components coto relay 3200 reed switch DCR test circuit coto 5V SPST Reed Relay competitor analysis, reed automatic change over switch circuit relay coto relays static relay coto
    Text: Technical & Applications Information [Relays] Reed Relay Packaging Relay packaging consists of antistatic tubes or trays depending upon relay model. Several Coto surface mount reed relays are available in Tape & Reel packaging. Listed below are the dimensions by Coto series and


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    Untitled

    Abstract: No abstract text available
    Text: NOTES: REVISION Q Q 1. C REPRESENTS A CRITICAL DIMENSION. 2. MINIMUM PUSHOUT FORCE: .75 LBS. 3. PARTS TO BE PACKAGED IN TRAYS. 4. MUST BE CHECKED ON EVERY 6 CONSECUTIVE PINS. 5. SEE RECOMMENDED FOOTPRINT DRAWING FOR STENCIL REQUIREMENTS. 6. MEASURE ON ALL 4 CORNERS OF THE ASSEMBLY.


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    PDF DPAF-XX-03 DPAF-23-03 K-1000-800 \DWG\MISC\MKTG\DPAF-XX-03

    Untitled

    Abstract: No abstract text available
    Text: REVISION HISTORY Ky NOTES! U N LESS OTHERWISE SPECIFIED 1. TRAYS MUST MEET ALL REQUIREMENTS OF AMKOR/ANAM § 01 -04-31 - 2 2 B 3 PROCUREMENT SPE C FOR SHIPPING TRAY. 2. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY 3. TOTAL USABLE CELL COUNT IS 490. 4. TRAY VACUUM PICKUP METHOD REQUIRES A 28XZ8m m


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    PDF 28XZ8m A51200 A52135

    DAEWON tray drawing

    Abstract: TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9
    Text: 6 3 1 REVISION HISTORY NDTE i 1. TRAYS MUST MEET A L L REQUIREMENTS OF AMKDR/ANAM # 01-0431-228 3 PROCUREMENT SPEC FDR SHIPPING TRAY. 2. B A K EA B LE TRAYS ARE INTENDED TD BE CONTINUOUSLY BAKED FDR 48 HDURS AT THE BAK E TEMPERATURE AS SPECIFIED . 3. TDTAL U SA BLE C E L L CDUNT IS 220.


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    PDF 5M-1994. DAEWON tray drawing TRAY DAEWON MPSU DAEWON tray 48 daewon CABGA MPSU 140 DAEWON tray 10 x 9

    Untitled

    Abstract: No abstract text available
    Text: 31 — 7 0 0 4 0 — 100T NDTES: REVISIONS DRAWING NO. 3. 4. MATERIALS DF CONSTRUCTION; BODY 8« RETAINING RING = BRASS, NICKEL PLATED. CONTACT = BERRYLLIUM COPPER, GOLD PLATED. INSULATDR = TFE, FLUORCARBON. PACKAGE THIS CONNECTQR IN ANTI-STATIC TRAYS, 30 PIECES PER TRAY,


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    PDF 40-100T