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    TRAY MATRIX BGA Search Results

    TRAY MATRIX BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    TRAY MATRIX BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    trays

    Abstract: QFN Shipping Trays PEAK TRAY bga
    Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad


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    BGA Solder Ball 0.35mm collapse

    Abstract: TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm
    Text: AMPHENOL TCS TB-2241 TM DFM and SMT Assembly Guideline Revision “B“ Specification Revision Status Revision “A“ “B” SCR No. Description Initial Date S1647 S1884 Initial Release Implemented 6-Pr changes Updated PN Tree and connector weight table


    Original     		PDF TB-2241 S1647 S1884 BGA Solder Ball 0.35mm collapse TB-2241 reballing circular thermocouple connector JEDEC tray standard dimension tb224 BGA Solder Ball 0.35mm BGA PROFILING SAC305 solder paste SAC305 reflow 13mm

    TB-2082

    Abstract: TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS
    Text: AMPHENOL TCS TB-2082 DFM and SMT Assembly Guideline Revision “F“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 J. Proulx J. Proulx 9/17/02


    Original     		PDF TB-2082 28mil TB-2082 TB208 470-2075-100 reballing programming smt machine 470-1075-100 470-3105-100 programming for smt machine C-471-1025-500 Amphenol MIL CIRCULAR CONNECTORS

    Teradyne connector

    Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
    Text: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight


    Original     		PDF TB-2082 Teradyne connector 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne

    FR4 substrate

    Abstract: No abstract text available
    Text: fBGA96T.5-DC144 TM BALLS PITCH 96 0.5mm SIZE MATRIX ROWS MAT’L CENTER TEL 1-714-898-3830 info@topline.tv 8mm SQ 14 x 14 BALL VIEW 2 none Flex Polyimide BOTTOM SIDE TOP X-RAY VIEW 14 13 12 11 10 9 8 7 6 5 4 3 2 1 1 2 3 A B C D E C D E F G F G H J K L M


    Original     		PDF fBGA96T 5-DC144 FR4 substrate

    MD300-10A

    Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
    Text: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case


    Original     		PDF P22C-100-300A-1 P8C-100-300B P-DIP8-0300-2 MD300-2A P8CT-100-300B2-1 MD300-1A P8C-100-300A-1 X13769XJ2V0CD00 MD300-10A P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		PDF P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

    3 band audio tone control

    Abstract: extra bass circuit diagram valve audio amplifier circuit diagram 676 BGA package tray extra bass circuit
    Text: Audio ICs Audio sound controller BH3857AFV The BH3857AFV is a signal-processing IC for controlling audio quality in CD radio-cassette players and mini-component stereo systems. Three-line serial control is available making it easy to adjust tone and volume using a microprocessor.


    Original     		PDF BH3857AFV BH3857AFV SSOP-A54 O220FP RSIP13 maging\BITTING\cpl\20010108\01052001\ROHM 3 band audio tone control extra bass circuit diagram valve audio amplifier circuit diagram 676 BGA package tray extra bass circuit

    Amkor SBGA

    Abstract: JEDEC Matrix Tray outlines MO-192 copper bond wire amkor CO-029 jedec bga tray MO192 192 BGA PACKAGE thermal resistance
    Text: LAMINATE data sheet SuperBGA Features: SuperBGA® SBGA Packages: The SuperBGA® (SBGA) technology provides a cavity down, high-power BGA package. The IC is directly attached to an integrated copper heatsink. Since the IC and I/O are on the same side, signal vias are eliminated,


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    PAL 007 c

    Abstract: PAL 007 B PAL 011 a PAL 007 Block Diagram of PAL TV receiver PAL 007 a ba7242f rgb encoder composite dip Rohm video encoder ntsc pal BA7* DIP
    Text: Multimedia ICs Color TV signal encoder BA7242F The BA7242F is an IC which converts analog RGB signals to NTSC and PAL color TV signals. In addition to composite output, luminance output, chrominance output, and analog RGB output are available. Each type of output is


    Original     		PDF BA7242F BA7242F SSOP-A54 O220FP RSIP13 maging\BITTING\cpl\20010105\01042001\ROHM PAL 007 c PAL 007 B PAL 011 a PAL 007 Block Diagram of PAL TV receiver PAL 007 a rgb encoder composite dip Rohm video encoder ntsc pal BA7* DIP

    LGA 1155 Socket PIN diagram

    Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


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    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


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    SMD MARKING CODE k11

    Abstract: Kodak TDI SMD CAPACITORS color code SMD marking code B10 KDP03100 ED-4701 ITU-R601 VB12 SMD MARKING CODE L6 SMD MARKING CODE h5
    Text: To: Product Specification Issued date： February 17 , 2005 Kodak Part Number： KDP03100 Kodak CAT Number： 8675928 Acknowledgement Seal This product is not designed, developed and manufactured as contemplated for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a


    Original     		PDF KDP03100 KDP03100 160mm 345mm 289mm 404mm 384mm SMD MARKING CODE k11 Kodak TDI SMD CAPACITORS color code SMD marking code B10 ED-4701 ITU-R601 VB12 SMD MARKING CODE L6 SMD MARKING CODE h5

    Untitled

    Abstract: No abstract text available
    Text: ARM-based Flash MCU SAM4N Series SUMMARY DATASHEET SAM4N8/16 Description The Atmel SAM4N series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex®-M4 RISC processor. It operates at a maximum speed of 100 MHz and features up to 1024 Kbytes of Flash and up to 80


    Original     		PDF SAM4N8/16 32-bit 16-bit 10-bit 12-bit

    A21-A0

    Abstract: tray matrix bga DQ15-DQ0
    Text: S70JL128H Two SpansionTM S29JL064H, 64 Megabit 8 M x 8-Bit/4 M x 16-Bit CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memories PRELIMINARY Distinctive Characteristics Architectural Advantages „ „ Simultaneous Read/Write operations — Data can be continuously read from one bank while


    Original     		PDF S70JL128H S29JL064H, 16-Bit) S70JL128HA0 A21-A0 tray matrix bga DQ15-DQ0

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    ba6849 driver ic

    Abstract: ba6849fp
    Text: Motor driver ICs 3-phase motor driver for CD-ROMs BA6849FP / BA6849FP-Y / BA6849FM / BA6849FS The BA6849 series are ICs developed for CD-ROM spindle motor drives. These ICs possess a short brake and reverserotation brake for two types of brake functions, and also contain FG output and rotation direction detection FR circuits,


    Original     		PDF BA6849FP BA6849FP-Y BA6849FM BA6849FS BA6849 SSOP-A54 O220FP RSIP13 maging\BITTING\cpl\20010105\01042001\ROHM ba6849 driver ic

    CY7B993V

    Abstract: CY7B994V LCK4993 LCK4994
    Text: Advance Data Sheet December 4, 2003 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 1 Features • 12 MHz—100 MHz LCK4993 , or 24 MHz—200 MHz (LCK4994) output operation ■ Matched pair output skew <200 ps ■ Zero input-to-output delay ■ ■ ■ 18 LVTTL 50% duty-cycle outputs capable of driving


    Original     		PDF LCK4993/LCK4994 Hz--100 LCK4993) Hz--200 LCK4994) DS04-014LCK DS02-346LCK) CY7B993V CY7B994V LCK4993 LCK4994

    DS 2020

    Abstract: CY7B993V CY7B994V JESD22-A114 LCK4993 LCK4993YH-DB LCK4993YH-DT LCK4994 chilled water system
    Text: Data Sheet, Revision 1 May 5, 2004 LCK4993/LCK4994 Low-Voltage PLL Clock Drivers 1 Features • 12 MHz—100 MHz LCK4993 , or 24 MHz—200 MHz (LCK4994) output operation ■ Matched pair output skew <200 ps ■ Zero input-to-output delay ■ 18 LVTTL 50% duty-cycle outputs capable of driving


    Original     		PDF LCK4993/LCK4994 Hz--100 LCK4993) Hz--200 LCK4994) DS04-014LCK-1 DS04-014LCK) DS 2020 CY7B993V CY7B994V JESD22-A114 LCK4993 LCK4993YH-DB LCK4993YH-DT LCK4994 chilled water system

    Untitled

    Abstract: No abstract text available
    Text: S98WS256PD0-003 Stacked Multi-chip Product MCP 256 Mbit (16 M x 16-Bit) 1.8 V Burst Mode Flash Memory 128 Mb (8M x 16-Bit) 1.8 V CellularRAM Type 2, Burst Mode Data Sheet S98WS256PD0-003 Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S98WS256PD0-003 16-Bit) S98WS256PD0-003

    spansion solder profile

    Abstract: diode F4 3J S29GL016A S29GL-A S71GL016A SPANSION 16
    Text: S71GL016A Based MCPs Stacked Multi-Chip Product MCP Flash Memory and RAM 16 Megabit (1M x 16-bit) CMOS 3.0 Volt-only Page Mode Flash Memory 4 Megabit (256K x 16-bit) pSRAM S71GL016A Based MCPs Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		PDF S71GL016A 16-bit) spansion solder profile diode F4 3J S29GL016A S29GL-A SPANSION 16

    28F160

    Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
    Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


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    SPH016D970R1R

    Abstract: SPH032D970R1R S71GL064NB0BHW S71GL032NA0B
    Text: S71GL-N Based MCPs Stacked Multi-Chip Product MCP Flash Memory and RAM 64/32 Megabit (4/2M x 16-bit) CMOS 3.0 Volt-Only Page Mode Flash Memory and 32/16 Megabit (2M/1M x 16-bit) Pseudo Static RAM S71GL-N Based MCPs Cover Sheet Data Sheet (Advance Information)


    Original     		PDF S71GL-N 16-bit) SPH016D970R1R SPH032D970R1R S71GL064NB0BHW S71GL032NA0B

    TI5C

    Abstract: SHARP I A05 SMD MARKING lah controller LU850425 lu850425 IR3Y38M LR38266 LR38277 LR38278 LR38578
    Text: SHARP S P E C No. E L 1 0 7 1 6 9 I S S U E : A u g u s t 18,1998 T o ;_ S P EC I F I CAT IONS Product Ty pe Model No. 8-BIT MICROCOMPUTER FOR DSP CAMERA SYSTEM LU850425 •^This specification contains 40 pages including the cover and appendix.


    OCR Scan     		PDF LU850425 LU850425 LQFP100â AA1058 CV557 TI5C SHARP I A05 SMD MARKING lah controller LU850425 IR3Y38M LR38266 LR38277 LR38278 LR38578