Kostat tray
Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher
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and5-741-9148
Kostat tray
KS-8308
CAMTEX
Kostat
DAEWON tray 48
DAEWON tray drawing
JEDEC Kostat
CERAMIC PIN GRID ARRAY CPGA AMD
daewon
D-12G-56LD-A13
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5150Q
Abstract: S100GF-65-8ET
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3510A-1 ST-TQ142014TJ-1 100 pin LQFP 14 x 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 Q F 31 30 100 1 G R S D C detail of lead end H I M J M P K N L NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of
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LA-3510A-1
ST-TQ142014TJ-1
S100GF-65-8ET
5150Q
S100GF-65-8ET
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PDF
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing NEC Tray JEDEC Tray Name LA-3A68A-1 ST-TQ242414TJ-1 TQFP 20x20 1.4mm 176 pin LQFP 24 × 24 Terminal Spacing Linear = 0.5 A B 132 133 89 88 detail of lead end C D S Q 176 1 R 45 44 F G H I M J P K M N NOTE ITEM Each lead centerline is located within 0.10 mm (0.004 inch) of
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LA-3A68A-1
ST-TQ242414TJ-1
S176GM-50-8EU-2
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S100GC-50-8EU
Abstract: f 630
Text: Mounting Pad Packing NEC Tray Name LA-3566A-1 LA-0566A-1 JEDEC Tray TQFP 14x14×1.4 100 pin LQFP 14 × 14 A B 75 76 51 50 detail of lead end S C D Q R 26 25 100 1 F G H I M J K P M N NOTE Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition.
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LA-3566A-1
LA-0566A-1
S100GC-50-8EU
S100GC-50-8EU
f 630
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PDF
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LQFP Package tray
Abstract: 128-PIN nec 144 pin LQFP LQFP Package 128-pin LQFP 144 tray
Text: TRAY CONTAINER UNIT : mm 17.55 135°C MAX 22.63 25.40 17.80 22.63 100.8 A' LQFP 20x20×1.4 25.20 135.9 NEC A 279.4 315.0 322.6 SECTION A-A' 22.63 6.02 (6.35) 7.62 19.85 Applied Package Quantity (pcs) Material 128-pin Plastic LQFP (Fine Pitch) (1.4mm thick)
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128-pin
144-pin
176-pin
SSD-A-H6553-1
LQFP Package tray
nec 144 pin LQFP
LQFP Package 128-pin
LQFP 144 tray
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PDF
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LQFP Package tray
Abstract: TQFP 1414 1.4mm JEDEC tray standard TQFP 1414
Text: HEAT PROOF 16.7 15.45 21.00 A' 6x15=90 A 150°CMAXPPE 7 105.0 TQFP 14×14×1.4 135.9 UNIT : mm 15.40 16.7 20.30 284.2 315.0 322.6 < SECTION A – A' > 16.7 5.62 6.35 7.62 13.85 Applied Package Quantity (pcs) 100-pin Plastic LQFP (1.4mm thick) MAX. 90 Tray
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100-pin
TQFP14
LQFP Package tray
TQFP 1414 1.4mm
JEDEC tray standard TQFP 1414
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LQFP Package tray
Abstract: 128-PIN ST-TQ142014TJ-1 NEC 87 tray dimensions
Text: TRAY CONTAINER A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A-A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 128-pin Plastic LQFP (1.4mm thick) 5.62 6.35 7.62 19.87 Quantity (pcs)
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ST-TQ142014TJ-1
100-pin
128-pin
SSD-A-H5941-1
LQFP Package tray
ST-TQ142014TJ-1
NEC 87
tray dimensions
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PDF
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ST-TQ142014TJ-1
Abstract: LQFP Package tray
Text: A' 15.45 16.64 21.00 150°C MAX. 7 A PPE ST-TQ142014TJ-1 135.9 105 UNIT : mm 22.64 25.40 17.80 279.4 315 322.6 SECTION A – A' 22.64 Applied Package 100-pin Plastic LQFP 1.4mm thick 5.62 6.35 7.62 19.87 Quantity (pcs) MAX. 72 Tray Material Heat Proof Temp.
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ST-TQ142014TJ-1
100-pin
ST-TQ142014TJ-1
LQFP Package tray
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PDF
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LQFP144
Abstract: QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32
Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic
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DIP14
DIP16
DIP18
DIP20
DIP22
DIP24
DIP32
DIP40
SDIP22
SDIP24
LQFP144
QFN24
tray qfp32
QFN tray
QFP52-A2
QFP52-S1
SSOP20
DIP18
DIP20
DIP32
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LQFP1414-8bt Package tray
Abstract: LQFP Package tray h658 LQFP1414-8BT
Text: TRAY CONTAINER HEAT PROOF 7 A' 15.45 18.0 6x15=90 21.00 A 135°CMAXPPE 105.0 NEC LQFP1414−8BT 15.40 18.0 20.30 284.2 315.0 322.6 < SECTION A – A' > 18.0 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (1.4mm thick)
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LQFP1414-8BT
64-pin
80-pin
SSD-A-H6583-1
LQFP1414-8bt Package tray
LQFP Package tray
h658
LQFP1414-8BT
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LQFP Package tray
Abstract: TQFP14X14X1 LQFP "100 pin" PACKAGE LQFP Package 128-pin 128-PIN tray container dimensions TRAY CONTAINER LQFP14 100-PIN PLASTIC LQFP NEC tqfp14x14x1.4
Text: TRAY CONTAINER 7 15.45 16.7 6x15=90 21.00 A' A 150°C MAX. PPE 105.0 TQFP14X14X1.4 15.40 16.7 20.30 284.2 315.0 322.6 Section A – A' 16.7 5.62 (6.35) 13.85 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) 80-pin Plastic LQFP (1.4mm thick) 100-pin Plastic LQFP (1.4mm thick)
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TQFP14X14X1
LQFP14
80-pin
100-pin
128-pin
SSD-A-H6285-2
-A-H6285-2
LQFP Package tray
LQFP "100 pin" PACKAGE
LQFP Package 128-pin
tray container dimensions
TRAY CONTAINER
100-PIN PLASTIC LQFP NEC
tqfp14x14x1.4
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QFP JEDEC tray
Abstract: nec 44 pin LQFP LQFP Package tray NEC lqfp 52 JEDEC TRAY QFP JEDEC tray standard qfp tray standard nec 44pin QFp Package tray tray qfp 160 jedec
Text: TRAY CONTAINER HEAT PROOF 7 A' 15.20 13.10 12.5 PPE 135°C MAX NEC 15.70 A 8x20 = 160 13.00 109.9 LQFP 10×10×1.4 12.5 288.8 315.0 322.6 SECTION A-A' 12.50 Applied Package 6.12 (6.35) 9.90 7.62 135.9 UNIT : mm Quantity (pcs) 64-pin Plastic QFP (1.4mm thick)
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64-pin
44-pin
52-pin
SSD-A-H6405-1
QFP JEDEC tray
nec 44 pin LQFP
LQFP Package tray
NEC lqfp 52
JEDEC TRAY QFP
JEDEC tray standard
qfp tray standard
nec 44pin
QFp Package tray
tray qfp 160 jedec
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lqfp64
Abstract: TRAY DIMENSIONS TQFP64 TQFP64 TQFP10
Text: FUJITSU SEMICONDUCTOR DATA SHEET LQFP64, TQFP64 Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box FPT-64P-M03 160 1600 9600 FPT-64P-M04 160 1600 9600 322.6 315 15.2 x 19 = 288.8 13.1 7.62 1.27 13.1 15.7 × 7 = 109.9 13 B 0.76 A A B 34.3
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LQFP64,
TQFP64
FPT-64P-M03
FPT-64P-M04
TQFP10
JHB-TQ101014F-3-D-1
lqfp64
TRAY DIMENSIONS TQFP64
TQFP64
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3510A
Abstract: LA10A LQFP Package tray
Text: Unit : mm 335±1.0 23.5±0.5 288±0.5 27.5±0.1 13.85 A' A 137.5±0.5 180±1.0 21.25±0.5 32±0.1 NEC LA–3510A–1 HEAT PROOF 19.85 SECTION A – A' 22.2 6.8 5.8 8.8 19.85 Applied Package Quantity pcs 100pin Plastic LQFP (1.4mm thick) MAX. 60 Tray LA-3510A-1
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100pin
LA-3510A-1
3510A
LA10A
LQFP Package tray
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LQFP Package tray
Abstract: fine pitch LQFP24 JEDEC TRAY DIMENSIONS tray container dimensions LQFP-24
Text: TRAY CONTAINER HEAT PROOF 30.40 20.70 26.4 7 135°C MAX NEC PPE A' 20.70 A 4x10=40 31.50 94.5 LQFP24×24×1.4 135.9 UNIT : mm 26.4 273.6 315.0 322.6 SECTION A – A' 26.4 6.12 7.62 (6.35) 23.9 Applied Package Quantity (pcs) 160-pin • Plastic LQFP(Fine Pitch)(1.4mm thick)
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LQFP24
160-pin
176-pin
216-pin
SSD-A-H6569
LQFP Package tray
fine pitch
JEDEC TRAY DIMENSIONS
tray container dimensions
LQFP-24
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LQFP Package tray
Abstract: JEDEC TRAY DIMENSIONS
Text: TRAY CONTAINER UNIT : mm 7 x 17=119 NEC 135° C MAX. A' 14.60 17.90 14.30 14.60 108.0 13.95 18.00 LQFP12 × 12× 1.4 135.9 PPE A 286.4 315.0 322.6 SECTION A-A' 14.60 5.62 (6.35) 7.62 11.82 Applied Package 64-pin Plastic LQFP (1.4mm thick) 80-pin Plastic LQFP (Fine Pitch)(1.4mm thick)
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LQFP12
64-pin
80-pin
SSD-A-H7503
LQFP Package tray
JEDEC TRAY DIMENSIONS
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PDF
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LQFP Package tray
Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
Text: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)
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48-pin
64-pin
SSD-A-H7499
LQFP Package tray
JEDEC TRAY DIMENSIONS
tray container dimensions
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PDF
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Untitled
Abstract: No abstract text available
Text: Packing Instruction Page:1/1 Tube and Tray Unit Quantity Update: June 3,2015 Description SRAM Product / Package 28 SOJ 25 ea / Tube 2,500 ea / 100 Tube / Box 10,000 ea / 4 Box / CTN 32 SOJ 22 ea / Tube 2,200 ea / 100 Tube / Box 8,800 ea / 4 Box / CTN 28 SOP
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9B/18B
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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trays
Abstract: QFN Shipping Trays PEAK TRAY bga
Text: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad
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Marking Code 2K
Abstract: No abstract text available
Text: EEPROM & Memory Card Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 12. Package Type 1 : TEBGA A : SDIP C : CHIP BIZ E : LQFP G : CLCC J : ELP L : CERDIP N : COB Q : QFP S : SOP V : SSOP Y : FBGA 2. Large Classfication : MOS (5)
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8K/16K
32K/64K
128K/256K
Marking Code 2K
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PDF
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HM-RAE105
Abstract: RPG100 PEAK TRAY qfn 4 x 4 RPG100F RPG100-01 qfn 5 x 5 TRAY PEAK TRAY qfn
Text: HM-RAE105-1105 PACKAGE [ RPG100 ] 32-pin plastic LQFP 32-pin plastic LQFP Lead pitch 0.80mm Package width x package length 7 x 7 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Note1 * :These dimensions do not include resin protrusion.
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HM-RAE105-1105
RPG100
32-pin
RPG100F
HM-RAE105
RPG100
PEAK TRAY qfn 4 x 4
RPG100F
RPG100-01
qfn 5 x 5 TRAY
PEAK TRAY qfn
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PDF
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
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