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    TRAY BGA 27 Search Results

    TRAY BGA 27 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    TRAY BGA 27 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tray datasheet bga

    Abstract: 4545
    Text: TRAY CONTAINER 45.3 27.95 2 x 6 = 12 A' A 48.00 37.50 150°C MAX 135.9 80.0 BGA 45 × 45 PPE 7 HEAT PROOF Unit : mm 45.3 240.0 315.0 322.6 SECTION A – A' Applied Package 4.72 7.62 (6.35) 45.30 44.0 Quantity (pcs) BGA 45 × 45 Tray 480-pin • Plastic BGA (45×45)


    Original     		PDF 480-pin 580-pin 672-pin 756-pin 888-pin SSD-A-H5933-3 tray datasheet bga 4545

    ADV0505

    Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
    Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The


    Original     		PDF ADV0505 and14 12C-0707-E19 12F-1111-119 1F3-1313-D19 1F1-1717-A19 12U-1919-G19 12Y-2323-919 12Y-3333-419 12Y-3535-419 ADV0505 FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7

    BGA package tray 40 x 40

    Abstract: ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07
    Text: FUJITSU SEMICONDUCTOR DATA SHEET BGA 256, 320, 352, 420, 484, 543, 544, 554, 676 PBGA 256, 352, 416, 420, 480, 484, 496 Maximum storage capacity PKG code Maximum storage capacity PKG code pcs/tray pcs/inner box pcs/outer box BGA-484P-M07 40 400 1600 1600 BGA-484P-M09


    Original     		PDF BGA-484P-M07 BGA-484P-M09 BGA-496P-M02 BGA-543P-M01 BGA-320P-M06 BGA-544P-M01 BGA-352P-M36 BGA-544P-M02 BGA-352P-M41 BGA-544P-M04 BGA package tray 40 x 40 ST-BG272720TJ-1-1-Y-1 676 BGA package tray tray datasheet bga TRAY JEDEC BGA 5 6 BGA-544P-M04 tray bga PBGA 484P SDP91-PS,PBGA,496P BGA-676P-M07

    676 BGA package tray

    Abstract: BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 7 135°C MAX. 27.50 29.20 262.8 315.0 322.6 26.10 Section A – A' 27.50 27.00 (5.95) (6.35) 7.62 27.50 29.20 87.6 BGA27×27ESP A' 24.15 135.9 PPE A Applied Package Quantity (pcs) Tray BGA27×27ESP 225-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 676 BGA package tray BGA package tray NEC 2415 tray bga 676-Pin 596-PIN 27ES jedec tray BGA tray datasheet bga BGA JEDEC tray

    676 BGA package tray

    Abstract: tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27
    Text: TRAY CONTAINER UNIT : mm 4x10=40 NEC 27.50 7 135°C MAX. 29.20 87.6 BGA27×27ESP A' 24.15 27.50 29.20 262.8 26.10 315.0 322.6 SECTION A – A' 27.50 (5.95) (6.35) 27.00 7.62 135.9 PPE A Applied Package 225-pin Plastic BGA (27×27) 256-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27ESP 225-pin 256-pin 272-pin 316-pin 320-pin 352-pin 385-pin 400-pin 676 BGA package tray tray bga BGA package tray jedec bga tray NEC 2415 tray bga 27

    27B1

    Abstract: BGA27 BGA package tray 625-Pin
    Text: TRAY CONTAINER UNIT : mm 4 x 10=40 87.6 135° C MAX. 27.25 24.15 NEC BGA27 × 27B-1 29.20 135.9 PPE A' A 27.25 29.20 26.10 262.8 315.0 322.6 SECTION A-A' 4.17 (6.35) 7.62 27.25 Applied Package Quantity (pcs) Tray BGA27×27B-1 624-pin Plastic BGA (27×27)


    Original     		PDF BGA27 27B-1 BGA27 624-pin 625-pin 720-pin 960-pin SSD-A-H7549-2 27B1 BGA package tray

    a 2530

    Abstract: JEDEC tray standard JEDEC TRAY DIMENSIONS tray bga BGA package tray tray jedec BGA 550-PIN
    Text: TRAY CONTAINER 19.80 135° C MAX. A A' 25.30 NEC 96.3 BGA30 x 25ESP 32.10 135.9 PPE 4 × 9=36 UNIT : mm 30.30 34.15 273.2 315.0 322.6 20.90 SECTION A-A' 30.30 (5.88) (5.62) 7.62 30.00 Applied Package Quantity (pcs) 420-pin Plastic BGA (30×25) 464-pin Plastic BGA (30×25)


    Original     		PDF BGA30 25ESP 550-pin BGA30 420-pin 464-pin SSD-A-H7573-2 a 2530 JEDEC tray standard JEDEC TRAY DIMENSIONS tray bga BGA package tray tray jedec BGA

    337 BGA

    Abstract: tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015
    Text: TRAY CONTAINER UNIT : mm 5x12=60 A' 135°C MAX. 20.15 21.35 7 BGA21×21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 322.6 SECTION A – A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21×21 ESP Tray 256-pin • Plastic BGA (21×21)


    Original     		PDF BGA21 21ESP 256-pin 272-pin 292-pin 320-pin 337-pin SSD-A-H7071-3 337 BGA tray bga 256-pin BGA Transistor 337 tray datasheet bga BGA PACKAGE 2015

    tray datasheet bga

    Abstract: tray bga
    Text: 150°C MAX 135.9 80 BGA 45 x 45 2 × 6 = 12 PPE 7 HEAT PROOF Unit : mm 45.3 A 48 37.5 45.3 240 315 322.6 SECTION A – A' 45.3 44 4.72 7.62 6.35 27.95 A' BGA 45 × 45 Tray Material Carbon PPE Heat Proof Temp. Surface resistance 135°C 12 less than 1 × 10 Ω /


    Original     		PDF 480-pin 580-pin 672-pin tray datasheet bga tray bga

    tray bga

    Abstract: tray datasheet bga NEC 2732 jedec bga tray tray jedec BGA JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm 4 x 9=36 19.80 135° C MAX. 25.30 NEC 96.3 A' BGA30.5×25ESP 32.10 135.9 PPE A 30.80 34.15 273.2 315.0 322.6 20.90 SECTION A-A' 30.80 (5.87) (5.62) 7.62 30.50 Applied Package Quantity (pcs) 559-pin Plastic BGA (30.5×25) 36 MAX.


    Original     		PDF BGA30 25ESP 559-pin SSD-A-H7739 tray bga tray datasheet bga NEC 2732 jedec bga tray tray jedec BGA JEDEC TRAY DIMENSIONS

    tray datasheet bga

    Abstract: TRAY DIMENSIONS tray bga
    Text: 87.6 24.15 29.20 135.9 UNIT : mm 27.2 A' A 27.2 29.2 26.10 262.8 315.0 322.6 SECTION A-A' 6.42 6.35 7.62 27.12 Applied Package Quantity (pcs) 256-pin Plastic BGA MAX. 40 Tray Material Heat Proof Temp. Surface resistance T-651 Carbon PES 135°C less than 1x1012Ω/


    Original     		PDF 256-pin T-651 tray datasheet bga TRAY DIMENSIONS tray bga

    Untitled

    Abstract: No abstract text available
    Text: TRAY CONTAINER UNIT : mm 3 x 7=21 NEC 80.0 135° C MAX. A' 37.70 40.00 37.50 37.70 27.95 7 BGA37.5 × 37.5A 40.00 135.9 PPE A 240.0 315.0 322.6 SECTION A-A' 3.92 (6.35) 7.62 37.70 Applied Package Quantity (pcs) 1296-pin Plastic BGA (37.5×37.5) (FLIP CHIP TYPE)


    Original     		PDF BGA37 1296-pin SSD-A-H7543

    nec 2505

    Abstract: tray datasheet bga BGA 927 tray bga nec 3131
    Text: TRAY CONTAINER UNIT : mm 3 x 9=27 85.8 NEC 135° C MAX. 31.25 25.05 BGA31 × 31A-1 42.90 135.9 PPE A A' 31.25 33.90 21.90 271.2 315.0 322.6 SECTION A-A' 4.32 (6.35) 7.62 31.25 Applied Package Quantity (pcs) 840-pin Plastic BGA (31×31) (FLIP CHIP TYPE)


    Original     		PDF BGA31 840-pin BGA31 SSD-A-H7559-1 nec 2505 tray datasheet bga BGA 927 tray bga nec 3131

    BGA25

    Abstract: TRAY DIMENSIONS JEDEC TRAY DIMENSIONS
    Text: TRAY CONTAINER UNIT : mm A' 7 25.50 27.50 20.00 25.50 135°C MAX. 26.70 BGA25x25ESP 27.50 NEC 82.5 135.9 4×11=44 PPE A 275.0 315.0 322.6 SECTION A – A' 25.50 (6.01) (6.35) 7.62 25.00 Applied Package Quantity (pcs) 240-pin Plastic BGA (25×25) (CAVITY DOWN ADVANCED TYPE)


    Original     		PDF BGA25 25ESP 240-pin SSD-A-H7199 TRAY DIMENSIONS JEDEC TRAY DIMENSIONS

    jedec bga tray

    Abstract: 784-pin 12Surface tray bga BGA package tray
    Text: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)


    Original     		PDF BGA29 29ESP 272-pin 729-pin 784-pin BGA29 SSD-A-H6977-2 jedec bga tray 12Surface tray bga BGA package tray

    256-pin

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name JEDEC Tray TBGA 27x27 256 pin T-BGA H/Sp (45 × 45) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M E S A B *1 S *2 detail of A part detail of B part (Z) K S N NOTES *1 Each ball centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		PDF 25MIN. S256N7-B6 256-pin

    WY transistor

    Abstract: tray datasheet bga 256-pin BGA S256S1-B6-1
    Text: Mounting Pad Packing Name JEDEC Tray T-651 256 pin BGA 27 x 27 A S B C D Y WV U T R P N M L K J H G F E D C B A P Index mark R H K L 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 φM F E I J G M NOTE Each lead centerline is located within φ 0.3 mm (φ 0.012 inch) of


    Original     		PDF T-651 S256S1-B6-1 WY transistor tray datasheet bga 256-pin BGA S256S1-B6-1

    tray datasheet bga

    Abstract: 256-pin BGA BGA L WY transistor
    Text: Packing Name Mounting Pad JEDEC Tray T-651 256 pin BGA 27 x 27 A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F L φM φN M S A B M S E G *1 *2 detail of A part K S NOTES * 1 Each lead centerline is located within φ 0.30 mm (φ 0.012 inch) of


    Original     		PDF T-651 Y256S1-B6 tray datasheet bga 256-pin BGA BGA L WY transistor

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    Kostat tray

    Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
    Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher


    Original     		PDF and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13

    56mm carrier tape

    Abstract: 28 pin ic TM 1628
    Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03


    Original     		PDF 3027b 56mm carrier tape 28 pin ic TM 1628

    CCGA

    Abstract: 938 SO-16 tray datasheet bga LQFP 48 Package Box tray BGA 520 CBF 420 292 CCGA BGA 328 plcc TRAY 40 PIN PDE-208
    Text: u Packing Quantities CHAPTER 6 SUMMARY OF PACKING QUANTITIES Packing Quantities Packages and Packing Publication Revision A 3/1/03 6-1 u Packing Quantities PACKING QUANTITIES The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each product carrier can be found in the following chapters:


    Original     		PDF

    S146

    Abstract: S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3
    Text: NEW High-Speed 10+Gbps BGA Mezzanine Connectors IT3 Series •Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single-ended,


    Original     		PDF 15mmH misali6-2-2557-7351 S146 S514 S144 200POS IT3D-200S-BGA37 IT3D-100S-BGA BGA reflow guide S142 PEAK TRAY bga hirose it3