TRAY
Abstract: Tray 14 x 20 tray 20 x 14
Text: PACKAGING DETAILS Quantities device quantities Part Number Packaging Style Quantity 803 XX Tray 100 1200 /X Boxed 10 1200 /X/X Boxed 10* 14 XXX XX Boxed/Tray 50/100 17 XXX Boxed 20 18 XXX Boxed 18R XXX Boxed 19 XXX Tray 19 XXXB Tray 10 100 3 - PACKAGING * The following devices are boxed in quantities of 5 : 1200/13/H
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1200/13/H
TRAY
Tray 14 x 20
tray 20 x 14
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Untitled
Abstract: No abstract text available
Text: 2,54 2,1 0,3 Verpackt in Tray - tray packaging Verpackungseinheit 182 Stück - packaging unit 182 a1 1,8 Abdeckung verpresst cover loose mounted cover pressed on 5,55 5 14 11,54 Abdeckung vorverrastet 6 x 14 = 84 0,6 max. 128 3 max. 342 6,6 15 X Einzelheit X
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Untitled
Abstract: No abstract text available
Text: 0,6 6,6 Verpackt in Tray - tray packaging Verpackungseinheit 98 Stück - packaging unit 98 a1 2,54 3 max. 342 Abdeckung vorverrastet cover loose mounted cover pressed on 5 x 2,54 = 12,7 5,55 5 14 21,7 Abdeckung verpresst 6 x 14 = 84 1,2 max. 128 6 6,6 15 X
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Untitled
Abstract: No abstract text available
Text: 3 6,6 2,54 Verpackt in Tray - tray packaging Verpackungseinheit 77 Stück - packaging unit 77 a1 3,6 Abdeckung vorverrastet Abdeckung verpresst 7 x 2,54 = 17,78 cover loose mounted cover pressed on 26,78 5,55 14 5 6 x 14 = 84 6 max. 128 3 max. 342 6,6 15 X
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Untitled
Abstract: No abstract text available
Text: 4,2 3 Verpackt in Tray - tray packaging Verpackungseinheit 98 Stück - packaging unit 98 a1 2,54 3 max. 342 Abdeckung vorverrastet Abdeckung verpresst 5 x 2,54 = 12,7 cover loose mounted cover pressed on 21,7 5,55 14 5 6 x 14 = 84 4,8 max. 128 2,4 6,6 15 X
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Untitled
Abstract: No abstract text available
Text: 4,2 5,4 2,54 Verpackt in Tray - tray packaging Verpackungseinheit 77 Stück - packaging unit 77 a1 4,8 Abdeckung vorverrastet Abdeckung verpresst 7 x 2,54 = 17,78 cover loose mounted cover pressed on 26,78 5,55 14 5 6 x 14 = 84 4,8 max. 128 3 max. 342 6,6
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Untitled
Abstract: No abstract text available
Text: 2,54 3,3 1,5 Verpackt in Tray - tray packaging Verpackungseinheit 112 Stück - packaging unit 112 a1 3 max. 342 4 x 2,54 = 10,16 Abdeckung verpresst cover loose mounted cover pressed on 5,55 5 14 19,16 Abdeckung vorverrastet max. 128 2,7 6 x 14 = 84 2,1 15
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Untitled
Abstract: No abstract text available
Text: 1,8 5,4 Verpackt in Tray - tray packaging Verpackungseinheit 98 Stück - packaging unit 98 a1 2,54 3 max. 342 Abdeckung vorverrastet cover loose mounted cover pressed on 5 x 2,54 = 12,7 5,55 5 14 21,7 Abdeckung verpresst 6 x 14 = 84 2,4 max. 128 4,8 6,6 15
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Untitled
Abstract: No abstract text available
Text: 0,6 9 2,54 Verpackt in Tray - tray packaging Verpackungseinheit 77 Stück - packaging unit 77 a1 1,2 Abdeckung vorverrastet Abdeckung verpresst 7 x 2,54 = 17,78 cover loose mounted cover pressed on 26,78 5,55 14 5 6 x 14 = 84 8,4 max. 128 3 max. 342 6,6 15
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Untitled
Abstract: No abstract text available
Text: 2,54 2,25 0,15 Verpackt in Tray - tray packaging Verpackungseinheit 154 Stück - packaging unit 154 a1 3 max. 342 2 x 2,54 = 5,08 Abdeckung verpresst cover loose mounted cover pressed on 5,55 5 14 14,08 Abdeckung vorverrastet 6 x 14 = 84 2,7 max. 128 0,3 6,6
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Untitled
Abstract: No abstract text available
Text: VF Type Voltage Controlled Crystal Oscillator RoHS Compliant Optional 1.Typical 20.4 x 12.8 x 7.8 mm, standard package & 14-Pin dual in line. 2.Pulling range: ±150ppm max. 3.Aging: ±1ppm/year. 4.TTL/ CMOS output. 5.Packing: 50pcs per Tray. V F T U P C J
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14-Pin
150ppm
50pcs
10TTL
000MHz
100ppm
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B65541
Abstract: B65541D0000R048 FAL0546-D FAL0547-L FAL0548-U FAL0549-3 FAL0667-7 FAL0683-N FAL0694-4 siferrit N22
Text: Ferrites Core P 14 x 8 B65541 With center hole Ungapped Mode of delivery: Packing: Sets Standard styrofoam tray size 200 mm x 300 mm Material AL value 1) [nH] N48 2300 +30% / -20% 1340 1) µe Air gap [mm] ø3+0,1 s Approx. weight: 3.2 g/set ø6 _ 0,2
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B65541
FPK0085-A
B65541D0000R048
B65541
B65541D0000R048
FAL0546-D
FAL0547-L
FAL0548-U
FAL0549-3
FAL0667-7
FAL0683-N
FAL0694-4
siferrit N22
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Untitled
Abstract: No abstract text available
Text: REVISION X QTE-XXX-01-X-D-EMX-XX OPTION -GP: GUIDE POST USE QTE-20-01-D-EMX-XX-GP, SEE FIG. 2, SHEET 2 -TY: TRAY PACKAGING No OF POSITIONS -020, -040, -060, *-080, *-100 (PER ROW) DO NOT SCALE FROM THIS PRINT *SEE NOTE 14 * = SEE NOTE 13 (No OF POSITIONS/20 x .7875 [20.003]) + .3900 [9.906] REF
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QTE-XXX-01-X-D-EMX-XX
QTE-20-01-D-EMX-XX-GP,
POSITIONS/20
QTE-20-01-D-EM2-XX
T-1S42-01-X)
QTE-20-01-D-EM3-XX
T-1S42-02-X)
QTE-20-XX-D-EMX-XX)
t\DWG\MISC\MKTG\QTE-XXX-01-X-D-EMX-XX-MKT
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Untitled
Abstract: No abstract text available
Text: REVISIONS SYM ZONE ECN, ERN NO. DATE PR O P O S A L JU L14/06 A APPRD. L CHAN SEE DETAIL 1B ’ FOR 4 POS'N BOARDLOCK PART NUMBER NO. OF NO. OF POSITIONS CONTACTS 'A* \B* DliVENSlOhIS ’C‘ '£>' r QUANTITY QUANTITY PER TRAY PER CARTON MATERIAL: R JE02-14 2 -0 X 2 0
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L14/06
JE02-14
RJE02â
162-0X
JE02-16
JUL14/06
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KGA0E000BA
Abstract: kgc0g000dm KGB0F000BA fBGA package tray 12 x 19 FCMSP kga0a000am kgd0h000dm fBGA package tray 12 19 secucalm lsi SoC
Text: Mobile SoC Code Information • Microcontroller • MSP • MOS August 2009 -1- Part Number Decoder Microcontroller Code Information 1/3 Last Updated : August 2009 S3XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 1. System LSI (S) 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte
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16-bit
32-bit
ARM10
16-bit
HT80Cer
KGA0E000BA
kgc0g000dm
KGB0F000BA
fBGA package tray 12 x 19
FCMSP
kga0a000am
kgd0h000dm
fBGA package tray 12 19
secucalm
lsi SoC
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IC 50061
Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing
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Mos MARKING CODE
Abstract: clcc tray transistor WLM package marking WF 5 CCD MARKING
Text: Imaging Solutions Code Information • MOS • CIS • CCD August 2009 -1- Part Number Decoder MOS Code Information 1/2 Last Updated : August 2009 S5XXXXXXXX - XXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1. System LSI (S) 9~10. Mask Option 2. Large Classification : MOS (5)
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Untitled
Abstract: No abstract text available
Text: Machine oriented packaging Reel dimensions and position of pin headers “Tape-on-Reel” Feed direction uneven pole numbers pin header is reversed even pole numbers O O O O Q O O O O f f l O O O O Si 5 0 0 0 0 OOP 0 9 0 0 0 0 c 20 H The pin headers for the 90° and 180° versions
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WM-G2412
Abstract: WM-G2412E-6WFWb wintek lcd Wintek LCM wintek wintek display 4.1" Toshiba LCM Toshiba T6963C LCD 128 240 Toshiba T6963C LCD 128 64 WM-G2412E
Text: WM-G2412E-6WFWb Contents Page 1 Electronic Units. 3 1.1 Absolute Maximum Ratings . 3 1.2 Electrical Characteristics (VDD=5.0V±10 , Ta=-20 to 70℃) . 3
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WM-G2412E-6WFWb
WM-G2412
WM-G2412E-6WFWb
wintek lcd
Wintek
LCM wintek
wintek display
4.1" Toshiba LCM
Toshiba T6963C LCD 128 240
Toshiba T6963C LCD 128 64
WM-G2412E
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wd-c1602m
Abstract: ST7066U wintek lcd WD-C1602 CASH BOX GUARD wintek WD-C1602MB-6NLWa wintek display LCM wintek C1602
Text: EG Components AB WD-C1602MB-6NLWa 2 History of Version Version Chap. a1 - 1 a2 3 2 Contents Date Note 27.Jun.2002 SPEC. Change as follow by : Customer 1.Change the name of customer from Cash Guard to EG Components AB 1.21.5、1.6：Change the IC from ST7066U-0A
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WD-C1602MB-6NLWa
ST7066U-0A
ST7066U-0B
wd-c1602m
ST7066U
wintek lcd
WD-C1602
CASH BOX GUARD
wintek
WD-C1602MB-6NLWa
wintek display
LCM wintek
C1602
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wintek lcd
Abstract: WD-C1602 wintek wintek display WD-C1602Q-6YLYC st7065 C1602 LCM wintek WINTEK SPECIFICATION wintek lcd WD
Text: STD WD-C1602Q-6YLYc 3 History of Version Version Chap. c1 - c2 c3 Date Note NEW VERSION 26.Sep.2001 SPEC.& Sample - Change as follow by Wintek 1.Modify SPEC Style 12.Oct.2001 SPEC.& Sample - Change as follow by Wintek 1.Modify SPEC Style 25.Oct.2001 SPEC.&
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WD-C1602Q-6YLYc
wintek lcd
WD-C1602
wintek
wintek display
WD-C1602Q-6YLYC
st7065
C1602
LCM wintek
WINTEK SPECIFICATION
wintek lcd WD
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din standard 5480
Abstract: pcb connectors din 5480 IPC-A610B sl-smt IEC 326-3
Text: 2 PCB-COMPONENTS PCB-COMPONENTS CATALOGUE 2002/03 CATALOGUE 2002/03 CATALOGUE 2002/03 CATALOGUE 2002/03 CATALOGUE EXTRACT SL-SMT 5.08 Omnimate Range - Pitch 5.08 mm Pin headers SL-SMT 5.08/90 D = up tp 8 poles Ø 1.4 +0.1 from 9 poles Ø 1.5 +0.1 Technical Data
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JEDEC TRAY DIMENSIONS
Abstract: TSOP 8x14 TSOP 48 package tray TSOP 32ld tray JEDEC TRAY 10 X 10 shipping tray jedec tray scale TSOP package tray
Text: _L _L _L 001IHAL RELEASE. NOTE : 1. BAKEABLE TRAYS ARE INTENDED TO BE CONTINUOUSLY BAKED FOR 48 HOURS AT THE BAKE TEMPERATURE AS SPECIFIED. 2. TOTAL USABLE CELL COUNT IS 208. 3. TRAY VACUUM PICKUP METHOD REQUIRES A 28m m SQUARE MINIMUM WALLED PICKUP AREA , LOCATED AS CLOSE TO
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001IHAL
1X105
1X1012
JEDEC TRAY DIMENSIONS
TSOP 8x14
TSOP 48 package tray
TSOP 32ld tray
JEDEC TRAY 10 X 10
shipping tray
jedec tray scale
TSOP package tray
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weidmueller
Abstract: din standard 5480 pin header stand-off pin in paste IEC 326-3
Text: 2 PCB-COMPONENTS PCB-COMPONENTS CATALOGUE 2002/03 CATALOGUE 2002/03 CATALOGUE 2002/03 CATALOGUE 2002/03 CATALOGUE EXTRACT SL-SMT 5.08 Omnimate Range - Pitch 5.08 mm Pin headers SL-SMT 5.08/90LF = Ø Ø = + Technical Data Rated voltage Rated current V A VDE
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08/90LF
weidmueller
din standard 5480
pin header stand-off pin in paste
IEC 326-3
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