TRANSMISSION LINES IN SIGNAL INTEGRITY Search Results

backplane design

Abstract: PCI backplane Layout backplane layout GTLP16T1655 Signal Path Designer
Contextual Info: Revised March 2002 Section 4 - Backplane Design Considerations Backplane Designer’s Guide This section focuses on designing high-performance parallel backplanes, a task that can be extremely complex. To assure high performance and good signal integrity, many issues must be considered during the design process. To a large extent,

SIGNAL PATH DESIGNER

Abstract: DSA0050327
Contextual Info: Revised March 2002 Section 6 - Noise, Cross-talk, Jitter, Skew, and EMI Backplane Designer’s Guide This section discusses backplane signal integrity, focusing on the phenomena and effects that can disrupt clean signals and high signal integrity. Enemies of signal integrity include noise, cross-talk, jitter, skew, and electromagnetic interference

SIGNAL PATH DESIGNER

Contextual Info: White Paper Basic Principles of Signal Integrity Introduction Digital designs have not traditionally suffered by issues associated with transmission line effects. At lower frequencies the signals remain within data characterization and the system performs as designed. But as system

SSTL-18

Contextual Info: Impact of I/O Settings on Signal Integrity in Stratix III Devices October 2007, ver. 1.0 Application Note 476 Introduction This application note provides information on the effects of the I/O settings on the quality of the signal. Its main focus is on drive strength

GS8170DW36B

Abstract: CLAMSHELL
Contextual Info: HSTL I/O Sync SRAM Board Design Guidelines System designers using high speed Synchronous Static RAM must consider how printed circuit board layout affects signal integrity when designing 100–300 MHz systems. Transmission line effects will affect signals even on short trace runs at these high speeds.

S1M A3

Abstract: S1M a4 pin model spice
Contextual Info: Simulation of the signal integrity of the ERNI ERmet 10Row 2mm H.M. connectors This application note is a demonstration for the use of the SPICE simulation models of the ERNI ERmet connector family. The goal of this simulation is to predict the crosstalk on a single connector pin issued by

Contextual Info: DataSource CD-ROM Q4-01: techXclusives techXclusives techXclusives Signal Integrity: Tips and Tricks By Austin Lesea Principal Engineer - Xilinx San Jose Signal Integrity SI engineering has become a necessary requirement for today's high-speed logic signals. Having control of cross-talk, ground

TN-46-06

Abstract: FR4 substrate with dielectric constant 4.4 transmission lines in signal integrity TN4606 micron power resistor FR4 substrate with dielectric constant 4 MICRON 63 micron resistor Signal Integrity transmission line theory
Contextual Info: TN-46-06 TERMINATON FOR POINT-TO-POINT SYSTEMS TECHNICAL NOTE TERMINATION FOR POINTTO-POINT SYSTEMS INTRODUCTION TRANSMISSION LINE THEORY Because digital signal rates in computing systems are increasing at an astonishing rate, signal integrity issues have become far more important to designers. At higher

CY7C038

Abstract: SIGNAL PATH designer
Contextual Info: Input Signal Integrity for CMOS Dual-Port Products Memory arrays are typically sensitive to noise and glitches at the input. Excessive undershoot or line noise may cause memory upset and data loss. When designing a circuit board, a good termination scheme is needed to maintain signal integrity. For details about the kinds of termination and transmission lines, please refer to the application notes “System

DS3662

Abstract: AN-337
Contextual Info: INTRODUCTION As the microcomputer bus bandwidth is extended to handle ever increasing clock rates, the noise susceptibility of a single-ended bus poses a serious threat to the overall system integrity. Thus, it is mandatory that the various noise contributions be taken into account in the design of the bus

DPRAM

Abstract: CY7C038 Signal Path Designer
Contextual Info: Input Signal Integrity for CMOS Dual-Port Products AN1142 Introduction Ground and Power Supply Bounce Memory arrays are typically sensitive to noise and glitches at the input. Excessive undershoot or line noise may cause memory upset and data loss. When designing a circuit board,

DSLAM drawing

Abstract: DSLAM board layout hyperlynx SIGNAL INTEGRITY AND TIMING SIMULATION PC3T04 IDT74FCT3807 PMC-1990815 PC3B01 74LCX244MCT
Contextual Info: VORTEX CHIPSET RELEASED DSLAM APPS NOTE PMC-1990816 ISSUE 1 SIGNAL INTEGRITY AND TIMING SIMULATION DSLAM DSLAM APPS NOTE: SIGNAL INTEGRITY AND TIMING SIMULATION FOR THE VORTEX CHIPSET S/UNI-DUPLEX, S/UNI-VORTEX, S/UNI-APEX AND S/UNI-ATLAS Released Issue 1

alan 100 plus

Abstract: Microwave PIN diode spice power supply diagram
Contextual Info: DesignCon 2007 FPGA Design for Signal and Power Integrity Larry Smith, Altera Corporation Hong Shi, Altera Corporation CP-01023-1.0 January 2007 Abstract FPGAs have traditionally been optimized for low-cost environments where signal and power integrity are minor considerations. With today’s requirements for high-speed

buffer driver ic SPICE MODEL S

Abstract: hyperlynx what is the drawback of operating system SN65LVDS31 SN65LVDS32 ic 4145B converter spice model 4145B
Contextual Info: Generating Accurate Behavioral Models of I/O Buffers Thomas Fisher Texas Instruments Abstract As data rates continue to rise the need for Signal Integrity simulation grows in importance. With this new interest in SI simulation comes the need to simulate accurately down to the device level. Silicon manufacturers are being asked with

Fairchild Switching power supply Technologies

Abstract: AN-5017 EIA-644 TR30 RS-644 Signal path designer
Contextual Info: Fairchild Semiconductor Application Note December 2000 Revised December 2000 LVDS Fundamentals Introduction What is LVDS? With the recent developments in the communications market, the demand for throughput is becoming increasingly more crucial. Although older differential technologies provide significant signal integrity benefits compared to singleended technologies, many of them consume much more

AN1051

Abstract: AN2127 MPC5500 MPC5553 MPC5554 MPC5554 evb AN2705
Contextual Info: Freescale Semiconductor Application Note Signal Integrity Considerations with MPC5500-based Systems by: Stevan Dobrasevic and John Phillippe MCD Design 1 Introduction As external bus interfaces increase in operating frequency, signal integrity becomes a major concern for

of 1000 microfarad electrolytic capacitor

Abstract: JTAG series termination resistors
Contextual Info: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.

Contextual Info: RFSeries High-performance RF Pyramid Probe cards DATA SHEET Cascade Microtech’s high-performance RF Pyramid Probe cards provide state-of-the-art signal integrity for wireless RF and microwave production test. Microstrip transmission lines maintain impedance control all the way to the bond pad. Patented ground and power planes

Tektronix P6056

Abstract: microstrip antenna mf AN-831 C1995 SUMITOMO F2 AN-831 national
Contextual Info: National Semiconductor Application Note 831 Michael L Gilbert James W Davison William M Hall July 1992 INTRODUCTION Electromagnetic Interference EMI has long been an issue in the integrity and certification of electronic systems Until recently design and measurement of electromagnetic compatibility (EMC) has predominantly been the focus of the

Signal Integrity Handbook

Abstract: Signal Integrity edge rate processing microwave products TWISTED SHIELDED PAIR SPICE MODEL transmission line model orcad pspice samtec PCIE 1-800-SAMTEC-9 samtec PCIE design
Contextual Info: INTERCONNECT SIGNAL INTEGRITY HANDBOOK AUGUST 2007 INTERCONNECT SIGNAL INTEGRITY HANDBOOK 2007 by Samtec, Inc. All rights reserved. Table of Contents Introduction . 4

FF1136

Abstract: SSTL18I thevenin DDR2 sstl_18 class magic eye ML461 ML561 UG190 UG199 XAPP863
Contextual Info: Application Note: Virtex-5, Virtex-4, and Spartan-3 Generation Devices R XAPP863 v1.0 June 1, 2007 Using Digitally Controlled Impedance: Signal Integrity vs. Power Dissipation Considerations Author: David Banas Summary On-die termination (ODT) promises higher signaling rates for printed circuit board (PCB) interchip interfaces through improved signal integrity. However, when using ODT, there is

N3215B

Abstract: EESof
Contextual Info: Agilent EEsof EDA Designing for Signal Integrity with Advanced Design System Course Overview Course Numbers Agilent-Training Center: N3215A Onsite-Training: N3215B Length What you will learn Prerequisites 3 Days • A brief introduction to ADS is presented, showing schematic capture,

transmission lines Twisted Pair spice model

Abstract: transmission lines Twisted Pair characteristics of twisted pair cable LVDS 30 pin connector cable slla053 twisted pair cable with parameter XAPP230 idc 20 pin data ribbon connector receiver LVDS XAPP231
Contextual Info: Application Note: Virtex-E Family The LVDS I/O Standard R XAPP230 v1.1 November 16, 1999 Application Note: Jon Brunetti & Brian Von Herzen Ph.D. Summary This application note describes the LVDS I/O standard. LVDS provides higher noise immunity than single-ended techniques, allowing for higher transmission speeds, smaller signal swings,

GA9012

Abstract: GA22V10
Contextual Info: GA9011/GA9012 Hoi Rod Update The following changes have been made to the Hot Rod data sheet, dated July, 1991: Figure I.Chip Set Data Flow Communications Protocol Unidirectional Link HOT ROD TRANSMITTER 40 • The maximum transmit strobe interval requirement for guaranteed data integrity