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    TRANSISTOR CB550 Search Results

    TRANSISTOR CB550 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TTC5886A Toshiba Electronic Devices & Storage Corporation NPN Bipolar Transistor / hFE=400~1000 / VCE(sat)=0.22V / tf=120ns Visit Toshiba Electronic Devices & Storage Corporation
    TTA2097 Toshiba Electronic Devices & Storage Corporation PNP Bipolar Transistor / hFE=200~500 / VCE(sat)=-0.27V / tf=60ns Visit Toshiba Electronic Devices & Storage Corporation
    XPQR8308QB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 80 V, 350 A, 0.00083 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    XPQ1R00AQB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 300 A, 0.00103 Ω@10V, L-TOGL Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation

    TRANSISTOR CB550 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    8mm pitch BGA 256 pin 14x14

    Abstract: CB45000 CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10
    Text: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV


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    PDF CB55000 8mm pitch BGA 256 pin 14x14 CB45000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics of BGA Staggered pins bga 10x10

    b55qs

    Abstract: CB45000 ultra fine pitch BGA CB55Q CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics
    Text: CB55000 Series HCMOS7 Standard Cells FEATURE • 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV


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    PDF CB55000 b55qs CB45000 ultra fine pitch BGA CB55Q D950 ST10 ST100 ST20 CMOS GATE ARRAY BGA stmicroelectronics

    0.25-um CMOS standard cell library inverter

    Abstract: CMOS GATE ARRAY stmicroelectronics OLIVETTI
    Text: CB55000 Series HCMOS7 Standard Cells FEATURES • ■ ■ ■ ■ ■ 0.25 micron drawn 0.20 micron effective channel length process , six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided


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    PDF CB55000 0.25-um CMOS standard cell library inverter CMOS GATE ARRAY stmicroelectronics OLIVETTI

    0.18-um CMOS technology characteristics

    Abstract: CB55000 CB65000 D950 ST10 ST100 ST20 CMOS GATE ARRAY stmicroelectronics 12v na 19.5v 0.18-um CMOS technology characteristics 1.2V
    Text: CB65000 Series HCMOS8D 0.18µm Standard Cells Family FEATURE • 0.18 micron drawn, six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV lithography. ■ 1.8 V optimized High Performance and Low


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    PDF CB65000 85K/mm 30nanoWatt/Gate/MHz/ 0.18-um CMOS technology characteristics CB55000 D950 ST10 ST100 ST20 CMOS GATE ARRAY stmicroelectronics 12v na 19.5v 0.18-um CMOS technology characteristics 1.2V

    CB55000

    Abstract: CB65000 D950 ST10 ST100 ST20 12v na 19.5v 0.18-um CMOS technology characteristics horizontal output section 0.18Um Standard cell ST
    Text: CB65000 Series HCMOS8D 0.18µm Standard Cells Family FEATURE • 0.18 micron drawn, six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV lithography. ■ 1.8 V optimized High Performance and Low


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    PDF CB65000 85K/mm 30nanoWatt/Gate/MHz/ CB55000 D950 ST10 ST100 ST20 12v na 19.5v 0.18-um CMOS technology characteristics horizontal output section 0.18Um Standard cell ST

    ST100

    Abstract: CB55000 CB65000 D950 ST10 ST20 tristate nand gate
    Text: CB65000 Series HCMOS8D Standard Cells Family FEATURES • ■ ■ ■ ■ ■ 0.18 micron drawn, six layers of metal connected by fully stackable vias and contacts, Shallow Trench Isolation, low resistance, salicided active areas and gates. Deep UV lithography.


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    PDF CB65000 85K/mm2, 30nanoWatt/Gate/MHz/Stdload. ST100 CB55000 D950 ST10 ST20 tristate nand gate

    24c02 wp

    Abstract: transistor CB550 nForce4 G781-1P8F intel DG 31 crb c3421 transistor intel dg 41 crb nvidia ck804 nForce4 sli c3751 transistor
    Text: 5 4 GPU on Normal Mode conduct MXM on master slot only,link to PCIE x16 lanes . PAGE INDEX: 01_BLOCK_DIAGRAM 02_CLOCK_BLOCK_DIAGRAM GPU SLAVE 09_CK804 1/7 _HT/CPU_IF 10_CK804(2/7)_PCIE 11_CK804(3/7)_PCI/LPC 12_CK804(4/7)_SATA/PATA/XTAL-IN 13_CK804(5/7)_USB/MAC/AC97/RTC/SMB


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    PDF 26pins CK804 USB/MAC/AC97/RTC/SMB 8LANESdsn0403 2200P. 24c02 wp transistor CB550 nForce4 G781-1P8F intel DG 31 crb c3421 transistor intel dg 41 crb nvidia ck804 nForce4 sli c3751 transistor