TQFP-176 FOOTPRINT Search Results

atmel 216

Abstract: TQFP 132 PACKAGE TQFP216 BGA-121
Contextual Info: Packaging Introduction Atmel pairs its high-performance silicon with packages, custom designed for the company’s gate arrays. Atmel offers our gate arrays in ceramic and plastic packages. Atmel’s plastic through hole and surface mount packages come in a

plx 9030

Abstract: FOOTPRINTS CONNECTOR ssop-4 footprint plcc 208 plx 9030 176-pin pqfp PLCC pin configuration FOOTPRINTS CONNECTOR 2 PIN 14 pin plcc socket footprint soic 20 pci connector footprint plx 9030 data sheet
Contextual Info: PCI 9030RDK–LITE PCI SMARTarget Rapid Development Kit Features •A PCI v2.2 prototype adapter board design based on the PLX PCI 9030 SMARTarget I/O Accelerator ■ Surface mount footprints on the board support industry standard embedded CPUs, DSPs, FPGAs, CPLDs and

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

3195A

Contextual Info: XC3100, XC3100A Logic Cell Array Families Product Specifications F eatu re s Description • Two ultra-high-speed FPGA families with six members each XC3100 and XC3100A are performance-optimized rela­ tives of the XC3000 and XC3000A families. While all families are footprint compatible, the XC3100 and XC3100A

Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 SY-PQ240 enplas FPQ-256
Contextual Info: v3.1 Socket Recommendation for Actel FPGA Packages Sockets for Prototyping with Actel FPGAs Actel offers a range of surface-mount sockets to make it easier for designers to prototype designs using Actel one-time-programmable FPGAs. These sockets have been manufactured for Actel by some of

Contextual Info: XC3100, XC3100A Logic Cell Array Families Product Specifications Features Description • Two ultra-high-speed FPGA families with six members each XC3100 and XC3100A are performance-optimized rela­ tives of the XC3000 and XC3000A families. While all families are footprint compatible, the XC3100 and XC3100A

footprint tqfp 208

Abstract: GPIO20 rtc 205 82371AB FDC37N958FR FDC37N972 QS3384
Contextual Info: APPLICATION NOTE 8.1 DUAL FOOTPRINT CONFIGURATION FOR THE FDC37N958FR AND THE FDC37N972 OVERVIEW • • • The SMSC FDC37N972 and the FDC37N958FR are 208-pin ISA Ultra I/O Controllers for mobile applications. These devices are pin-compatible with the following exceptions, which

footprint tqfp 208

Abstract: rtc 205 82371AB FDC37N958FR FDC37N972 QS3384
Contextual Info: APPLICATION NOTE 8.1 DUAL FOOTPRINT CONFIGURATION FOR THE FDC37N958FR AND THE FDC37N972 OVERVIEW • • • The SMSC FDC37N972 and the FDC37N958FR are 208-pin ISA Ultra I/O Controllers for mobile applications. These devices are pin-compatible with the following exceptions, which

led interface with 8051

Abstract: Keyboard Controller kbc1100 philips RC5 8051 KBC1100 RC5 Infrared 8051 interfacing 8051 keyboard pwm fan speed control 8051 KBC1100-RD KBC1100-RT block diagram of 8051 based ADC
Contextual Info: KBC1100 Mobile KBC with Super I/O, SFI, ADC and DAC with SMSC SentinelAlert!TM PRODUCT FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ ■ Data Brief 3.3V Operation with 5V Tolerant Buffers ACPI 1.0b/2.0 and PC99a/PC2001 Compliant LPC Interface with Clock Run Support

Contextual Info: XC3100A Logic Cell Array Families f lX IL IN X Product Specifications Features Description • Ultra-high-speed FPGA family with six members The XC3100A is a performance-optimized relative of the XC3000 and XC3000A families. While all families are footprint compatible, XC31 OOAfamiliy extends the system

atmel 0945

Abstract: atmel 428
Contextual Info: pkg-3.5-04/98 Packaging Introduction . 4-3 Package Options: Table . 4-3

b13193

Abstract: XCR3256XL 614E-13 CS280 DS012 DS013 PQ208 TQ144 208pin T1648
Contextual Info: R DS013 v1.2 May 3, 2000 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,000 usable gates • Available in small footprint packages

footprint tqfp 208

Abstract: rtc 205 82371AB FDC37N958FR FDC37N972 QS3384 TQFP 100 footprint
Contextual Info: APPLICATION NOTE 8.1 DUAL FOOTPRINT CONFIGURATION FOR THE FDC37N958FR AND THE FDC37N972 OVERVIEW • • • The SMSC FDC37N972 and the FDC37N958FR are 208-pin ISA Ultra I/O Controllers for mobile applications. These devices are pin-compatible with the following exceptions, which

7064B

Abstract: m7512b
Contextual Info: MAX 7000B M Ï Ï I 3 Â. Programmable Logic Device Family August 1999. ve Data Sheet Features. • Preliminary Information ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array M atrix (MAX ) architecture (see Table 1)

footprint jedec MS-026 TQFP

Abstract: PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas
Contextual Info: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.

1000-pin bga 0,8 mm

Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
Contextual Info: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble

CI M6387-13

Abstract: CI 386 D XC3000 XC3000A XC3000L XC3100 XC3100A XC3120A XC3130A XC3195A
Contextual Info: XC3100A Field Programmable Gate Arrays  June 1, 1996 Version 4.1 Product Specification Features Description • The XC3100A is a performance-optimized relative of the XC3000A and XC3100A families. While all families are footprint compatible, XC3100A family extends the typical system performance beyond 85 MHz.

EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
Contextual Info: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.

EPM7218

Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family July 1999, ver. 2.02 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

PJO 399

Abstract: PJO 389 PJO 499 B13128 pjo 489 7512A PJO 376 PJO 386
Contextual Info: MMMA. MAX 7000A Includes MAX7000AE Programmable Logic Device Family May 1999, ver. 2 Data Sheet Features. • ■ ■ Prelim inary Information ■ ■ ■ ■ High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

CS-007

Abstract: Amkor Electronics Amkor mold compound
Contextual Info: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld

eeprom programmer schematic

Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family June 1999, ver. 2.01 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX

TTL pin outs

Abstract: 30J341 CMOS TTL Logic Family Specifications BGA and QFP Package BITBLASTER footprint tqfp 208 v16 248 337 BGA footprint N12110 74 series pin outs
Contextual Info: MAX 7000A Includes MAX 7000AE Programmable Logic Device Family September 1999, ver. 2.03 Data Sheet Features. • ■ Preliminary Information ■ ■ ■ ■ ■ f High-performance CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX