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    TO-46 THETA JC Search Results

    TO-46 THETA JC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    ADC1038CIWM Rochester Electronics LLC ADC, Successive Approximation, 10-Bit, 1 Func, 8 Channel, Serial Access, PDSO20, SOP-20 Visit Rochester Electronics LLC Buy
    TL505CN Rochester Electronics LLC ADC, Dual-Slope, 10-Bit, 1 Func, 1 Channel, Serial Access, BIMOS, PDIP14, PACKAGE-14 Visit Rochester Electronics LLC Buy
    ML2258CIQ Rochester Electronics LLC ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, PQCC28, PLASTIC, LCC-28 Visit Rochester Electronics LLC Buy
    CA3310AM Rochester Electronics LLC ADC, Successive Approximation, 10-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PDSO24, PLASTIC, MS-013AD, SOIC-24 Visit Rochester Electronics LLC Buy
    CA3310M Rochester Electronics LLC ADC, Successive Approximation, 10-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PDSO24, PLASTIC, MS-013AD, SOIC-24 Visit Rochester Electronics LLC Buy

    TO-46 THETA JC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 3.3Vdc and 2.5Vdc, clock square wave


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    PDF QT481 QT488 768kHz EAR99 768kHz 000gto

    32.768khz 5ppm

    Abstract: QT481 QT88L EAR99 QT492 QT488
    Text: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 3.3Vdc and 2.5Vdc, clock square wave


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    PDF QT481 QT488 768kHz EAR99 768kHz QT488 32.768khz 5ppm QT88L EAR99 QT492

    Untitled

    Abstract: No abstract text available
    Text: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 2.5Vdc and 3.3Vdc, clock square wave generator and a miniature round or


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    PDF QT481 QT488 768kHz EAR99 768kHz QPDS-0008

    Untitled

    Abstract: No abstract text available
    Text: QT581 AND QT588 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s high temperature real time clock oscillators consist of a source clock square wave generator and a


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    PDF QT581 QT588 768kHz 768kHz

    Untitled

    Abstract: No abstract text available
    Text: QT581 AND QT588 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s high temperature real time clock oscillators consist of a source clock square wave generator and a


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    PDF QT581 QT588 768kHz 768kHz characte90232 QPDS-0007

    Untitled

    Abstract: No abstract text available
    Text: QT481 AND QT488 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s leaded or surface-mount miniature QT481 and QT488 oscillators consist of an IC 2.5Vdc and 3.3Vdc, clock square wave generator and a miniature round or


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    PDF QT481 QT488 768kHz EAR99 768kHz QPDS-0008

    MCM2680-1 32.768KHZ

    Abstract: No abstract text available
    Text: QT581 AND QT588 SERIES Q-TECH CORPORATION ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS 2.5Vdc and 3.3Vdc - 32.768kHz Description Q-Tech’s high temperature real time clock oscillators consist of a source clock square wave generator and a


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    PDF QT581 QT588 768kHz 768kHz QT582 MCM2680-1 32.768KHZ

    MAX8900

    Abstract: DC1006 ion lithium battery ev
    Text: MAX8900C RELIABILITY REPORT FOR MAX8900CEWV+ WAFER LEVEL PRODUCT February 10, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX8900C MAX8900CEWV+ JESD22A114. /-100mA JESD78. MAX8900CEWV TWFZDQ001J, MAX8900 DC1006 ion lithium battery ev

    Untitled

    Abstract: No abstract text available
    Text: MAX8765 RELIABILITY REPORT FOR MAX8765ETI+ PLASTIC ENCAPSULATED DEVICES July 7, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX8765 MAX8765ETI+ TLI3CA005B PD15-3 /-500V JESD22-A114. /-250mA.

    JESD22-A114

    Abstract: MAX4951BE SATA III sata Connector signal spacing
    Text: MAX4951BE RELIABILITY REPORT FOR MAX4951BECTP+ PLASTIC ENCAPSULATED DEVICES May 19, 2010 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Don Lipps Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.


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    PDF MAX4951BE MAX4951BECTP+ 96hrs. C/150 JESD22-A114 MAX4951BE SATA III sata Connector signal spacing

    IPC-9702

    Abstract: BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C
    Text: Freescale Semiconductor Tape Ball Grid Array TBGA Overview TM Revision 0 – 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale


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    PDF 30C/60% 125degC. IPC-9702 BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C

    Theta-JC QFP die down

    Abstract: G30-88 Theta-J G38-87 Theta JB
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold Compound: Sumitomo 7304LC


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    PDF 2500AN 7304LC G38-87 115x102 Theta-JC QFP die down G30-88 Theta-J Theta JB

    Untitled

    Abstract: No abstract text available
    Text: LB11685AV Monolithic Digital IC 3-Phase sensor less Motor Driver Application Note http://onsemi.com Overview The LB11685AV is a three-phase full-wave current-linear-drive motor driver which adopts a sensorless control system without a use of Hall effect device. The LB11685AV features a current soft switching circuit for


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    PDF LB11685AV LB11685AV

    MT06-2

    Abstract: MT06
    Text: MAX6767 RELIABILITY REPORT FOR MAX6767TALD2+T PLASTIC ENCAPSULATED DEVICES June 9, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX6767 MAX6767TALD2 I06-2 /-2000V JESD22-A114. /-100mA JESD78. MT06-2 MT06

    C9633

    Abstract: soic theta jc value
    Text: MAX4521 RELIABILITY REPORT FOR MAX4521CSE+ PLASTIC ENCAPSULATED DEVICES October 6, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX4521 MAX4521CSE+ /-2000V /-100mA. NC5CAX001B, NC5AAX001B, C9633 soic theta jc value

    GST-2

    Abstract: soic theta jc value
    Text: MAX9371 RELIABILITY REPORT FOR MAX9371ESA+ PLASTIC ENCAPSULATED DEVICES June 10, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX9371 MAX9371ESA+ /-2500V /-250mA. N7L0BQ002B, N7L0AQ001B, GST-2 soic theta jc value

    MAX17108E

    Abstract: No abstract text available
    Text: MAX17108ETI+ RELIABILITY REPORT FOR MAX17108ETI+ PLASTIC ENCAPSULATED DEVICES May 4, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved.


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    PDF MAX17108ETI+ 1000hrs. C/150Â MAX17108E

    Untitled

    Abstract: No abstract text available
    Text: MAX1305 RELIABILITY REPORT FOR MAX1305ECM+ PLASTIC ENCAPSULATED DEVICES January 3, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX1305 MAX1305ECM+ ReliabilC44 /-1000V /-250mA. IHG0FA004D,

    MAX2850

    Abstract: MAX2850ITK "rf transmitter ic" rf transmitter ic 8 channel RF transmitter and Receiver circuit DIA WD401 max285 OFDM receiver wireless hdmi WD40-1
    Text: MAX2850 RELIABILITY REPORT FOR MAX2850ITK+ PLASTIC ENCAPSULATED DEVICES April 8, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.


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    PDF MAX2850 MAX2850ITK+ /-1500V JESD22-A114. /-250mA JESD78. MAX2850 MAX2850ITK "rf transmitter ic" rf transmitter ic 8 channel RF transmitter and Receiver circuit DIA WD401 max285 OFDM receiver wireless hdmi WD40-1

    Untitled

    Abstract: No abstract text available
    Text: MAX4080 RELIABILITY REPORT FOR MAX4080SASA+T PLASTIC ENCAPSULATED DEVICES June 6, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.


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    PDF MAX4080 MAX4080SASA 100mA JESD78, -25mA/ -25mA/passes 100mA

    98ARL10519D

    Abstract: JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8
    Text: Freescale Semiconductor Application Note AN2409 Rev. 1.0, 12/2005 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


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    PDF AN2409 98ARL10519D JESD51-5 JEDEC JESD51-8 BGA AN2409 JESD51-7 JESD51-51 jesd51 8 54ld JESD51-8

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


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    PDF AN2409

    MTTF analysis data

    Abstract: JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32
    Text: Freescale Semiconductor, Inc. Application Note AN2409/D Rev. 0, 01/2003 Small Outline Integrated Circuit-Fine Pitch Package SOIC Freescale Semiconductor, Inc. CONTENTS 1.0 PURPOSE 3 2.0 SCOPE 3 3.0 SOIC PACKAGE 3 3.1 PACKAGE DESCRIPTION 3 3.2 PACKAGE DIMENSION


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    PDF AN2409/D MTTF analysis data JEDEC JESD51-8 BGA 98ARL10519D JESD51-51 QFN PACKAGE thermal resistance JESD51-5 JESD51-7 jesd51 8 1147 x motorola SOICW-32

    AN1232

    Abstract: QFP PACKAGE thermal resistance micromechanical
    Text: MOTOROLA Order this document by AN1232/D SEMICONDUCTOR TECHNICAL DATA AN1232 Thermal Performance of Plastic Ball Grid Array PBGA Packages for Next Generation FSRAM Devices Prepared by: Shailesh Mulgaonker (APDC, Phoenix, AZ) and Bennett Joiner (APDPL, Austin, TX)


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    PDF AN1232/D AN1232 AN1232/D* AN1232 QFP PACKAGE thermal resistance micromechanical