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    TMS 3613 Search Results

    TMS 3613 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54121-808361300LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    89361-344LF Amphenol Communications Solutions Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle. Visit Amphenol Communications Solutions
    89361-344SLF Amphenol Communications Solutions Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle. Visit Amphenol Communications Solutions
    68683-613 Amphenol Communications Solutions Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Through Mount, Top Entry, Double Row, 26Position ,2.54mm (0.100in) Pitch.. Visit Amphenol Communications Solutions
    68683-613LF Amphenol Communications Solutions Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Through Mount, Top Entry, Double Row, 26Position ,2.54mm (0.100in) Pitch.. Visit Amphenol Communications Solutions

    TMS 3613 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    raychem manual

    Abstract: marking code software EAN-13 DUN14 raychem marking code TMS-WINTOTAL-SWARE
    Text: RINTERCONNECT A DIVISION OF !@#$ ELECTRONICS WinTotal Wire marking software • Powerful wire marker design and print software • Familiar Windows user environment • Pre-loaded with Raychem Interconnect identification products • Powerful import and export functions:


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    Untitled

    Abstract: No abstract text available
    Text: CY7C1371D CY7C1373D 18-Mbit 512 K x 36/1 M × 18 Flow-Through SRAM with NoBL Architecture 18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture Features Functional Description • No Bus Latency (NoBL) architecture eliminates dead cycles


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    CY7C1371D CY7C1373D 18-Mbit CY7C1371D/CY7C1373D PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1371D CY7C1373D 18-Mbit 512 K x 36/1 M × 18 Flow-Through SRAM with NoBL Architecture 18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture Features Functional Description • No Bus Latency (NoBL) architecture eliminates dead cycles


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    CY7C1371D CY7C1373D 18-Mbit CY7C1371D/CY7C1373D PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1371D CY7C1373D 18-Mbit 512 K x 36/1 M × 18 Flow-Through SRAM with NoBL Architecture 18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture Features Functional Description • No Bus Latency (NoBL) architecture eliminates dead cycles


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    CY7C1371D CY7C1373D 18-Mbit 133-MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1371D CY7C1373D 18-Mbit 512 K x 36/1 M × 18 Flow-Through SRAM with NoBL Architecture 18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture Features Functional Description • No Bus Latency (NoBL) architecture eliminates dead cycles


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    CY7C1371D CY7C1373D 18-Mbit 133-MHz PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1371D CY7C1373D 18-Mbit 512 K x 36/1 M × 18 Flow-Through SRAM with NoBL Architecture 18-Mbit (512 K × 36/1 M × 18) Flow-through SRAM with NoBL™ Architecture Functional Description Features • No Bus Latency (NoBL) architecture eliminates dead cycles


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    CY7C1371D CY7C1373D 18-Mbit 133-MHz PDF

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    Abstract: No abstract text available
    Text: CY7C1366C, CY7C1367C 9-Mbit 256 K x 36/512 K × 18 Pipelined DCD Sync SRAM 9-Mbit (256 K × 36/512 K × 18) Pipelined DCD Sync SRAM Features Functional Description  Supports bus operation up to 166 MHz  Available speed grade is 166 MHz  Registered inputs and outputs for pipelined operation


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    CY7C1366C, CY7C1367C CY7C1366C/CY7C1367C PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1366C, CY7C1367C 9-Mbit 256 K x 36/512 K × 18 Pipelined DCD Sync SRAM 9-Mbit (256 K × 36/512 K × 18) Pipelined DCD Sync SRAM Features Functional Description • Supports bus operation up to 166 MHz ■ Available speed grade is 166 MHz ■ Registered inputs and outputs for pipelined operation


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    CY7C1366C, CY7C1367C PDF

    Untitled

    Abstract: No abstract text available
    Text: CY7C1366C, CY7C1367C 9-Mbit 256 K x 36/512 K × 18 Pipelined DCD Sync SRAM 9-Mbit (256 K × 36/512 K × 18) Pipelined DCD Sync SRAM Features Functional Description • Supports bus operation up to 166 MHz ■ Available speed grade is 166 MHz ■ Registered inputs and outputs for pipelined operation


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    CY7C1366C, CY7C1367C CY7C1366C/CY7C1367C PDF

    MIL-C-17

    Abstract: RG-211 MIL-W-85 M17/194-00001 M17 RG 180
    Text: INTRODUCTION Times Microwave Systems designs and manufactures high performance coaxial cables, connectors and cable assemblies for a broad range of RF transmission applications. For more than 50 years, Times has been the leader in the development of new cable


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    800-TMS-COAX TL-15 MIL-C-17 RG-211 MIL-W-85 M17/194-00001 M17 RG 180 PDF

    y336

    Abstract: Y164 Y165 Y143 88 TR 337 Y162 ST8601 Y163 TMS 3834 Transistor 337
    Text: ST Sitronix ST8616 168 Segment Driver for STN LCD with Low-Voltage Drive PRELIMINARY Notice: This is not a final specification. Some parameters are subject to change 1 Features „ 168/160 output mode „ 4/8 bits data bus „ LCD drive voltage: 2.6 to 5.5 V


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    ST8616 ST8616 168-channel ST8600 ST8601. ST8616, 2001/Dec/13 2001-Aug-24. y336 Y164 Y165 Y143 88 TR 337 Y162 ST8601 Y163 TMS 3834 Transistor 337 PDF

    tms 3614

    Abstract: 755-335 ST8600 ST 6244 A 06 / CT X112 ST8624 ST8632 x9301 X8302
    Text: ST Sitronix ST8600 240 Channel Common Driver for STN LCD with High-Voltage Drive PRELIMINARY Notice: This is not a final specification. Some parameters are subject to change 1 Features „ Duty cycle up to 1/240 „ Intermediate voltage I/F „ LCD drive voltage: 43V max


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    ST8600 ST8600 240-channel 2001/Feb/28 tms 3614 755-335 ST 6244 A 06 / CT X112 ST8624 ST8632 x9301 X8302 PDF

    TXC07900AIBG

    Abstract: TXC-07900AIBG TSOP transmitter B020H OED155TM TXC-07900-MB VTXP-6 AU-AIS dk12b EK117
    Text: OED155 Device Dual STM-1 Overhead Terminator, Tributary Processor and Cross-Connect with Integrated E1 Mapper TXC-07900 PRODUCT PREVIEW DATA SHEET DESCRIPTION: ™ The Optimized Edge Device, OED155, is a dual STM-1 SDH framer and overhead terminator, virtual tributary


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    OED155 TXC-07900 TXC-07900-MB, OED155TM TXC07900AIBG TXC-07900AIBG TSOP transmitter B020H OED155TM TXC-07900-MB VTXP-6 AU-AIS dk12b EK117 PDF

    RX1d

    Abstract: 3A184
    Text: AsTriX Device CellBus Expansion Switch TXC-05840 DATA SHEET The AsTriX™ TXC-05840 CellBus Expansion Switch is a single chip switching solution for ATM systems. In order to meet the accelerating need for bandwidth in access systems, the AsTriX is designed to allow higher


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    TXC-05840 TXC-05804) CUBIT-622 TXC-05805) TXC-05860) TXC-05810) OC-12 16-bit MPC850/860 TXC-05840-MB RX1d 3A184 PDF

    TXC-07905-MB

    Abstract: TXC-07905 OED622 B016H BP85H MSP SNCP h-12-H cu3ah B007H
    Text: OED622 Device Dual STM-4/STM-1 Overhead Terminator, Tributary Processor and Cross-Connect with Integrated E1 Mapper TXC-07905 PRODUCT PREVIEW DATA SHEET DESCRIPTION: ™ The Optimized Edge Device, OED622, is a dual STM-4/STM-1 SDH framer and overhead terminator, virtual


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    OED622 TXC-07905 TXC-07905-MB, OED622TM TXC-07905-MB TXC-07905 B016H BP85H MSP SNCP h-12-H cu3ah B007H PDF

    POS-PHY ATM format

    Abstract: No abstract text available
    Text: Sertopia Device UTOPIA Serializer TXC-05860 DESCRIPTION • In-band UTOPIA and POS-PHY Level 2 operating modes for cell and packet traffic • UTOPIA Level 2, and POS-PHY operating modes for cell and packet traffic • One UTOPIA port up to 800 Mbit/s


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    TXC-05860 gC-05860-MB POS-PHY ATM format PDF

    Untitled

    Abstract: No abstract text available
    Text: ASPEN-PX Device ASPEN Port Expander TXC-05811 DATA SHEET FEATURES DESCRIPTION  The ASPEN-PX TXC-05811 , ASPEN Port Expander is a single chip solution for increasing the UTOPIA port density of ASPEN based systems. The ASPEN-PX device acts as a port expander enabling the ASPEN


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    TXC-05811 TXC-05810B) 256-lead TXC-05811-MB PDF

    Line Driver SHDSL

    Abstract: lan SHDSL TXC-05806 TXC-06212 DP43 metd15 DP39 AETA
    Text: ASPEN-PX Device ASPEN Port Expander TXC-05811 DATA SHEET DESCRIPTION FEATURES  • Interoperable with ASPEN TXC-05810B UTOPIA Level 2 interface • Provides port expansion for up to 64 UTOPIA Level 2 ports • Utilizes ASPEN ATM AccessEDGE firmware for


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    TXC-05811 TXC-05810B) 256-lead TXC-05811) TXC-05811-MB, Line Driver SHDSL lan SHDSL TXC-05806 TXC-06212 DP43 metd15 DP39 AETA PDF

    hp-1100

    Abstract: TL3M hp1100 TXC-03453B
    Text: TL3M Device Triple Level 3 Mapper TXC-03453B DATA SHEET SDH/SONET SIDE TELECOM BUS O-Bit Interfaces • Add/drop multiplexers • Digital cross connect systems • Broadband switching systems • Transmission equipment External Alarm Interfaces Drop Bus


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    TXC-03453B TXC-03453B-MB, hp-1100 TL3M hp1100 PDF

    Untitled

    Abstract: No abstract text available
    Text: PHAST -12N Device STM-4/OC-12 SDH/SONET Overhead Terminator with Telecom Bus Interface TXC-06312 DESCRIPTION • Bit-serial LVPECL SDH/SONET line interface with integrated clock recovery and clock synthesis - single 622.08 Mbit/s STM-4/OC-12 signal or - four 155.52 Mbit/s STM-1/OC-3 signals


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    STM-4/OC-12 TXC-06312 VC-4-Xc/STS-1/STS-3c/STC-6c/STS9c/STS-12c TXC-06312-MB PDF

    intel 7882

    Abstract: TXC-03453AI df2a df2e TXC-03453B
    Text: TL3M Device Triple Level 3 Mapper TXC-03453B DATA SHEET SDH/SONET SIDE TELECOM BUS O-Bit Interfaces • Add/drop multiplexers • Digital cross connect systems • Broadband switching systems • Transmission equipment External Alarm Interfaces Drop Bus


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    TXC-03453B TXC-03453B-MB intel 7882 TXC-03453AI df2a df2e TXC-03453B PDF

    HDB3

    Abstract: df2a SOT
    Text: TL3M Device Triple Level 3 Mapper TXC-03453B DATA SHEET Each of the three channels of the TL3M can map a DS3 line signal into an STM-1 TUG-3 or STS-3 STS-1 SPE SDH/SONET signal. An E3 signal can be mapped only into an STM-1 TUG-3. The TL3M interfaces to an STM-1 or STS-3 SDH/SONET signal


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    TXC-03453B TXC-03453B-MB HDB3 df2a SOT PDF

    df2e

    Abstract: TXC-03453 TXC-06103
    Text: TL3M Device Triple Level 3 Mapper TXC-03453 DATA SHEET Each of the three channels of the TL3M can map a DS3 line signal into an STM-1 TUG-3 or STS-3 STS-1 SPE SDH/SONET signal. An E3 signal can be mapped only into an STM-1 TUG-3. The TL3M interfaces to an STM-1 or STS-3 SDH/SONET signal


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    TXC-03453 TXC-03453-MB df2e TXC-03453 TXC-06103 PDF

    UPD 056

    Abstract: CBAW
    Text: ASPEN Express Device DATA SHEET PRODUCT PREVIEW FEATURES DESCRIPTION The ASPEN Express device is a single-chip solution for implementing cost-effective ATM multiplexing and switching systems, based on the CellBus architecture. Such systems are constructed from a number of CUBIT-3, CUBIT-Pro,


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    TXC-05806 8/16-bit) TXC-05806-MB UPD 056 CBAW PDF