TIN BOX Search Results

Contextual Info: b http://www.tekcon.com http://www.tekcon.com.tw 1131 Series 2.54 mm Box Header Low Profile, 4 Walls, Right Angle Ordering Information 1131 - X X X - XX R Contact Plating 0 - Gold Flash/Tin 100 µ" 1 - 10 µ" Gold/Tin 100 µ" 2 - 20 µ" Gold/Tin 100 µ" 3 - 30 µ" Gold/Tin 100 µ"

Contextual Info: 3012 SER IES □upi in BOX HEADER 2.54m m 0.100" Material: H ousing: 30% Glass filled C o n tac ts: Brass P la tin g : Gold plated: 5/T PBT U L 9 4 V - 0 . over 5 0 /i' nickel. Tin plated: 1 50/z over ( ' nickel. Selective gold plated: S tandard gold on m a tin g 'area and tin plated on

Contextual Info: b http://www.tekcon.com http://www.tekcon.com.tw 1131 Series 2.54 mm Box Header Low Profile, 4 Walls, Straight Ordering Information 1131 - X X X - XX S - XX Contact Plating 0 - Gold Flash/Tin 100 µ" 1 - 10 µ" Gold/Tin 100 µ" 2 - 20 µ" Gold/Tin 100 µ"

Contextual Info: 3112 SERIES □upi in BOX HEADER 2.0m m 0.079" Material: Housing: 30% Glass filled PBT UL94V —0. Contacts: Brass Plating: Gold plated: 5pi' over 5 0 /T nickel. Selective gold plated: gold plated on m a tin g area and tin plated on solder tail. Tin plated: 150/z

JEDEC Code e3

Abstract: IEC-60068-2 J-STD-020B E3 SOT MILITARY QUALIFIED DIP SWITCHES SSOT-23 IEC600682-58 QFN-16 SC-75A SC-89
Contextual Info: 100% Matte Tin Sn -Plated Family of Products Released with “–E3” suffix New Vishay Siliconix Matte Tin-Plated Packages Meet Requirements for Both Lead-Based and Lead-Free Solders Highlights: • 100% Matte Tin (Sn) plating replaces standard Tin/Lead (Sn/Pb) plating on Vishay Siliconix

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION CC 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION BY 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION CJ 02 PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -T: MATTE TIN OVER ENTIRE CONTACT

Contextual Info: 3011 SERIES □up* in BOX HEADER WITH EJECTORS 2 .5 4 m m 0 .1 0 0 " Material: Housing: 30% Glass filled PBT U L94V ^0. C ontacts: Brass P lating: Gold plated: ( ' over ( ' nickel. Tin plated: 1 ( ' over 70 nickel. Selective gold plated: Standard gold on m a tin g area and tin plated on

L 146 CB

Abstract: L 146 CB Equivalent F9037 EB 202 D HB Electronic Components marking EB 202 diode marking HB diode C0402 C0805 C1206
Contextual Info: New Product Bulletin Tin/Lead “L” Termination Ceramic Chip Capacitors KEMET's line of Tin/Lead termination commercial MLCC surface mount capacitors is designed to meet the needs of commercial, high reliability, and military customer applications where Tin/Lead plating is required. As the

22-25L

Contextual Info: New Product Bulletin Tin/Lead “L” Termination Ceramic Chip Capacitors KEMET's line of Tin/Lead termination commercial MLCC surface mount capacitors is designed to meet the needs of commercial, high reliability, and military customer applications where Tin/Lead plating is required. As the

Contextual Info: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the

Contextual Info: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the

C0805C103K5RAL

Abstract: transistor DJ marking 2JS marking
Contextual Info: CERAMIC CHIP/CAPACITORS Tin Lead L Termination FEATURES KEMET’s line of Tin/Lead termination commercial MLCC surface mount capacitors are designed to meet the needs of the commercial, high reliability, and military customer applications where Tin/Lead plating is required. KEMET’s Tin/Lead electroplating process is designed to meet a 5% minimum lead content in the termination of the component. As the bulk of the

A109

Contextual Info: 3214 Series □upun Box Header 1.27mmX2.54mm 0.050”X0.100” Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.

A116

Abstract: u 3842
Contextual Info: 3012 Series □upnn Box Header 2.54m m 0.100” Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating:Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail. Electrical Characteristics:

A111

Contextual Info: 3215 Series □upiin Box Header 1.27mmX2.54mm 0.050”X0.100” Material: Housing: 30% Gloss filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.

smema

Abstract: STR22 smema wiring smema control technical of tamura solder paste Cu6Sn5 telcon Schloetter NASA Group TND311
Contextual Info: TND311 Tin Whisker Info “Brief” http://onsemi.com APPLICATION NOTE Tin whiskers are a potential concern with high-tin Sn content lead finishes (this includes alloys such as SnBi, and SnCu). SnPb alloys introduced in the 1950's have been the most successful in controlling whiskers. It is widely

A110

Contextual Info: 3214 Series □upun Box Header 1.27mmX2.54mm 0.050”X0.100” Material: Housing: 3 0 % Glass filled PBT U L94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.

bellcore GR-78

Abstract: J-STD-006 SAC305
Contextual Info: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.

A105

Contextual Info: 3212 Series □upi in Box Header With Ejectors 1.27mmX2.54mm 0.050"X0.100" M aterial: Housing: 30% Glass filled PBT UL94V-0. Contacts: Brass. Plating: Gold plated over nickel. Tin plated over nickel. Selective gold plated: Gold plated on mating area and tin plated on solder tail.

Contextual Info: BCS-1XX-XXX-X-XX-XXX REVISION BW DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATIONS SEE TABLE 1 -T: MATTE TIN CONTACT AND TAIL -L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL -F: 3µ" FLASH SELECTIVE GOLD CONTACT AREA, MATTE TIN ON TAIL

Contextual Info: BCS-1XX-XXX-X-XX-XXX REVISION BV DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATIONS SEE TABLE 1 -T: MATTE TIN CONTACT AND TAIL -L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT AREA, MATTE TIN ON TAIL -F: 3µ" FLASH SELECTIVE GOLD CONTACT AREA, MATTE TIN ON TAIL

Contextual Info: MMS-1XX-02-XXX-XX-XX-XXX REVISION CH 02 DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: 30µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -L: 10µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL -F: 3µ" SELECTIVE GOLD IN CONTACT AREA, MATTE TIN TAIL