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    MRF286

    Abstract: AP 494 Application Note ansys eb211 motorola milestone
    Text: MOTOROLA Order thisEB211 document by EB211/D SEMICONDUCTOR ENGINEERING BULLETIN EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW Copper Tungsten Base Package Prepared by: Jeanne Pavio, Jerry Mason, Bill Adams, Wendi Stemmons, Craig Johnson, Bob Wentworth,


    Original     		PDF EB211 EB211/D MRF286, MRF286 AP 494 Application Note ansys eb211 motorola milestone