thermal design guide -intel
Abstract: 82801CA E7500 E7501 E7505 P64H2 intel package drawings intel celeron 633 flotherm MODEL intel 61 chipset
Text: Intel E7500 and Intel® E7501 Chipsets MCH Thermal Design Guide for Embedded Applications March 2003 Order Number: 273819-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
|
Original
|
E7500
E7501
E7501
thermal design guide -intel
82801CA
E7505
P64H2
intel package drawings
intel celeron 633
flotherm MODEL
intel 61 chipset
|
PDF
|
LFXP2-8E
Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.
|
Original
|
64-ball
144-ball
LFXP2-8E
LFXP2-40E
LFXP2-5E
LFXP20C
theta jc FCBGA
LFXP2-17E
LFE3-17
Theta JB
LFXP15C
LFXP2-8E 132
|
PDF
|
nokia 1600 schematic diagram
Abstract: TUNDRA Tsi568 Tundra Tsi568a Alcatel fcbga theta jc FCBGA 10GIL TSI568 005 tx1 nortel
Text: Title Tsi568A Serial RapidIO Switch Hardware Manual Formal April 2007 80B8000_MA002_04 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi568A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor
|
Original
|
Tsi568A
80B8000
Tsi568A,
nokia 1600 schematic diagram
TUNDRA Tsi568
Tundra Tsi568a
Alcatel fcbga
theta jc FCBGA
10GIL
TSI568
005 tx1 nortel
|
PDF
|
nokia 1600 schematic diagram
Abstract: TSI564 TUNDRA Tsi568
Text: Titl Tsi564A Serial RapidIO Switch Hardware Manual Formal May 2007 80B802A_MA002_04 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi564A, and Silicon Behind the Network, are trademarks of Tundra Semiconductor
|
Original
|
Tsi564A
80B802A
Tsi564A,
nokia 1600 schematic diagram
TSI564
TUNDRA Tsi568
|
PDF
|
tundra srio switch
Abstract: BGA PACKAGE thermal profile chn 037 tsi576
Text: Title Tsi576 Serial RapidIO Switch Hardware Manual Preliminary October 2007 80B804A_MA002_01 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi576, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.
|
Original
|
Tsi576
80B804A
Tsi576,
tundra srio switch
BGA PACKAGE thermal profile
chn 037
|
PDF
|
BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
|
Original
|
63Sn/37Pb)
BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Title Tsi574 Serial RapidIO Switch Hardware Manual Final November 2007 80B8050_MA001_02 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi574, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.
|
Original
|
Tsi574
80B8050
Tsi574,
|
PDF
|
RC1800
Abstract: 736-pin FC54 ddr phy LSI Rapidchip ARM926 "user manual" LSI gigablaze serdes DDR PHY ASIC LSI coreware library ARM926
Text: DATASHEET RC1800 Foundation Slice Family April 2003 Advance DB14-000253-02 This document is advance. As such, it describes a product under development. This information is intended to help you evaluate the product. LSI Logic reserves the right to change or discontinue this proposed product without notice.
|
Original
|
RC1800
DB14-000253-02
DB14-000253-02,
RC1800
736-pin
FC54
ddr phy
LSI Rapidchip
ARM926 "user manual"
LSI gigablaze serdes
DDR PHY ASIC
LSI coreware library
ARM926
|
PDF
|
Tsi578
Abstract: No abstract text available
Text: Titl IDT Tsi578 Serial RapidIO Switch Hardware Manual May 18, 2012 GENERAL DISCLAIMER Integrated Device Technology, Inc. “IDT” reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or
|
Original
|
Tsi578
Tsi578
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Titl IDT Tsi574 Serial RapidIO Switch Hardware Manual May 18, 2012 GENERAL DISCLAIMER Integrated Device Technology, Inc. “IDT” reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or
|
Original
|
Tsi574
Tsi574
|
PDF
|
Tsi578
Abstract: TSI578-10GILY tundra srio switch tsi578 hardware manual Tsi578 user guide "tsi578 user manual" Tsi578 switch IPC-D-317 10GIL
Text: Title Tsi578 Serial RapidIO Switch Hardware Manual Final November 2007 80B803A_MA002_07 Trademarks TUNDRA is a registered trademark of Tundra Semiconductor Corporation Canada, U.S., and U.K. . TUNDRA, the Tundra logo, Tsi578, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.
|
Original
|
Tsi578
80B803A
Tsi578,
TSI578-10GILY
tundra srio switch
tsi578 hardware manual
Tsi578 user guide
"tsi578 user manual"
Tsi578 switch
IPC-D-317
10GIL
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Titl IDT Tsi576 Serial RapidIO Switch Hardware Manual May 18, 2012 GENERAL DISCLAIMER Integrated Device Technology, Inc. “IDT” reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or
|
Original
|
Tsi576
Tsi576
|
PDF
|
EP80579
Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
Text: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile
|
Original
|
EP805799
L5408,
EP80579
loop heat pipes
heat pipes
32-1055
Sicc
intel liquid cooling
MULTIPLE EFFECT EVAPORATOR
heat exchanger process
TRANSFORM
fanless motherboard
|
PDF
|
MC100EL91
Abstract: MC100EPT25 MC100LVEP16 MC10LVEP16 100H646
Text: AND8072/D Thermal Analysis and Reliability of WIRE BONDED ECL Prepared by: Paul Shockman ON Semiconductor Logic Applications Engineering http://onsemi.com APPLICATION NOTE WIRE BONDED Device Failure Mechanisms For the plastic DIP, SOIC, TSSOP, PLCC, TQFP, and
|
Original
|
AND8072/D
MC100EL91
MC100EPT25
MC100LVEP16
MC10LVEP16
100H646
|
PDF
|
|
|
X557-AT2
Abstract: lp 8029 l4
Text: Intel X557-AT/AT2/AT4 10 GbE PHY Datasheet Networking Division ND Features: 10GBASE-T Performance — Ability to support worst case channels while reducing power and latency when channel characteristics permit: Built-in thermal management capabilities — Enables deployment in thermally constrained
|
Original
|
X557-AT/AT2/AT4
10GBASE-T
H7137NL
G13-152T-038
G17-188T-038
G12-1JJT-038
JT4-1108HL
RJTGE1G4172J
H130A-50
000-16-F-1010-TR-NS1
X557-AT2
lp 8029 l4
|
PDF
|
bcp 846
Abstract: 100C PCM45 PCM45F HT 7002
Text: Intel 413808 and 413812 SAS/ SATA I/O Controllers Thermal Design Considerations Application Note July 2007 Order Number: 315052-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
|
Original
|
SU200-250513
54MCP
mm01x05x05
etaC--218314
bcp 846
100C
PCM45
PCM45F
HT 7002
|
PDF
|
100C
Abstract: PCM45 PCM45F moc 7002
Text: Intel 81341 and 81342 I/O Processors Thermal Design Considerations Application Note July 2007 Order Number: 315051-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
|
Original
|
SU200-150513
etaC--24318
100C
PCM45
PCM45F
moc 7002
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 8-Port Serial RapidIO Switch 1 Device Overview Performance – 20 Gbps of peak switching bandwidth – Non-blocking data flow architecture within each sRIO priority – Very low latency for all packet length and load condition – Internal queuing buffer and retransmit buffer
|
Original
|
IDT80KSW0003,
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 12-Port Serial RapidIO Switch 1 Device Overview ◆ The CPS-12, device number IDT80KSW0004, is a serial RapidIO sRIO switch whose functionality is central to routing packets for distribution among DSPs, processors, FPGAs, other switches, or any other sRIO-based devices. It may
|
Original
|
12-Port
CPS-12,
IDT80KSW0004,
CPS-12
80KSW0004
125Gbps,
25Gbps
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 16-Port Serial RapidIO Switch 1 Device Overview ◆ The CPS-16, device number IDT80KSW0002, is a serial RapidIO sRIO switch whose functionality is central to routing packets for distribution among DSPs, processors, FPGAs, other switches, or any other sRIO-based devices. It may
|
Original
|
16-Port
CPS-16,
IDT80KSW0002,
CPS-16
80KSW0002
125Gbps,
25Gbps
|
PDF
|
thermal test vehicle -intel
Abstract: PCM45F honeywell thermocouple
Text: Intel 3100 Chipset Thermal Design Guide November 2008 Order Number: 313457-004US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
|
Original
|
313457-004US
thermal test vehicle -intel
PCM45F
honeywell thermocouple
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Datasheet 80KSW0005 10-Quad RapidIO Switch 1 Device Overview The CPS-10Q 80KSW0005 is a serial RapidIO switch whose functionality is central to routing packets for distribution among DSPs, processors, FPGAs, other switches, or any other sRIO-based devices. The CPS-10Q supports serial
|
Original
|
80KSW0005
10-Quad
CPS-10Q
80KSW0005)
CPS-10Q
125Gbps,
25Gbps
676-Pin
|
PDF
|
honeywell pcm45
Abstract: mpga479 pcm45 ECC-00177-01-GP L2400 PCM45F T2500 INTEL embedded processors Core 2 duo socket 478 motherboard manual cpu socket mPGA479m
Text: Intel CoreTM Duo processor on 65 nm process for Embedded Applications Thermal Design Guide February 2006 Order Number: 311161-001 February 2006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS
|
Original
|
|
PDF
|
PCM45F
Abstract: intel core 2 duo e7500 T9400 atom intel Honeywell TIM2 3185* Intel METRIX+ox+5100
Text: Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Thermal/Mechanical Design Guide July 2008 Revision 003US Order Number: 318676-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
|
Original
|
003US
318676-003US
x1131
D10234-001
A13494-005
HB96030-DW)
PCM45F
intel core 2 duo e7500
T9400
atom intel
Honeywell TIM2
3185* Intel
METRIX+ox+5100
|
PDF
|
