THERMAL PAD Search Results

THERMAL PAD Result Highlights (5)

Part	Manufacturer	Description
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type
TCTH012BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function
TCTH012AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function

THERMAL PAD Price and Stock

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Wakefield-Vette CUSTOM THERMAL PAD Custom Thermal Pad 35Mm X 45Mm X1Mm Pn To Be Given Upon Po Rohs Compliant: Yes \|Wakefield Thermal CUSTOM THERMAL PAD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Newark	CUSTOM THERMAL PAD	Bulk			2,500	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Phoenix Contact VL2 THERMAL PAD: 9MM 2.5
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	VL2 THERMAL PAD: 9MM 2.5					1 $131.55 10 $110.22 100 $102.77 1000 $102.77 10000 $102.77	Buy Now
Master Electronics	VL2 THERMAL PAD: 9MM 2.5					1 $131.55 10 $110.22 100 $102.77 1000 $102.77 10000 $102.77	Buy Now
Phoenix Contact VL2 THERMAL PAD: 7MM 2.5
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Onlinecomponents.com	VL2 THERMAL PAD: 7MM 2.5					1 $131.55 10 $110.22 100 $102.77 1000 $102.77 10000 $102.77	Buy Now
Master Electronics	VL2 THERMAL PAD: 7MM 2.5					1 $131.55 10 $110.22 100 $102.77 1000 $102.77 10000 $102.77	Buy Now
Vicor Corporation 20264 MINI THERMAL PAD 10-PACK Thermal Interface Pad for Mini-Size DC to DC Modules 58.92mm x 55.88mm x 0.17mm (Alt: MMA02040C2873FB300)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Abacus	20264 MINI THERMAL PAD 10-PACK			30 Weeks	3,000	1 - 10 - 100 - 1000 - 10000 -	Buy Now
Vicor Corporation 20263 MAXI THERMAL PAD 10-PACK THERMMATE MAXI (10PC) (Alt: 20263)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Abacus	20263 MAXI THERMAL PAD 10-PACK			30 Weeks	1	1 - 10 - 100 - 1000 - 10000 -	Buy Now

Find more THERMAL PAD price and stock on Findchips.com

THERMAL PAD Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
VICOR 20263 Abstract: ThermMate VICOR 20265 ThermMate mini 16299 ThermMate maxi 16297 ThermMate micro VI-J00 20267 Text: Thermal Management ThermMate Thermal Pads 10 pieces per package For use with Vicor modules, ThermMate thermal pads are a “dry” alternative to thermal compound and are pre-cut to the outline dimensions of the module.* 20266 Thermal Pad Part No. VI-200 (10 pieces)	Original	PDF	VI-200 VI-J00 VICOR 20263 ThermMate VICOR 20265 ThermMate mini 16299 ThermMate maxi 16297 ThermMate micro VI-J00 20267
JTP 38 diode smd Abstract: p2w smd Transistor SMD SOT363 SC70 SC11 SC70-6 SO20 SSOP16 SSOP24 SC11 Thermal Considerations SOD61 Text: DISCRETE SEMICONDUCTORS General Section Module Thermal Considerations Module: THC00X Valid for: SC11 Thermal Considerations Power Diodes 1998 Dec 09 Philips Semiconductors Power Diodes Thermal Considerations THERMAL CONSIDERATIONS Thermal resistance junction	Original	PDF	THC00X OT404 JTP 38 diode smd p2w smd Transistor SMD SOT363 SC70 SC11 SC70-6 SO20 SSOP16 SSOP24 SC11 Thermal Considerations SOD61
D149 Abstract: D149 diode Interpoint HR300 TMP-002 TMP-003 TMP-004 TMP-005 7264 M Text: FEATURES * –60° to +180°C temperature rating • Provides thermal transfer for Interpoint converters • 0.2°C in2/W 129°C mm2/W thermal resistance • 4000 Vac breakdown voltage typical TMP THERMAL PAD ACCESSORY TMP THERMAL PAD TMP-004 TMP-001 MODEL	Original	PDF	TMP-004 TMP-001 TMP-002 HR300 TMP-003 MK200 TMP-005 D149 D149 diode Interpoint HR300 TMP-002 TMP-003 TMP-004 TMP-005 7264 M
D2240 Abstract: D257 E595 Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component	Original	PDF	A15955-00 D2240 D257 E595
APP4646 Abstract: MAX16815 PWM simulation matlab Text: Maxim > App Notes > Display Drivers Power-Supply Circuits Temperature Sensors and Thermal Management Keywords: Transient thermal behavior, IC thermal behavior, thermal-body model, RC network model, predict thermal behavior Feb 25, 2010 APPLICATION NOTE 4646	Original	PDF	MAX16815: MAX16828: com/an4646 AN4646, APP4646, Appnote4646, APP4646 MAX16815 PWM simulation matlab
Athlon 64 motherboard design guide Abstract: Thermal grease silicon thermal grease AMD Athlon 64 AMD xp datasheet amd Athlon xp mobile Athlon XP AMD ATHLON 64 X 2 soil "electrical conductivity" amd Athlon 64 processor data sheet Text: Thermal Interface Material Comparison: Thermal Pads vs. Thermal Grease Publication # 26951 Revision: 3.00 Issue Date: April 2004 2004 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced	Original	PDF
Untitled Abstract: No abstract text available Text: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /	Original	PDF	320-320mm D2240
Untitled Abstract: No abstract text available Text: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /	Original	PDF	320-320mm D2240
Untitled Abstract: No abstract text available Text: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /	Original	PDF	320-320mm D2240
Untitled Abstract: No abstract text available Text: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /	Original	PDF	320-320mm D2240
D149 Abstract: HR300 TMP-002 TMP-003 TMP-005 astm D149 Interpoint Text: Crane Aerospace & Electronics Power Solutions TMP Thermal Pad Accessory FEATURES • -60°C to +200°C temperature rating • Provides thermal transfer for Interpoint converters • 0.46°C in2/W 297°C mm2/W thermal impedance • 4000 VAC breakdown voltage typical	Original	PDF	TMP-007 TMP-001 TMP-003 TMP-002 HR300 TMP-005 D149 HR300 TMP-002 TMP-003 TMP-005 astm D149 Interpoint
APP3879 Abstract: MAX9704 MAX9741 MAX9742 MAX9744 MAX9768 CLASS D class d Audio amplifier 24v Highly Efficiency Audio Amplifier CLASS D amplifier Text: Maxim > App Notes > AUDIO CIRCUITS Keywords: class D, thermal, performance, heatsink, exposed, pad, TQFN Aug 16, 2006 APPLICATION NOTE 3879 Thermal Considerations for a Class D Amplifier Abstract: A Class D amplifier provides much better efficiency and thermal performance than a comparable	Original	PDF	MAX9704: MAX9741: MAX9742: MAX9744: MAX9768: AN3879, APP3879, Appnote3879, APP3879 MAX9704 MAX9741 MAX9742 MAX9744 MAX9768 CLASS D class d Audio amplifier 24v Highly Efficiency Audio Amplifier CLASS D amplifier
TMP-005 Abstract: TMP-003 c 129 transistor MPE SERIES D149 HR300 TMP-002 interpoint tmp007 Text: Crane Aerospace & Electronics Power Solutions TMP Thermal Pad Accessory FEATURES • –60° to +180°C temperature rating • Provides thermal transfer for Interpoint converters • 0.2°C in2/W 129°C mm2/W thermal resistance • 4000 Vac breakdown voltage typical	Original	PDF	TMP-007 TMP-001 TMP-003 TMP-002 HR300 TMP-005 TMP-005 TMP-003 c 129 transistor MPE SERIES D149 HR300 TMP-002 interpoint tmp007
QFN PACKAGE Junction to PCB thermal resistance Abstract: en5322 double sided pcb, thermal via EN5322QI J-STD-020A double sided pcb thermal Text: THERMAL NOTE EN5322QI DC-DC Converters September 2008 Thermal Characteristics The Enpirion EN5322QI DC-DC converter is packaged in 4x6x1.1mm, 24-pin QFN package. The QFN packages are constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for	Original	PDF	EN5322QI 24-pin QFN PACKAGE Junction to PCB thermal resistance en5322 double sided pcb, thermal via J-STD-020A double sided pcb thermal

FR4 epoxy pcb double sided Abstract: SA transistor thermal resistance of low power semiconductor Text: Philips Semiconductors Thermal considerations PowerMOS Transistors The elements of thermal resistance shown in Fig.2 are defined as follows: THERMAL CONSIDERATIONS Thermal resistance Circuit performance and long-term reliability are affected by the temperature of the transistor die. Normally, both are	Original	PDF	MBB446 MBB447 FR4 epoxy pcb double sided SA transistor thermal resistance of low power semiconductor
AN569 in Motorola Power Applications Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083 Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7	Original	PDF
"exposed pad" PCB via Abstract: "thermal via" thermal pcb guidelines AIC1573 copper thermal Text: Thermal Design Considerations of Exposed Pad IC As the miniaturization of electronic devices, the small area and close proximity of ICs in these modules demands small packages with excellent thermal properties. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design.	Original	PDF	im1573 "exposed pad" PCB via "thermal via" thermal pcb guidelines AIC1573 copper thermal
EN5336 Abstract: EN5366Q QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5365Q EN5335Q EN5365 J-STD-020A "thermal via" Text: THERMAL NOTE EN5365Q/EN5366Q DC-DC Converters ENPIRION Thermal Characteristics The Enpirion EN5365Q and EN5366Q DC-DC converters are packaged in 12x10x1.85mm 58-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal	Original	PDF	EN5365Q/EN5366Q EN5365Q EN5366Q 12x10x1 58-pin EN5336 QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE Junction to PCB thermal resistance EN5356 EN5335Q EN5365 J-STD-020A "thermal via"
D149 Abstract: D150 D2240 D257 D412 E595 Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These	Original	PDF
D149 Abstract: D150 D2240 D257 D412 E595 IPC-TM650 Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These	Original	PDF	A13512-00 T-FLEX600-0707 D149 D150 D2240 D257 D412 E595 IPC-TM650
SoftFlex Abstract: No abstract text available Text: DATASHEET SOFTFLEX GAP FILLER LIGHT FLEXIBLE THERMAL GAP FILLING PADS The Aavid SoftFlex series is our most flexible and diverse line of thermal conductive pads. The compressibility and adhesion features enable a dramatic reduction in thermal resistance when mounting. The unique flexibility of the SoftFlex base material provides	Original	PDF	400mm x8122 SoftFlex
k-952 TRANSISTOR Abstract: transistor RJp 30 Text: Thermal Management Considerations for Super Flux LEDs Application Note 1149-4 Table of Contents Introduction Importance of Thermal Management for High-Power LED Assemblies . 2 Thermal management is critical in	Original	PDF	5968-1214E 5968-4415E k-952 TRANSISTOR transistor RJp 30
CRYDOM ssr panel mount Abstract: phase separator Text: HSP Series Thermal Pads • Easy-to-use thermal interface Material designed for use with Standard Crydom single-phase and three-phase solid-state relays. • Excellent alternative to thermal grease HSP-1 For use with all single phase Panel mount SSR’s, Control modules and M50 power modules.	Original	PDF	53TP/53RV) 15dules. CRYDOM ssr panel mount phase separator
Loctite 3873 Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the	Original	PDF	AN-358-3 Loctite 3873 T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X

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THERMAL PAD Search Results

THERMAL PAD Result Highlights (5)

THERMAL PAD Price and Stock

Wakefield-Vette CUSTOM THERMAL PAD

Phoenix Contact VL2 THERMAL PAD: 9MM 2.5

Phoenix Contact VL2 THERMAL PAD: 7MM 2.5

Vicor Corporation 20264 MINI THERMAL PAD 10-PACK

Vicor Corporation 20263 MAXI THERMAL PAD 10-PACK

THERMAL PAD Datasheets Context Search

VICOR 20263

JTP 38 diode smd

D149

D2240

APP4646

Athlon 64 motherboard design guide

Untitled

Untitled

Untitled

Untitled

D149

APP3879

TMP-005

QFN PACKAGE Junction to PCB thermal resistance

FR4 epoxy pcb double sided

AN569 in Motorola Power Applications

"exposed pad" PCB via

EN5336

D149

D149

SoftFlex

k-952 TRANSISTOR

CRYDOM ssr panel mount

Loctite 3873