APP4646
Abstract: MAX16815 PWM simulation matlab
Text: Maxim > App Notes > Display Drivers Power-Supply Circuits Temperature Sensors and Thermal Management Keywords: Transient thermal behavior, IC thermal behavior, thermal-body model, RC network model, predict thermal behavior Feb 25, 2010 APPLICATION NOTE 4646
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MAX16815:
MAX16828:
com/an4646
AN4646,
APP4646,
Appnote4646,
APP4646
MAX16815
PWM simulation matlab
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Untitled
Abstract: No abstract text available
Text: AN11113 LFPAK MOSFET thermal design guide - Part 2 Rev. 2 — 16 November 2011 Application note Document information Info Content Keywords LFPAK, MOSFET, thermal analysis, design and performance, thermal considerations, thermal resistance, thermal vias, SMD, surface-mount,
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AN11113
AN10874)
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MAX1618
Abstract: No abstract text available
Text: The MAX1618 reduces CPU heat accumulation, improves performance, and protects CPUs against destructive thermal overloads—all in a space-saving 10-pin µMAX package. The MAX1618 eliminates the guesswork in compensating for thermal mass and thermal gradients,
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MAX1618
10-pin
MAX1618
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Untitled
Abstract: No abstract text available
Text: Thermal Emission Microscope R series Thermal Emission Microscope 5AHEAI The THEMOS series thermal emission microscope is a semiconductor failure analysis system that pinpoints failures by detecting thermal emissions generated within the semiconductor device. The increasing
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SE-164
SSMS0012E10
JAN/2013
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thermal printhead
Abstract: No abstract text available
Text: Printheads Near edge thermal printhead A thermal printhead is sometimes required to print on a flat plane without bending the print medium. For this requirement, other companies offer various types of thermal printheads including end face thermal printhead.
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AN569 in Motorola Power Applications
Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083
Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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Abstract: No abstract text available
Text: R R series Thermal Emission Microscope IAHEAI New High-sensitivity detector thermal detector InSb Motorized turret with objective lenses • Two objective lenses for analyzing thermal emissions • Three objective lenses for probing and laser scanning Thermal Emission Microscope
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B1201
SSMS0012E15
JUN/2015
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"Audio Power Amplifiers"
Abstract: darlington transistor for audio power application Germanium Power Diodes thermal resistance TO metal package aluminum kovar darlington power transistor power led heat sink
Text: PACKAGE INFORMATION THERMAL DESIGN FOR PLASTIC ICs THERMAL DESIGN FOR PLASTIC INTEGRATED CIRCUITS Proper thermal design is essential for reliable operation of many electronic circuits. Under severe thermal stress, leakage currents increase, materials decompose, and components drift in value or fail.
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AN628
Abstract: APP628 MAX1298 MAX1299
Text: Maxim > App Notes > Temperature sensors and thermal management Keywords: analog-to-digital converter, ADC, temperature sensor, temp sensor, thermally lumped system, thermal conductivity, thermal model, thermal resistance Oct 03, 2001 APPLICATION NOTE 628 Achieving high accuracy using MAX1298/MAX1299 temperature sensors
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MAX1298/MAX1299
MAX1298
12-Bit
com/an628
AN628,
APP628,
Appnote628,
AN628
APP628
MAX1299
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Untitled
Abstract: No abstract text available
Text: TflexTM HR400 Series Thermal Gap Filler Innovative Technology for a Connected World MID-PERFORMANCE GAP FILLER WITH 1.8 W/MK Tflex HR400 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR400
HR400â
A15958-00
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Untitled
Abstract: No abstract text available
Text: TflexTM HR200 Series Thermal Gap Filler Innovative Technology for a Connected World PRELIMINARY MID-PERFORMANCE GAP FILLER WITH 1.6 W/MK Tflex HR200 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR200
A16503-00
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A15999-00
Abstract: D2240 ASTM D5470 ASTM-D-257 HR610FG D257 E595 HR600 HR6120 HR-60
Text: Tflex HR600 Series TM Thermal Gap Filler Innovative Technology for a Connected World Mid-Performance Gap Filler with 3 W/mK Tflex HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.
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HR600
A15999-00
D2240
ASTM D5470
ASTM-D-257
HR610FG
D257
E595
HR6120
HR-60
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D2240
Abstract: D257 E595
Text: TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component
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A15955-00
D2240
D257
E595
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Loctite 3873
Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the
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AN-358-3
Loctite 3873
T-PCM905C
Loctite 3873 rework
TPCM585
T-pcm585
datasheet of Z40-12.7B heat sink
TPCM905C
of Z40-12.7B heat sink
Theta JC of FBGA
JESD51-X
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accelerometer endevco 63b
Abstract: Fluke 177 iepe circuit 65HT-10 ISOLATOR VIBRATION ati 9600 soil conductivity sensors datasheet piezoelectric contact accelerometer sensor piezoelectric contact accelerometer
Text: Thermal isolation of accelerometers TP 317 Thermal isolation of accelerometers Endevco Corporation’s Accelerometer Thermal Isolator ATI significantly extends the operating temperature range of Isotron accelerometers in certain applications. Constructed from a
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325-inch-thick,
65HT-10.
accelerometer endevco 63b
Fluke 177
iepe circuit
65HT-10
ISOLATOR VIBRATION
ati 9600
soil conductivity sensors datasheet
piezoelectric contact accelerometer sensor
piezoelectric contact accelerometer
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PF600-1
Abstract: MIL-A-8625
Text: PF600-1 Thermal Management Application Note AIR FLOW Thermal Management with the PF600-1 In this application note, you will find information on thermal management considerations for the PF600-1. Thermal Management with the PF600-1 Heatsink and Airflow Calculations
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PF600-1
PF600-1
PF600-1.
1005J/kgK,
01kg/s
150mm
MIL-A-8625
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hand movement based fan speed control
Abstract: No abstract text available
Text: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,
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CWT-125
CLWTC-1000
HP-97TM
hand movement based fan speed control
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GM50
Abstract: KF3006-GM50A thermal transfer printhead
Text: KF3006-GM50A Printhead Thick film thermal printhead with thermal historical control KF3006-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the conventional thick-film fast response thermal element.
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KF3006-GM50A
GM50
KF3006-GM50A
thermal transfer printhead
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GM50
Abstract: KF2002-GM50A
Text: KF2002-GM50A Printheads Thick film thermal printhead with thermal historical control KF2002-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the convertional thick-film fast response thermal element.
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KF2002-GM50A
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KF2002-GM50A
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thermal transfer printhead
Abstract: gm50 KF2003-GM50A
Text: KF2003-GM50A Printhead Thick film thermal printhead with thermal historical control KF2003-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the conventional thick-film fast response thermal element.
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KF2003-GM50A
thermal transfer printhead
gm50
KF2003-GM50A
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GM50
Abstract: KF2006-GM50A
Text: KF2006-GM50A Printhead Thick film thermal printhead with thermal historical control KF2006-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the conventional thick-film fast response thermal element.
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KF2006-GM50A
GM50
KF2006-GM50A
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GM50
Abstract: KF2004-GM50A GM-50
Text: KF2004-GM50A Printheads Thick film thermal printhead with thermal historical control KF2004-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the convertional thick-film fast response thermal element.
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KF2004-GM50A
GM50
KF2004-GM50A
GM-50
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thermal transfer printhead
Abstract: GM50 KF3004-GM50A
Text: KF3004-GM50A Printhead Thick film thermal printhead with thermal historical control KF3004-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the conventional thick-film fast response thermal element.
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KF3004-GM50A
thermal transfer printhead
GM50
KF3004-GM50A
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GM50
Abstract: KF3002-GM50A
Text: KF3002-GM50A Printheads Thick film thermal printhead with thermal historical control KF3002-GM50A GM50 series is the new product that newly added the future history control and driver LSI which has the function of thermal historical control, to GL50 series which is employing the convertional thick-film fast response thermal element.
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KF3002-GM50A
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