Power Semiconductor Applications Philips Semiconductors
Abstract: "Power Semiconductor Applications" Philips "CHAPTER 1 Introduction to Power Semiconductors" CHAPTER 1 Introduction to Power Semiconductors "static induction thyristor" varistor 503 static induction Thyristor TELEVISION EHT TRANSFORMERS 201 Static Induction Thyristor varistor 10c 471
Text: Thermal Management Power Semiconductor Applications Philips Semiconductors CHAPTER 7 Thermal Management 7.1 Thermal Considerations 553 Thermal Management Power Semiconductor Applications Philips Semiconductors Thermal Considerations 555 Thermal Management
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IGBT JUNCTION TEMPERATURE CALCULATION
Abstract: 0642
Text: APPLICATION NOTE Page 1 of 3 Thermal Impedance Models The thermal behavior of semiconductors can be described by two different models: Continued fraction model Tj Tcase The above shown model reflects the physical layer structure of a semiconductor – thermal capacitances with thermal resistances in
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Abstract: No abstract text available
Text: AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Rev. 1 — 11 July 2011 Application note Document information Info Content Keywords Low VCEsat, BISS, thermal resistance Rth , thermal impedance (Zth), total power dissipation (Ptot) Abstract
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AN11076
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Phase Change
Abstract: ultrastick phase-change AAVID THERMALLOY COMPOUND 250
Text: Aavid Ultrastick Phase-Change Thermal Interface Compound ULTRASTICK™ PHASE-CHANGE THERMAL INTERFACE COMPOUND Aavid’s Ultrastick™ is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, siliconefree, paraffin-based thermal compound changes phase at
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VICOR 20263
Abstract: ThermMate VICOR 20265 ThermMate mini 16299 ThermMate maxi 16297 ThermMate micro VI-J00 20267
Text: Thermal Management ThermMate Thermal Pads 10 pieces per package For use with Vicor modules, ThermMate thermal pads are a “dry” alternative to thermal compound and are pre-cut to the outline dimensions of the module.* 20266 Thermal Pad Part No. VI-200 (10 pieces)
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VI-200
VI-J00
VICOR 20263
ThermMate
VICOR 20265
ThermMate mini
16299
ThermMate maxi
16297
ThermMate micro
VI-J00
20267
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GaAs FET operating junction temperature
Abstract: 5257 transistor chip die hp transistor HP transistor cross reference mtt2
Text: High Frequency Transistor Primer Part III Thermal Properties Table of Contents I. I. Thermal Resistance Thermal Resistance . 1 A. Definition .
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ED-19,
5966-3084E
GaAs FET operating junction temperature
5257 transistor
chip die hp transistor
HP transistor cross reference
mtt2
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Untitled
Abstract: No abstract text available
Text: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
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320-320mm
D2240
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Abstract: No abstract text available
Text: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
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320-320mm
D2240
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Untitled
Abstract: No abstract text available
Text: PC93 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
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320-320mm
D2240
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crouzet 900
Abstract: No abstract text available
Text: pero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which
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Abstract: No abstract text available
Text: Li-2000A Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink
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Li-2000A
Li2000A
D5470
10psi
30psi
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Abstract: No abstract text available
Text: Li-2000 Thermal Tape on rolls Features Good adhesion Low contact thermal impedance High thermal conductivity High bond strength High temp-long term stability Electrically insulating Applications Electronic components: IC / CPU / MOS / LED / M/B / P/S / Heat Sink
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Li-2000
D5470
10psi
30psi
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The Effect of Forced Air Cooling on Heat Sink Thermal Ratings
Abstract: No abstract text available
Text: zpero 1 The Effect of Forced Air Cooling on Heat Sink Thermal Ratings By Paul Bachman, Fellow Engineer & Ronnie Haiduk, Applications Engineer, Crydom, Inc. ABSTRACT A heat sink’s ability to dissipate thermal energy is determined by its thermal impedance, which
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Abstract: No abstract text available
Text: PC94 Non-Silicone Thermal Conductive Pad Features Low contact thermal impedance Good thermal conductivity Silicone free Long term stability Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
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SO20-300
Abstract: QFP PACKAGE thermal resistance SO14-150 MBK360 SOT411 QFP-80-14 die bond diode handbook MBK368 QFP120
Text: CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting Rth j-a 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors for thermal resistance 6-4 Thermal resistance data - assumptions and precautions
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OT111-1
OT157-2
DBS13P
OT141-6
DBS17P
OT243-1
DBS23P
OT411-1
HSOP20
OT418-2
SO20-300
QFP PACKAGE thermal resistance
SO14-150
MBK360
SOT411
QFP-80-14
die bond
diode handbook
MBK368
QFP120
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D149
Abstract: HR300 TMP-002 TMP-003 TMP-005 astm D149 Interpoint
Text: Crane Aerospace & Electronics Power Solutions TMP Thermal Pad Accessory FEATURES • -60°C to +200°C temperature rating • Provides thermal transfer for Interpoint converters • 0.46°C in2/W 297°C mm2/W thermal impedance • 4000 VAC breakdown voltage typical
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TMP-007
TMP-001
TMP-003
TMP-002
HR300
TMP-005
D149
HR300
TMP-002
TMP-003
TMP-005
astm D149
Interpoint
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Untitled
Abstract: No abstract text available
Text: Hi-Flow 565UT Tacky, High Performance, Un-Reinforced Phase Change Thermal Interface Material Features and Benefits TYPICAL PROPERTIES OF HI-FLOW 565UT PROPERTY Color • Thermal impedance: 0.05°C-in2/W @25 psi • High thermal conductivity: 3.0 W/m-k
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565UT
D3418
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AN569 in Motorola Power Applications
Abstract: motorola mosfet BASIC THERMAL MANAGEMENT OF POWER SEMICONDUCTORS MTP15N06V equivalent dpak DIODE ANODE COMMON motorola ir 722c motorola Power Applications Manual mtv32 DV240 AN1083
Text: Thermal Compendium Table of Contents Abstracts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Basic Semiconductor Thermal Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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Abstract: No abstract text available
Text: Hi-Flow 565U High Performance, Unreinforced Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.04°C-in2/W @25 psi • Very high thermal conductivity: 3.5 W/m-K • 52°C phase change temperature • Unsupported TYPICAL PROPERTIES OF HI-FLOW 565U
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Loctite 3873
Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the
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AN-358-3
Loctite 3873
T-PCM905C
Loctite 3873 rework
TPCM585
T-pcm585
datasheet of Z40-12.7B heat sink
TPCM905C
of Z40-12.7B heat sink
Theta JC of FBGA
JESD51-X
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hot wire anemometer
Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
Text: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance
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Abstract: No abstract text available
Text: GT15 Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Electrically isolating Complies with UL standards
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Abstract: No abstract text available
Text: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs
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400psi)
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bs 280
Abstract: No abstract text available
Text: Thermal Considerations Overview Simplified thermal management is one of the benefits of using Vicor converters. High operating efficiency minimizes heat loss, and the low profile package features an easily accessible, electrically isolated thermal interface surface.
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VI-260-CV
MI-220-MY
bs 280
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