TF SOCKET Search Results

SMD F9

Contextual Info: A Sockets for TO . cases R 0,5 7,3 6,9 45° R 0,5 45° Ø 0,5 art. no. no. of contacts 3 Ø 0,5 art. no. TF 54 7,3 45° R 0,5 R 0,5 Ø 0,5 art. no. no. of contacts 6 no. of contacts 8 TF 58 18° 36° art. no. TF 510 7,3 Ø 7,11 6,9 R 0,5 R 0,5 Ø 0,5 no. of contacts

amphenol d sub CONNECTORS DATA SHEET

Contextual Info: Fiche E4/A TF 2/04/02 15:16 Page 2 TF D-Sub connectors - Stamped and Formed Contacts Materials and platings Shells Insulator Pin contact Socket contact Rear insert Boardlock Screwlock Steel, tin plated Glass-filled thermoplastic, UL 94V-0 Brass, selected gold in mating area ;

nuvoton

Abstract: intel i3 motherboard RSC-RR1U
Contextual Info: Contact Us Advanced Search Search Reseller Resource Center SuperServer 5016I-TF Products Systems 1U [ 5016I-TF ] Key Features Integrated Board 1. Intel Xeon® X3400 / L3400 series processors 2. Up to 32GB DDR3 1333/1066/800MHz ECC Registered DIMM / 16GB

63 7 transistor

Abstract: transistor sockets
Contextual Info: A Sockets for TO . cases Transistor sockets - teflon sockets for TO 5 B ∅ 10,3 Ø 10,3 7,3 7,3 36° 7,5 7,5 R 0,5 C 5,84 ∅ 0,63 Ø 0,5 art. no. TF 510 no. of contacts 10 D ∅ 10,3 Ø 10,3 7,3 7,3 36° 7,5 7,5 R 0,5 E 7,11 ∅ 0,63 Ø 0,5 art. no. TF 512

WPCM450

Abstract: W83527HG sddc
Contextual Info: Contact Us Advanced Search Search Reseller Resource Center SuperServer 6016GT-TF Products Systems 1U [ 6016GT-TF ] Key Features Integrated Boards 1. Intel Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s 2. Up to 192GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM / 48GB

FFC 0.7mm pitch

Contextual Info: TF Series Flexible Flat Cable, 0.50mm and 1.00mm Pitch Specifications Part Number Details Insulation Resistance: Conductor Resistance. TF 1,000MΩ min. at 500V DC C2 max. 300Ω / km C3 max. 850Ω / km C5 max. 940Ω / km C8 max. 430Ω / km Withstanding Voltage:

PWS-1K41P-1R

Abstract: W83527HG W83527 CSE-827T-1400B 932S421 SNK-P0037P SC827 E5500 x8dtt 93C46.SC827
Contextual Info: Contact Us Advanced Search Reseller Resource Center SuperServer 6026TT-TF Products Systems 2U [ 6026TT-TF ] Key Features 4 Integrated Boards Four systems nodes in a 2U form factor. Each node supports the following: 1. Intel Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s

RJ45 AMP

Abstract: uart 16550 bios chip AMI mg9072
Contextual Info: Contact Us Advanced Search Search Reseller Resource Center SuperServer 6036T-TF Products Systems 3U [ 6036T-TF ] Key Features Integrated Board 1. Intel Xeon® processor 5600/5500 series, with QPI up to 6.4 GT/s 2. Up to 192GB DDR3 1333/ 1066/ 800MHz ECC Registered DIMM / 48GB

1838 t

Abstract: 1838t IR 1838 T IR 1838 T datasheet D-10 IRGPH50MD2 c485
Contextual Info: IRGPH50MD2 90% Vge +Vge Same type device as D.U.T. Vce Ic 430µF 80% of Vce 90% Ic 10% Vce Ic D.U.T. 5% Ic td off tf Eoff = ∫ t1+5µS Vce ic dt t1 Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode) , trr, Qrr, Irr, td(on) , tr, td(off) , tf

D-10

Abstract: IRGPH50MD2 1838t
Contextual Info: IRGPH50MD2 90% Vge +Vge Same type device as D.U.T. Vce Ic 430µF 80% of Vce 90% Ic 10% Vce Ic D.U.T. 5% Ic td off tf Eoff = ∫ t1+5µS Vce ic dt t1 Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode) , trr, Qrr, Irr, td(on) , tr, td(off) , tf

Contextual Info: TF D-Sub connectors - Stamped and Formed Contacts Materials and platings Shells Insulator Pin contact Socket contact Rear insert Boardlock Scrowlock Steel, tin plated Glass-filled thermoplastic, UL 94V-0 Brass, selected gold in mating are8 ; 2.54pm 100p inches min. tin

l17TF

Contextual Info: TF D-Sub connectors - Stamped and Formed Contacts Shells Insulator Pin contact Socket contact Rear insert Boardlock Screwlock Steel, tin plated Glass-filled thermoplastic, UL 94V-0 Brass, selected gold in mating area; 2.54µm 100µ" min. tin on termination area over

Contextual Info: ^Fast Logic Digital Delay Units SERIES: DDU-tF ." ¿ " j; ? " ' “ '5 Features: • ■ ■ ■ ■ Auto-insertable. Low Cost. Com pletely interfaced fo rT T L . Low profile. Fits standard 8 pins DIP socket. Specifications: ■ ■ ■ ■ ■ ■ ■ ■

Contextual Info: 5V/3.3V 2.5Gbps VARIABLE OUTPUT SWING DIFFERENTIAL RECEIVER FEATURES SY100EP16VS DESCRIPTION • 3.3V and 5V power supply options ■ Fast output transitions <160ps tr / tf The SY100EP16VS are differential receivers with variable output swing. The devices are functionally

VCC880

Abstract: EP16VS variable resistor 100EP SY100EP16VS SY100EP16VSKI SY100EP16VSKITR SY10EP16V SY88927V EP16V
Contextual Info: 5V/3.3V 2.5Gbps VARIABLE OUTPUT SWING DIFFERENTIAL RECEIVER FEATURES SY100EP16VS FINAL DESCRIPTION • 3.3V and 5V power supply options ■ Fast output transitions <160ps tr / tf The SY100EP16VS are differential receivers with variable output swing. The devices are functionally

SY100ELT28

Abstract: SY100ELT28ZI SY100ELT28ZITR SY10ELT28 SY10ELT28ZI SY10ELT28ZITR
Contextual Info: 5V TTL-TO-DIFFERENTIAL PECL AND DIFFERENTIAL PECL-TO-TTL TRANSLATOR FEATURES SY10ELT28 SY100ELT28 FINAL DESCRIPTION • Guaranteed AC parameters over temperature: • fMAX > 160MHz TTL • < 5.5ns PECL-to-TTL propagation delay • < 1.5ns tr / tf; PECL output

Contextual Info: LABINAL/CINCH CONNECTORS # 25E ]>•$£■ 5 3 1 ^ 2 2 SUPERIBBON Miniature Ribbon Commercial All-Plastic .085" 2.16mm Density IDC Features Mechanical Characteristics • Insulation displacement terminations M ating/Unm ating Force: G000704 5 mA-N-tf

NDS-100

Abstract: NDP100-003-BF 77A0 1.27mm pitch connector 9735 h
Contextual Info: ND Series {Board-to-Board Connector Contact pitch 1.27mm - ND Series tf- Kto/li- «□*) 1.27mmpitch m sa Features • S§r?Jm i& lt M c T 'C y 7 ,SMT, SMT• ItM c T 'f

Contextual Info: 5V TTL-TO-DIFFERENTIAL PECL AND DIFFERENTIAL PECL-TO-TTL TRANSLATOR FEATURES SY10ELT28 SY100ELT28 DESCRIPTION • Guaranteed AC parameters over temperature: • fMAX > 160MHz TTL • < 5.5ns PECL-to-TTL propagation delay • < 1.5ns tr / tf; PECL output

SY55858UHGTR

Abstract: H321 SY55858U SY55858UHG SY55858UHI SY55858UHITR
Contextual Info: Micrel, Inc. 2.5V/3.3V 3.0GHZ DUAL 2 x 2 CML CROSSPOINT SWITCH W/INTERNAL TERMINATION SuperLite SY55858U SuperLite™ SY55858U FEATURES • Guaranteed AC parameters over temperature: • fMAX > 3.0GHz 3Gbps • tr/ tf < 120ps • Within-device skew < 25ps

marking code qa1

Abstract: SY55858U SY55858UHI SY55858UHITR
Contextual Info: 2.5V/3.3V 3.0GHZ DUAL 2 x 2 CML CROSSPOINT SWITCH W/INTERNAL TERMINATION Micrel SuperLite SuperLite™ SY55858U SY55858U FINAL FEATURES • Guaranteed AC parameters over temperature: • fMAX > 3.0GHz 3Gbps • tr/ tf < 120ps • Within-device skew < 25ps

Contextual Info: 2.5V/3.3V 1:10 DIFFERENTIAL LVPECL/LVECL/HSTL CLOCK DRIVER Precision Edge SY100EP111U FINAL FEATURES • 2.5V and 3.3V power supply options ■ Guaranteed AC parameters over temperature: • fMAX = 3GHz • < 25ps output-to-output skew • < 250ps tr / tf

EE 1605

Abstract: SY100EP111 SY100EP111U SY100EP111UTI SY100EP111UTITR XEP111U
Contextual Info: 2.5V/3.3V 1:10 DIFFERENTIAL LVPECL/LVECL/HSTL CLOCK DRIVER FEATURES DESCRIPTION • 2.5V and 3.3V power supply options ■ Guaranteed AC parameters over temperature: • fMAX = 3GHz • < 25ps output-to-output skew • < 320ps tr / tf • < 475ps propagation delay

SY100EP11U

Abstract: SY10EP11U
Contextual Info: 2.5V/3.3V/5V 1:2 DIFFERENTIAL PECL/LVPECL/ECL FANOUT BUFFER SY10EP11U SY100EP11U FINAL FEATURES • 2.5V, 3.3V and 5V power supply options ■ Guaranteed AC parameters over temperature: • fMAX > 3.0GHz • < 20ps output-to-output skew • < 200ps tr / tf