Untitled
Abstract: No abstract text available
Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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2XXX-1361-SX-3302
Abstract: TS-1361-04
Text: Test & Burn-In SPGA Socket • • • • Package for 1.27 mm .050" pitch PGA Zero insertion force Double mating contact Lever mechanism for opening and shutting switch over • Maximum grid 37x37 and lead count of 600 TS-1361-04 Sheet 1 of 3 Date Issued: June 20, 2001
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37x37
TS-1361-04
27x36
2XXX-1361-SX-3302
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pga 132 packaging
Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
Text: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar ranged 0.100 inch (2.54mm) center-to-center, In a
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l386TM
Intel386
132-pin
pga 132 packaging
55274-1
augat PGM
5527
Intel 386 DX
TEXTOOL PGA
TEXTOOL zif
AUGAT wire wrap
132 pin PGA socket
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LCS-68
Abstract: 821575-1 LCS-84 1-382320-7 821574-1
Text: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board
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SKs smd 69
Abstract: smd SKs Z KS78 HLS8 1.27mm pitch connector smd lcc 28 socket PGA 145 socket TEXTOOL PGA DECOUPLING CAPACITOR TEXTOOL
Text: ADVANCED INTERCONNECTIONS. Table of Contents 5 Energy Way, P.O. Box 1019, West Warwick, R[ 02893 USA Tel. 8 0 0 -4 2 4 -9 8 5 0 /4 0 1 -8 2 3 -5 2 0 0 Fax 401-823-8723 Email advintcorp@ aol.com • Internet http://ww w .advintcorp.com DIP Section pages 8 - 39
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NEC V20
Abstract: ARCHITECTURE OF 80186 PROCESSOR i486gx i386ex cables i386cx SQFP100 intel intel i386ex AKW186 AKW186-L
Text: Product Catalog 1/98 Development Tools for - 8086 Processors - 80186 Family Controllers - 386/486 Family Processors - Pentium Processors - MSP430 Mixed Signal Processors General Information This catalog gives an overview of the products offered by Hitex's x86 team. As for the prices,
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MSP430
EP186EX
EMXV50
MSP430x31x
MSP430x32x
MX430
MX430,
MSP430x33x
MX430P
MSP430
NEC V20
ARCHITECTURE OF 80186 PROCESSOR
i486gx
i386ex
cables
i386cx
SQFP100 intel
intel i386ex
AKW186
AKW186-L
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Yamaichi IC51-0444-1568
Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
Text: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production
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T12840
Abstract: STA132 TMS320C31 TMS320E15 TMS320E17 TMS320E25 tms320c3x instruction set
Text: I.S.I.T. Z.I. des Poumadres 32600 L'isle Jourdain France +33 62 07 29 54 Fax: (+33) 62 07 29 53 Compuserve: 100627,2421 Company Background Established near the technologic town of Toulouse in France (AERONAUTIC & SPATIAL CENTER), I.S.I.T. offers to design engineers both hardware and software development tool solutions for microcontroller and signal-processing applications. Moreover
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TMS320C31
50-MFLOPe.
STA132
STA132,
T12840
TMS320C31
TMS320E15
TMS320E17
TMS320E25
tms320c3x instruction set
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rtv 159
Abstract: textool socket TE zip socket rtv 157 TEXTOOL
Text: Table of Contents ADVANCED INTERCONNECTIONS 5 Energy Way, P.O. Box 1019, W est Warw ick, Rl 02893 • Tel. 4 0 1 -823-5200 • FAX 401-823-8723 D I P S e c t i o n Pages 8 through 43 Description Open Frame DIP Sockets . S e rie s . Page #
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IC51-2084-1052-11
Abstract: LCS-68-12 IC51-1004-814-2 IC51-0324-1498 QILE84P-410T LCS-84-12 IC51-1444-1354-7 CQFP 208 IC51-0444-1568 IC51-1604-845-4
Text: 1999年 1 月 ver. 3 イントロダク ション アルテラ・デバイス用 ソケットの選択方法 Application Note 80 表面実装用部品を使用するプリント基板（PCB）組立には従来とは異なる 手法が要求されます。まず、開発段階ではプリント基板のレイアウトに従来
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-AN-080-03/J
10Hz55Hz
70xyz
PCS-044A-1
PCS-068A-1
LCS-68-12
PCS-084A-1
IC51-2084-1052-11
LCS-68-12
IC51-1004-814-2
IC51-0324-1498
QILE84P-410T
LCS-84-12
IC51-1444-1354-7
CQFP 208
IC51-0444-1568
IC51-1604-845-4
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Untitled
Abstract: No abstract text available
Text: I_ M / I TEM B S ffiS /P A R T S tS /Q T Y NAME 1 S -> 7 7 Iy -S /T 0 P 2 7 5 A ^U -S /C A M P L A TE 3 ^ -X 7 Iy -S /B A S E 4 t l U \ s l \ — / CAM HANDLE 5 □ > - 9 < 7 S / CONTACT 6 T .?U a /S C R E W C # 0 -8 0U N F PLATE P L A TE « K & O ' f f i l l / MATERIAL & F I N I S H
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L94V-0
11X11
X-6311-9UA-1902
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Untitled
Abstract: No abstract text available
Text: I_ E/IT EM ffiffig/PART NAME 1 K '> 7 7 l y - K / T 0 P 2 t>U~7U— \^/ CAM PLATE aa/QTY MA TER IAL & F I N I S H 1 f i^ x A r n v x -T iiy iiy iy m / GLASS REINFORCED POLYETHERSULFONE PES COLOR sBLACK UL94 V-0 PLATE 1 3 A ;-X 7 Iy -K / B A S E 4 t > U W I\-/ C m
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0-80U
15X15
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BGA PACKAGE thermal profile
Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
Text: Ball Grid Array Packaging The Cost Effective, High Density EPLD Solution November 1993 White Paper Introduction profile than conventional PQFPs 1.9 mm versus 3.7 mm which makes the package ideal for high pin count portable applications. The ball grid array (BGA) package is the latest in a series
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XC73108.
BGA PACKAGE thermal profile
225-pin BGA
X3365
fine BGA thermal profile
XC73108
TEXTOOL zif
capacitance in BGA package
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744040
Abstract: scx6206 74589 744020 Flip-Flop 7471 744017 744017 counter sn 74373 scx6218 74395
Text: July 1985 SCX m icroC M O S G ate A rray Fam ily A pplication G uide TABLE OF CONTENTS 1.0 General Description . 2 2.0 Product Features. 2 Enhanced Product Features. . 2
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AA32096
744040
scx6206
74589
744020
Flip-Flop 7471
744017
744017 counter
sn 74373
scx6218
74395
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Untitled
Abstract: No abstract text available
Text: ANALOG DEVICES □ FEATURES 16-Bit Resolution Low Nonlinearity Differential: ±3/4LSB max Integral: ± 1LSB max Relative Accuracy: ±0.003% max Fast Full-Scale Settling: 6|xs to ±1/2LSB High Stability Monotonic to 16 Bits: +15°C to +35°C Offset TC: ±0.1ppm/°C max
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16-Bit
44-Pad
CS044-01TG
PPS044-3A0802-L
PAS-044-ZS-8
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44-pin plcc pcb mount footprint
Abstract: PIC16C71SO pic16c57 PCB Circuit 27C64SO PIC16C74P adaptor 32 pin dil to 32 pin plcc pic16c57 codes data programmers DIP PLCC Enplas PIC17C76X
Text: 7 Logic Analyzers and Accessories 7 Logic Analyzers and Accessories Logic Analyzers and Accessories Logic Analyzers and Accessories DS00104F-page 7-1 2001 Microchip Technology Inc. Logic Analyzers and Accessories Section 7 Logic Analyzers and Accessories
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PIC12CXXX,
PIC14C000,
PIC16CXXX
PIC17CXXX
28C64ASO
28C64AK
PIC16C55SW
W9711
44-pin plcc pcb mount footprint
PIC16C71SO
pic16c57 PCB Circuit
27C64SO
PIC16C74P
adaptor 32 pin dil to 32 pin plcc
pic16c57 codes
data programmers DIP PLCC
Enplas
PIC17C76X
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AD1145
Abstract: 74als990 AD1145AG LDIC NOTES 244-4961-00 44-PIN AD711 K110
Text: AN ALO G D E V IC E S □ FEATURES 16-Bit Resolution Low Nonlinearity Differential: ±3/4LSB max Integral: ± 1LSB max Relative Accuracy: ±0.003% max Fast Full-Scale Settling: 6|xs to ±1/2LSB High Stability Monotonic to 16 Bits: +15°C to -i-35°C Offset TC: ±0.1ppm/°C max
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16-Bit
AD1145
-i-35Â
44-Pad
AD1I45
74als990
AD1145AG
LDIC NOTES
244-4961-00
44-PIN
AD711
K110
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AK336
Abstract: TQFP240 68HC11E0 68hc001 68HC05B5 TQFP160 68hc11a0 Yamaichi TQFP144 68HC12 microcontroller M68HC08A
Text: Product Catalog 1/98 Development Tools for - Motorola M68HC05 - Motorola M68HC08 - Motorola M68HC11 - Motorola M68HC12 - Motorola M68xxx - Motorola CPU-32 General Information Contents This catalog gives an overview of the products General Information 2 Contents
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M68HC05
M68HC08
M68HC11
M68HC12
M68xxx
CPU-32
68HC05/08/11
AX6811
68HC05
68HC08
AK336
TQFP240
68HC11E0
68hc001
68HC05B5
TQFP160
68hc11a0
Yamaichi TQFP144
68HC12 microcontroller
M68HC08A
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siemens C166
Abstract: starter kit c167 ISA hitex rigel DZS167-M144-P ST10F166 HiCAN C166 CB167CR siemens C164 AP166
Text: Product Catalog 1/98 Development Tools for - Siemens C166 and Derivatives - SGS-Thomson ST10 General Information This catalog gives an overview of the products offered by Hitex's 166 team. As for the prices, please see the attached price list. All prices are
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AX166
AP167LV/AP167B
LX161
DProbe167
DProbe167
256KB
CB164P
PP166
siemens C166
starter kit c167 ISA hitex
rigel
DZS167-M144-P
ST10F166
HiCAN
C166
CB167CR
siemens C164
AP166
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bp-1200 operator manual
Abstract: CVASM16 RS232 STAG 200 interface palce programmer schematic 24cxx eeprom programmer schematic eeprom programmer schematic 24c02 MICROPROSS ROM 5000B graphical lcd MICROPROSS ROM 3000B Digital Weighing Scale using PIC microcontroller
Text: 3 Programmers 3 Programmers Section 3 Programmers 3 Programmers 3 Programmers 3 Programmers 2001 Microchip Technology Inc. DS00104F-page 3-1 DS00104F-page 3-2 2001 Microchip Technology Inc. 3 Abitec Products Programmers DATS and DATS-PG Features: 3
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DS00104F-page
PIC16C5X
PIC16C55
48-pin
bp-1200 operator manual
CVASM16
RS232 STAG 200 interface
palce programmer schematic
24cxx eeprom programmer schematic
eeprom programmer schematic 24c02
MICROPROSS ROM 5000B
graphical lcd
MICROPROSS ROM 3000B
Digital Weighing Scale using PIC microcontroller
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PR3000A
Abstract: No abstract text available
Text: PaceMips PR3400L CPU 32-BIT RISC PROCESSOR WITH FLOATING POINT ACCELERATOR X r- FEATURES registers to support single and double precision arithmetic. • Fully conforms to ANSI/IEEE Standard 7541985 "IE E E Standard for Binary Floating Point
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PR3400L
32-BIT
PR3000A)
256KBytes
PR3000A
145-pin
PR3010A)
64-bit
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footprint jedec MS-026 TQFP
Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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schematic impulse sealer
Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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JEDEC Package Code MS-026-AED
Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Text: • Packages and Thermal Characteristics November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or
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