TEST & BURN-IN SOCKETS Search Results

Contextual Info: Test- und Burn-In Socket Sockel m it A us werfei^/Verriegelungshebeln Test- und Burn-In Sockel Test- and Burn-In sockets Sockel mit Auswerfer-/Verriegelungshebeln Lock/Eject-DIP-sockets NEU He w - b — - r - EJCCTORaOCK LATCH

rf pogo pin

Abstract: 180C high current pogo pin
Contextual Info: SBT – Socket for Burn-in and Test Applications High Performance IC Sockets And Test Adaptors IP, June 2009 Problem Custom Burn-in and Standard Production Test Applications usually demand a spring probe solution • Custom Burn-in sockets are expensive • Need high cost tooling and long development time

Contextual Info: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Contextual Info: YAMAICHI Socket Test Probes DESCRIPTION SPECIFICATIONS • Socket test probes are used in conj unction with your board tester to ensure the reliability of your burn-in or test board prior to test or burn-in process. • Probe head material is natural Ultem, unless

dead bug

Abstract: wells Wells Electronics
Contextual Info: SOCKETS/SOCKET TOOLS WELLS ELECTRONICS Burn-in and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Flash Memory Tools Solution Program TSOP, PSOP, µBGA* packages and DIP Sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP

dead bug

Abstract: PSOP wells 28F001BX 28F002BC 28F002BX 28F010 28F020 28F200BX
Contextual Info: SOCKETS WELLS ELECTRONICS Burn-In and Test Sockets • ■ ■ ■ ■ ■ ■ ■ ■ ■ TSOP, PSOP & DIP sockets for test and burn-in High force, high reliability contacts Open top, compact design TSOP & PSOP Long life (10,000 cycles minimum) Live and dead bug insertion (TSOP)

Contextual Info: CSP/MicroBGA Test & Burn-In Socket FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required.

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.40mm or larger. • Pressure mounting, no soldering required.

1720G

Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to

Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.

micro pitch BGA

Contextual Info: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any device on 0.40mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides.

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.

Contextual Info: CSP/MicroBGA Test & Burn-In Socket for Devices Up to 13mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to

Contextual Info: CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square FEATURES • For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications • Any pitch device on 0.30mm pitch or higher • Socket is easily mounted and removed to & from the BIB due to solderless pressure

Contextual Info: CSP/µBGA Test & Burn-in Socket for Devices up to 40mm Square FEATURES • For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices • Any pitch device on 0.30mm or larger • 4-point crown insures “scrub” on solder oxides • Single Point Probes available for small land area contact pads

23019

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket for Devices Up to 40mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.40mm or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.

Contextual Info: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any device on 0.50mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.

Contextual Info: CSP/MicroBGA Test & Burn-In Socket FEATURES: AV AI LA B LE AT TH IS TI M E • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm pitch or higher. • Socket is easily mounted and removed to & from the BIB due to solderless pressure

Test & Burn In Sockets

Abstract: AXS-3215-02-01 abs07
Contextual Info: CRYSTAL TEST & BURN IN SOCKETSOCKET CRYSTAL/CRYSTAL OSCILLATOR AXS-3215-02-01 Precision test socket for 3.2x1.5mm Pb RoHS Compliant 2 pad crystal packages. | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices

Test & Burn In Sockets

Abstract: AXS-2520-04-09 ABM10 4 pin surface mount crystal oscillator
Contextual Info: CRYSTAL TEST & BURN IN SOCKETSOCKET CRYSTAL/CRYSTAL OSCILLATOR AXS-2520-04-09 Precision test socket for 2.5X2mm, 4 pad crystal packages. Pb RoHS Compliant | | | | | | | | | | | | | | | FEATURES: • Accurate and reliable testing of frequency control devices

656C1202211-001

Abstract: 656C1162211 656C1162211-001 656C1242211-001 656-1082211 656C1242211 R-535 C635 ZIF socket 478
Contextual Info: 59G- Ss3 WELD ELECTRONIC Burn-ln/Test Sockets Series 656 SSO P ZIF Socket • Open top, Zero Insertion Force design for automatic loading. • Compact size for high board density. • High reliability, pre-loaded contacts. • For burn-in applications up to 150°C.

Contextual Info: 3M " K Sockets • Sockets for computer chips • Test and burn-in sockets • Other production sockets 3M Electronic Specialty Markets http://www.mmm.com/esm 85