TERMINAL LAYER STACKING HEIGHT Search Results

Contextual Info: AXN 1/3/4 13mm 11,5mm Stacking height 3mm 3.5mm 4mm 4.5mm 5mm 5.5mm 6mm 6.5mm • • 16 20^ 22 24 26 30 34 — 40 50_ 60 _80 ^ • : • • • • — i • • _9cT~ _ J00 l Available FEATURES 1. A wide variety available, including 0.8mm pitch and ultra-low 3mm pro­

AXN450330

Abstract: YHP4328A
Contextual Info: AXN 1/3/4 NARROW-PITCH (0.8mm) CONNECTORS — P8 SERIES — NARROW-PITCH CONNECTORS FOR PC BOARDS 11.5mm Stacking height No. of contacts 16 20 22 24 26 30 34 40 50 60 80 90 100 ⅷ Available 5mm 7mm 4.5mm 6.5mm 3.5mm 5.5mm 3mm 4mm 6mm 8mm ⅷ ⅷ — ⅷ

Contextual Info: Catalog MCER41d 04/04 ERmet 2mm Hard Metric Connectors Product Features AB and DE Alignment Option features The IEC 61076-4-101 connector standard only provides for connector Types A, B, C, D, E, F, L, M and N. Many customers require a connector with the density of a Type B or a

Contextual Info: Product Features AB Alignment Option features The IEC 61076-4-101 connector standard only provides for connector Types A, B, C, D, E, F, L, M and N. Many customers require a connector with the density of a Type B (25 columns) and with the pre-alignment guide pins of the

megohmmeter 1620

Abstract: PES50 AXN316038P AXN316038S AXN320038S AXN416330P AXN416330S YHP4328A
Contextual Info: AXN 1/3/4 NARROW-PITCH (0.8mm) CONNECTORS - P 8 SER IES- NARROW-PiTCH CONNECTORS FOR PC BOARDS 11.5mm Stacking height 3.5mm 3mm I 4mm 4.5mm 5mm 5.5mm 6mm 6.5mm 7mm 13mm 8mm I 16 20 22 24 26 30 34 40 50 60 80 90 100 >Available FEATURES 1. A wide variety available, including

9-pin D type connector

Abstract: LINK86 fiber distribution hub
Contextual Info: USERS GUIDE OCTOBER 1997 Revision 1.0 LXD916/917 Reference Design Users Guide General Description The LXD916/917 Reference Designs are 10 Mbps Ethernet Hubs. All models are IEEE 802.3 10BASE-T compliant and are built for simple plug-in and go installation. This

Contextual Info: UNLE55 OTHERWISE NOTED REV. BG HMEN90N5 ARE IN INCHES TABLE LEAD STYLE T E R M IN A L ONE PLACE DECIMALS ±.1 [Z5mm] THREE PLACE DECIMALS ± .005 [,13mm] TWO PLACE DECIMALS ± .010 [.Z5nuii] FOUR PLACE DECIMALS ± 0020 [,05mm] 1 MAX "A ” "B ” IS .00 0 [ .0 0 ] MIN

Contextual Info: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and

Contextual Info: UNLESS OTHERWISE NOTED R E V IS IO N B U DO NOT SCALE FROM THIS PRINT DIMENSIONS ARE IN INCHES ONE PLACE DECIMALS ±.1 [25mm] THREE PLACE DECIMALS ± .005 [.13mm] TWO PLACE DECIMALS ± .010 [,Z5mni] FOUR PLACE DECIMALS ± 0020 [.05mm] TABLE 1 LEAD STYLE T E R M IN A L

Contextual Info: REVISION CA “ IN C * MOWS DO NOT SCALE FROM THIS PRINT TABLE 1 LEAD STYLE MAX "A” "B* IS .000 [.00] MIN TE R M IN A L T—1S13—02—XXX—2 .309 [7.85] .377 [9.6] -0 3 T—1S13—03—XXX—2 .467 [11.86] .535 [13.6] -0 4 T—1S13—06—XXX—2 .487 [12.37]

ceramic disc capacitor 100nf 104

Abstract: 470pf x5p 222 2kv 103 Ceramic Disc Capacitors N1500 N220 Ceramic or Polyester Capacitors N330 N4700 P100
Contextual Info: Disc Ceramic Capacitors Professional Ceramic Capacitors - Class I, II and III MIL-STD-202F The professional ceramic disc capacitors were specially developed for applications in severe environmental conditions, high humidity, temperature, gas, vapor and solvents.

Contextual Info: UNLESS OTHERWISE NOTED REV. AQ TABLE 1 LEAD STYLE DIMENSIONS ARE IN INCHES TERMINAL MAX ” A” "B ” IS .0 0 0 [ .0 0 ] MIN T— 1S13 — 0 2 — X— 2 .3 0 9 [7 .8 5 ] -0 3 T -1 S 1 3 - 0 3 - X - 2 .4 6 7 [1 1 .8 6 ] -0 4 T— 1S13 — 0 6 — X— 2

76751

Abstract: Tyco 3-1827253-6 1307819 Tyco Electronics IDC 26 pin ribbon B-21 7120 intel 945 MOTHERBOARD SERVICE MANUAL tyco crimp height chart 3-6318491-6 5177984 0.5mm 20 pin fpc connector
Contextual Info: Fine Pitch SMT Stacking Connectors Parallel Board-to-Board TE Connectivity Catalog 889092 Revised 4-12 0.4mm Fine Stack Connectors (Pages 7 thru 11) 0.5mm Fine Stack Connectors (Pages 13 thru 16) 0.5mm Fine Mate Connectors (Pages 13 and 16 thru 18) 0.5mm Free Height (FH)

Contextual Info: R E V IS IO N bT DO NO T SCALE FROM THIS PRINT T TA B LE 1 LEAD STYLE ONE PLACE OECIMALS ± .1 [23mm] THREE PLACE DECIMALS ± .005 [.13mm] ANGLES TWO PLACE DECIMALS ± M [.25m] FOUR PLACE DECIMALS ± -0020 [.OSnvn] ± “cM TERMINAL MAX "A" "B " IS .000 [.0 0 ] MIN

Contextual Info: R E V IS IO N BZ DO NO T SCALE FROM THIS PRINT ONE PLACE OECIMALS ± .1 [23mm] THREE PLACE DECIMALS ± .005 [.13mm] ANGLES ' TWO PLACE DECIMALS ± [35m] FOUR PLACE DECIMALS ± -0020 [.OSnvn] ± M TA B LE 1 LEAD STYLE MAX "A" MB" IS .000 [.0 0 ] MIN TE R M IN AL

Contextual Info: I I REVISION CL TWO PLACE DECIMALS I DO NOT SCALE FROM THIS PRINT s • I ONE PLACE DECIMALS ± .1 [2.5mm] THREE PLACE DECIMALS ± .006 [.13mm] ± M [J im ] FOUR PLACE DECIMALS ± -0020 [.05mm] ANGLES ±2 DWG NO: HIGH TEMP 2MM SMT BOARD STACKING TERMINAL TW-XX-XX-XXX-X-XXX-SM-XXX-XX

PT-TW001-D-SM

Contextual Info: R E V IS IO N C F DHM OMM KHHOO DO N O T S C A LE FROM TH IS P R IN T IM E B o i m n HOIED KXEMMCE9 AIKS ONE PLACE DECIMALS ±.1 [25mm]THREE PLACE DECIMALS ± .005 [.13nm] ANGLES TWO PLACE DECIMALS ± .#0 [J S m ] FOUR PLACE DECIMALS ± 0020 [.05mm] ± 2 HIGH TEMP

stacked transistor shunt switch

Abstract: stacked transistors SOI RF Peregrine 2000 stacked diplexer and duplexer for GSM and DCS ultra high frequency FETs or transistors SOI series shunt stacked FETs soi stacked FETs circulator s band switching circulator
Contextual Info: 18| www.wirelessdesignmag.com COVER STORY| Integrating UltraCMOS Designs in GSM Front Ends G L O S S A RY O F A C R O N Y M S ASM - Antenna switch module BVDSS - Breakdown voltage drain-to-source, gate shorted CDMA - Code-division multiple access CMOS - Complimentary metal oxide semiconductor

Contextual Info: cc I DO NOT SCALE FROM THIS PRINT DVlC NO: HIGH TEMP 2MM SMT BOARD ONE PLACE DECIMALS ± .1 [Urn] THREE PLACE DECIMALS ± .006 [.IJmm ANGLES STACKING TERMINAL 1W-XX-XX-XXX-X-XXX-SM-XXX-XX TWO PLACE DECIMALS ± J* [Jta] FOUR PLACE DEOUALS ± .MW [48mm] ± 2 '

220V ac to 48V dc

Abstract: 7 Segment Displays finger print sensor pcb with circuit cables military switch military resistors catalog molex* polycarbonate laser Treadmill treadmill controller ipass connector
Contextual Info: Printed Circuit Products Copper Flex Products. R-2 to R-4 Printer Circuit and Electromechanical Assemblies. R-5 to R-6

Contextual Info: Tantalum Stack Polymer Surface Mount Capacitors Tantalum Stack Polymer TSP Series Overview The KEMET Tantalum Stack Polymer (TSP) Series is designed to provide the highest capacitance/voltage ratings in surface mount configuration. KEMET's T540 Polymer COTS capacitors

Contextual Info: R E V IS IO N CH ONE PLACE DECIMALS ±.1 [ISrnn] THREE PLACE DECIMALS ± .005 [.13mm] ANGLES ° TWO PLACE DECIMALS ± AO[Am ] FOUR PLACE DECIMALS ± -0020 [,05mm] ± 2 DO N O T SC ALE F R O M T H IS P R IN T HIGH TEMP 2MM SMT BOARD STACKING TERMINAL STRIP ASM

RJ2361

Contextual Info: Imaging CMOS CAMERA MODULES ROAD MAP ☆New product ★ Under development • CMOS Camera Modules Road Map Image format ~ 2013 2014 2015 ★RJ63EC200 ★RJ63GC900 21M 1/2.8 type 0.56 cc Built-in high-speed auto focus function 9.5 x 9.5 x 6.15 1/2.4 type 0.94 cc

Contextual Info: F-205-1 S u rfa c e SM T M ount BOARD STACKER HW SERIES Mates with: LEAD P IP L A T IN G P I ROW S T Y L E U OPTION U O P T IO N NO. PINS PER ROW SSW, SSQ, ESW, ESQ, CES, SLW, BSW, BCS, SSM, IDSS, IDSD, HLE SPECIFICATIONS = Single Row For complete specifications