TEPRO TM Search Results

diode DS1

Abstract: embedded firmware TranSwitch TXC-06830 TEPRO
Contextual Info: TEPro TM Product Brief Complete single-chip channelized DS3 solution The TEPro can be configured to support a variety of modes of operation, which allows for design flexibility. TEPro supports a combination of unframed DS1/E1, transmission DS1/E1 and H.100/H.110 bus or MVIP interfaces on the

intel 7882

Abstract: Tepro Technology TE 2395 motorola 431an TXC-06830 431and
Contextual Info: TEPro Device Channelized DS3 Access Solution TXC-06830 DATA SHEET PRODUCT PREVIEW LINE SIDE DS1/E1 Monitor Port 4 DS1/E1/DS3 interface, 145 TEPro™ TXC-06830 is a RISC processor-based device that supports the requirements of next-generation channelized DS3 access

tepro TM 50

Abstract: TM250
Contextual Info: TEPRO TYPE “TM” ELECTRO TECHNIK DIMENSIONS Inches mm TEPRO TYPE A ±.062 B C ±.010 ±.031 D E F ±.010 ±.062 ±.062 G ±.062 H ±.031 J ±.031 K L ±.005 ±.031 M ±.062 N ±.031 P Q ±.005 .AWG. TM 5 1.12 (28.5) .490 (12.4) .078 (1.98) TM 10 1.37

Dart Controls

Abstract: GUIDE INSTALLATION rbs 2111
Contextual Info: TEPro Device Channelized DS3 Access Solution TXC-06830 DATA SHEET PRODUCT PREVIEW LINE SIDE DS1/E1 Monitor Port 4 DS1/E1/DS3 interface, LIU control & Indication TEPro™ TXC-06830 is a system-on-chip (SoC) device that supports the requirements of next-generation channelized DS3 access

Contextual Info: TENN-R TEPRO TYPE "TM" ELECTRO TECHNIK HIGH VOLTAGE METAL ALLOY RESISTORS FEATURES: High voltage: to 15KV High temperature: to +350°C Tolerance: ±2%, ±5%, ±10%, ±20% Special testing, data packages available High temperature silicone coating available

tepro TM 50

Abstract: TM-250
Contextual Info: TEPRO TYPE "TM" PRECISION POWER WIREWOUND ALUMINUM HOUSED, CHASSIS MOUNT RESISTORS FEATURES Chassis mount for heat sink effect Silcone protected windings Miniature size Non-inductive windings High stability Optimum power to size ratio Higher ambients Withstand severe environments

tepro TM 50

Abstract: TM250 MIL-R-18546 MIL-R-39009 tepro TM TEPRO TM50
Contextual Info: TEPRO TYPE "RE" / "TM" ELECTRO TECHNIK PRECISION POWER WIREWOUND ALUMINUM HOUSED, CHASSIS MOUNT RESISTORS MIL-R-18546 APPROVED FEATURES: Chassis mount for heat sink effect Silicone protected windings Miniature size Noninductive windings High stability Optimum power to size ratio

High Heat Transfer

Abstract: MIL-R-18546C tepro TM 50
Contextual Info: TEPRO TYPE “TMG” ELECTRO TECHNIK ALUMINUM HOUSED, HIGH HEAT TRANSFER CORES FEATURES: Molded construction High purity cores for optimum heat dissipation Even heat distribution curve Extremely high stability at conventional power ratings DERATING CURVE VARIATIONS:

chasis L 03.1

Contextual Info: TEPRO •>A ' M EUX TYPE "TMG' BO TEC -frJIK ALUMINUM HOUSED HIGH HEAT TRANSFER CORE TYPE "TMG" ALU M INUM HOUSED - HIGH HEAT TRANSFER CORES FEATURES Molded construction Exceeds MIL - R - 18546 C, MIL - R - 39009 High purity cores for optimum heat dissipation

motorola te 2395

Abstract: DART
Contextual Info: TEPro Device Channelized DS3 Access Solution TXC-06830 DATA SHEET • Complete single-chip channelized DS3 solution • RISC processor with royalty-free DD-AMPS™ firmware Drivers, Data link, Alarms, Messaging, Performance/configuration objects, and Signaling

15KV

Abstract: tepro TM
Contextual Info: TENN-R TEPRO TYPE “TM” ELECTRO TECHNIK HIGH VOLTAGE METAL ALLOY RESISTORS FEATURES: High voltage: to 15KV High temperature: to +350°C Tolerance: ±2%, ±5%, ±10%, ±20% Special testing, data packages available High temperature silicone coating available

Contextual Info: TEPro Device Channelized DS3 Access Solution TXC-06830 DATA SHEET • Complete single-chip channelized DS3 solution • RISC processor with royalty-free DD-AMPS™ firmware Drivers, Data link, Alarms, Messaging, Performance/configuration objects, and Signaling

TMK-50

Abstract: tepro tmk TMK-100 tepro tepro type s TMKR50 TMKA-50
Contextual Info: TEPRO TYPE “TMK” ELECTRO TECHNIK ALUMINUM HOUSED KELVIN 4 TERMINAL FEATURES: Chassis mount for heat sink effect 10 to 100 watt ratings Very low resistance For sensing and control Silicone protected windings High stability DERATING: DERATING CURVE Special TC on request

tepro TM 50

Abstract: TM100 TM-250 MIL-R-18546 tepro TM
Contextual Info: TEPRO TYPE “TM” ELECTRO TECHNIK PRECISION POWER WIREWOUND ALUMINUM HOUSED, CHASSIS MOUNT RESISTORS FEATURES: Chassis mount for heat sink effect Epoxy protected windings Miniature size Noninductive windings High stability Optimum power to size ratio Higher ambients

1N128

Abstract: 54016
Contextual Info: TEPro-Fx28 Device Channelized DS1/E1 Access Solution TXC-06836 DATA SHEET PRODUCT PREVIEW • Complete single-chip channelized DS1/E1 solution • RISC processor with royalty-free DD-AMPS™ firmware Drivers, Data link, Alarms, Messaging, Performance/configuration objects, and Signaling

TM 937

Abstract: tepro tepro tmk tepro TM 50 TMK-100 406 J tepro type s
Contextual Info: TEPRO TYPE "TMK" li â t E L IiC TYPE "TMK" ALUMINUM HOUSED KELVIN 4 TERMINAL n O TEC Power rating: Based on: a full power operation at 25 °C (b) 1% maximum A R in 1000-hour load life (c) maximum hotspot 275 °C (d) mounting on proper heat sink Recommended heat sink:

tdmoip

Abstract: TXC-05870 N058 MPLS transwitch packettrunk 20/MPLS
Contextual Info: TXC-05870 PacketTrunk TM -4 Single-Chip TDMoIP/MPLS Gateway Solution KEY BENEFITS Your First-Class Choice for Transporting TDM over IP, MPLS, and Switched Ethernet Networks Efficient voice and data delivery over IP/MPLS PacketTrunk -4 is a TDMoIP/MPLS gateway device that transparently transports TDM trunks over

Contextual Info: TYPE "TMG" ELECTRO TECHNIK TYPE "TMG" A L U M IN U M HOUSED, H IG H HEAT TRANSFER CORES FEATURES: Molded construction Exceeds MIL - R - 18546 C, MIL - R - 39009 High purity cores for optimum heat dissipation Even heat distribution curve Exlremely high stability at conventional power ratings

Contextual Info: T Y P E "R E " / "T M " ELECTRO TE C H N IK PRECISION POWER W IR E W O U N D ALU M IN U M HOUSED, CHASSIS M O U N T RESISTORS MIL-R-18546 APPROVED FEATURES: V AR IATIO N S: Chassis mount for heat sink effect Silcone protected windings Miniature size Non-inductive windings

Contextual Info: T Y P E "T M K E L E C T R O T E C H N IK TYPE "TMK" A LUM INUM HOUSED KELVIN 4 TERMINAL Power rating: Based on: a full power operation at 25 °C (b) 1% maximum A R in 1000-hour load life FEATURES: Chassis mounts for heat sink effect 10 to 100 watt ratings

mepco capacitor

Abstract: MEPCO mepco RESISTOR RCL 7010 DALE SOMC1603 toko rcl Toko inductor RCL somc1603 RC02HP pr01 piher
Contextual Info: Cross Reference - RCD Components Vendor RCD part# Description MIL TYPE ALLEN BRADLEY: 706A CL061 Conformal coated SIP networks CL-C-FA032 ALLEN BRADLEY: 706B CL062 Conformal coated SIP networks CL-C-FA032 ALLEN BRADLEY: 706E CL063 Conformal coated SIP networks

Contextual Info: T Y P E "T M " TAPPED DUAL TYPES ALUMINUM HOUSED, CHASSIS M O U N T SINGLE - ENDED, "DUAL", MULTI - TAPPED W INDINGS FEATURES: Chassis mounts or heat sink effect 1 or 2 laps, single - ended, dual windings High - temperature silicone protection Optimum heat distribution

ethernet over sdh

Abstract: GPON SoC EPON ONU EPON SoC processor cross reference stm 16 mapper VTXP-6 voip ethernet single chip etherphast-48pt STM-1
Contextual Info: PRODUCT REFERENCE GUIDE Optical Transport • Carrier Ethernet • Broadband Access Optical Transport Carrier Ethernet and VoIP Transceivers Controllers Apollo STM-1 / 4 / 16 SDH Transceiver - Digita / Optical Cross-Connect and Section Repeater Envoy-2GE Dual Gigabit Ethernet Controller with SPI3 / POS-PHY L2 interfaces

processor cross reference

Abstract: Atlanta-70 entropia voip ethernet single chip Mustang ONU stm 16 mapper ethernet over pdh IEEE1588v2 VTXP-6 VOIP PROCESSORS
Contextual Info: PRODUCT REFERENCE GUIDE Optical Transport • Carrier Ethernet • Broadband Access Optical Transport Carrier Ethernet and VoIP Transceivers Controllers Apollo STM-1 / 4 / 16 SDH Transceiver - Digita / Optical Cross-Connect and Section Repeater Envoy-2GE Dual Gigabit Ethernet Controller with SPI3 / POS-PHY L2 interfaces