Technical DS56
Abstract: DS56 JESD22 PH01 PM01 PR01
Text: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per
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LUXEON Rebel Cyan Green LED
Abstract: ph01 LUXEON Rebel LED DS56 IEC825 JESD22 PM01 PR01 LED rebel PWN1
Text: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per
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LUXEON Rebel LED
Abstract: LUXEON Rebel Cyan Green LED Technical Datasheet DS56 Aluminum Base 3 LED emitters PCB luxeon Rebel PC Amber pulse 0030 DS56 IEC825 JESD22 PH01
Text: Technical Datasheet DS56 power light source LUXEON Rebel Introduction LUXEON® Rebel is an ultra compact, surface mount, high power LED that delivers elevated standards for light output, flux density and manufacturability. Offering industry leading flux density, lumens per
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DFM1200FXS12-A000
Abstract: DFM1200FXS12-A fast recovery diode 600v 1200A mj 13005
Text: DFM1200FXS12-A000 Fast Recovery Diode Module Replaces DS5645-1.1 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop DS5845-2 April 2010 LN26743 KEY PARAMETERS VRRM VF IF IFM 1200V 1.9V 1200A 2400A (typ) (max) (max) Isolated Cu Base with Al2O3 Substrates
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DFM1200FXS12-A000
DS5645-1
DS5845-2
LN26743)
DFM1200FXS12-A000
DFM1200FXS12-A
fast recovery diode 600v 1200A
mj 13005
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Untitled
Abstract: No abstract text available
Text: DFM1200FXS12-A000 Fast Recovery Diode Module Replaces DS5645-1.1 FEATURES Low Reverse Recovery Charge High Switching Speed Low Forward Volt Drop DS5845-2 April 2010 LN26743 KEY PARAMETERS VRRM VF IF IFM 1200V 1.9V 1200A 2400A (typ) (max) (max) Isolated Cu Base with Al2O3 Substrates
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DFM1200FXS12-A000
DS5645-1
DS5845-2
LN26743)
DFM1200FXS12-A000
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DFM1200FXS12-A000
Abstract: No abstract text available
Text: DFM1200FXS12-A000 Fast Recovery Diode Module DS5645-1.1 June 2007 LN25322 FEATURES • Low Reverse Recovery Charge • High Switching Speed • Low Forward Voltage Drop • Isolated Copper Base plate • Dual Diodes Can be paralleled for 2400A Rating •
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DFM1200FXS12-A000
DS5645-1
LN25322)
DFM1200FXS12-A000
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Untitled
Abstract: No abstract text available
Text: MT92220 Carrier Class VoIP Processor Advance Datasheet DS5659 Introduction ISSUE 1 December 2001 Features The MT92220 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets or AAL2 cells, according to the H.225 and I.363.2 standards. The device
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MT92220
DS5659
MT92220
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LAN switch with HDLC
Abstract: hdlc mii to hdlc MT92210 MT92220 RFC1889 RFC768
Text: MT92220 Carrier Class VoIP Processor Advance Datasheet DS5659 Introduction ISSUE 1 December 2001 Features The MT92220 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets or AAL2 cells, according to the H.225 and I.363.2 standards. The device
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MT92220
DS5659
MT92220
LAN switch with HDLC
hdlc
mii to hdlc
MT92210
RFC1889
RFC768
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Untitled
Abstract: No abstract text available
Text: DIM600DCM17-A000 IGBT Chopper Module DS5607- 4.1 March 2007 FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated AlSiC Baseplate with AIN substrate High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat * (typ) IC (max) IC(PK) (max)
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DIM600DCM17-A000
DS5607-
LN25194)
DIM600DCM17-A000
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DIM600DCS17-A000
Abstract: No abstract text available
Text: DIM600DCS17-A000 IGBT Chopper Module DS5607- 2.1 March 2006 FEATURES • 10µs Short Circuit Withstand • Non Punch Through Silicon • Isolated Copper Baseplate • Lead Free construction KEY PARAMETERS VCES VCE sat * (typ) IC (max) IC(PK) (max) (LN24484)
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DIM600DCS17-A000
DS5607-
LN24484)
DIM600DCS17-A000
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dynex igbt 1200v
Abstract: DIM400WHS17-A000
Text: DIM400WHS17-A000 Half Bridge IGBT Module DS5690-1.3 July 2007 LN25359 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand KEY PARAMETERS VCES VCE (sat) (typ) IC (max) IC(PK) (max) 1700V 2.7 V 400A 800A Lead Free construction
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DIM400WHS17-A000
DS5690-1
LN25359)
DIM400WHS17-A000
dynex igbt 1200v
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mii to hdlc
Abstract: MT92210 LAN switch with HDLC
Text: MT92210 Carrier Class VoIP Processor Advance Datasheet DS5660 Introduction ISSUE 1.0 December 2001 Features The MT92210 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets and back, according to the H.225 standard. The device communicates via
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MT92210
DS5660
MT92210
16-bit
mii to hdlc
LAN switch with HDLC
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Untitled
Abstract: No abstract text available
Text: MT92210 Carrier Class VoIP Processor Advance Datasheet DS5660 Introduction ISSUE 1.0 December 2001 Features The MT92210 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets and back, according to the H.225 standard. The device communicates via
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MT92210
DS5660
MT92210
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DIM200WLS17-A000
Abstract: 12v AC to DC CIRCUIT DIAGRAM transistor 9009
Text: DIM200WLS17-A000 Chopper Module - Lower Arm Control DS5698-1.2 July 2007 LN25358 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) 1700V
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DIM200WLS17-A000
DS5698-1
LN25358)
DIM200WLS17-A000
12v AC to DC CIRCUIT DIAGRAM
transistor 9009
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DIM200WKS17-A000
Abstract: transistor 9009
Text: DIM200WKS17-A000 Chopper Module - Upper Arm Control DS5699-1.2 July 2007 LN25361 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK) (max) 1700V
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DIM200WKS17-A000
DS5699-1
LN25361)
DIM200WKS17-A000
transistor 9009
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DIM400BSS12-A000
Abstract: No abstract text available
Text: DIM400BSS12-A000 Single Switch IGBT Module DS5672-4.1 June 2007 LN25349 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1200V 2.2 V 400A 800A *(Measured at the power bus-bars and not the auxiliary
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DIM400BSS12-A000
DS5672-4
LN25349)
DIM400BSS12-A000
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DIM600BBS17-A000
Abstract: No abstract text available
Text: DIM600BBS17-A000 Single Switch IGBT Module DS5692-1.3.0 June 2007 LN25344 FEATURES • 10 s Short Circuit Withstand • Non Punch Through Silicon • Isolated Copper Baseplate KEY PARAMETERS VCES (typ) VCE (sat) * IC (max) IC(PK) (max) 1200V 1.7 V 600A
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DIM600BBS17-A000
DS5692-1
LN25344)
DIM600BBS17-A000
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DIM400BSS17-A000
Abstract: No abstract text available
Text: DIM400BSS17-A000 Single Switch IGBT Module DS5674-2.3 June 2007 LN25344 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1700V 2.7 V 400A 800A *(Measured at the power bus-bars and not the auxiliary
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DIM400BSS17-A000
DS5674-2
LN25344)
DIM400BSS17-A000
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DIM600BSS17-A000
Abstract: No abstract text available
Text: DIM600BSS17-A000 Single Switch IGBT Module DS5692-1.4.0 September 2007 LN25581 FEATURES 10 s Short Circuit Withstand Non Punch Through Silicon Isolated Copper Baseplate KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK) (max) 1700V 2.7 V 600A 1200A *(Measured at the power bus-bars and not the auxiliary
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DIM600BSS17-A000
DS5692-1
LN25581)
DIM600BSS17-A000
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DIM200PHM33-F000
Abstract: ge traction motor DS5606-1
Text: DIM200PHM33-F000 DIM200PHM33-F000 Half Bridge IGBT Module Preliminary Information DS5606-1.2 June 2003 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability APPLICATIONS
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DIM200PHM33-F000
DS5606-1
DIM200PHM33-F000
ge traction motor
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DIM200WLS12-A000
Abstract: No abstract text available
Text: DIM200WLS12-A000 IGBT Chopper Module – Lower Arm Control DS5697-3.1 July 2007 LN25356 FEATURES Non Punch Through Silicon Isolated Copper Baseplate 10 s Short Circuit Withstand Lead Free construction KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK)
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DIM200WLS12-A000
DS5697-3
LN25356)
DIM200WLS12-A000
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DIM400GCM33-A000
Abstract: No abstract text available
Text: DIM400GCM33-A000 DIM400GCM33-A000 IGBT Chopper Module DS5613-1.1 June 2003 FEATURES • Non Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES VCE sat *
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DIM400GCM33-A000
DS5613-1
DIM400GCM33-A000
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DIM1200DDM17-E000
Abstract: 5200A
Text: DIM1200DDM17-E000 Preliminary Information DIM1200DDM17-E000 Dual Switch IGBT Module Preliminary Information DS5603-1.4 June 2003 FEATURES • Trench Gate Field Stop Technology ■ Low Conduction Losses ■ Low Switching Losses KEY PARAMETERS VCES typ VCE(sat) *
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DIM1200DDM17-E000
DS5603-1
DIM1200DDM17-E000
5200A
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LAN switch with HDLC
Abstract: No abstract text available
Text: MT92220 Carrier Class VoP Processor Data Sheet DS5659 Introduction ISSUE 1 December 2001 Features The MT92220 is an assembly and disassembly engine that can convert up to 1023 full-duplex TDM voice channels to IP packets or AAL2 cells, according to the H.225 and I.363.2 standards. The device
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MT92220
MT92220
MT92include
LAN switch with HDLC
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