Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TANAKA WIRE Search Results

    TANAKA WIRE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MP-5XRJ11PPXS-014 Amphenol Cables on Demand Amphenol MP-5XRJ11PPXS-014 Flat Silver Satin Modular Crossed wiring Cable, RJ11 / RJ11 14ft Datasheet
    MP-64RJ4528GB-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GB-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Blue 3ft Datasheet
    MP-64RJ4528GG-014 Amphenol Cables on Demand Amphenol MP-64RJ4528GG-014 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Green 14ft Datasheet
    MP-64RJ4528GR-007 Amphenol Cables on Demand Amphenol MP-64RJ4528GR-007 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Red 7ft Datasheet
    MP-64RJ4528GY-003 Amphenol Cables on Demand Amphenol MP-64RJ4528GY-003 Slim Category-6 (Thin CAT6) UTP 28-AWG Network Patch Cable (550-MHz) with Snagless RJ45 Connectors - Yellow 3ft Datasheet

    TANAKA WIRE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    tanaka gold wire

    Abstract: tanaka wire tanaka bonding wire tanaka GPG wire tanaka wire 15 mils tanaka EN-4088Z SN74LS244 SN74LS244DW
    Text: TEXAS INSTRUMENTS Qualification Notification of the Change from 0.95 mil Conventional Gold Bonding Wire to 0.80 mil Tanaka GPG Gold Alloy Bonding Wire for SLL Product June 23, 1997 Abstract Texas Instruments Standard Linear and Logic Products SLL has qualified the 0.80 mil Tanaka GPG


    Original     		PDF S01-06486 S01-06563 tanaka gold wire tanaka wire tanaka bonding wire tanaka GPG wire tanaka wire 15 mils tanaka EN-4088Z SN74LS244 SN74LS244DW

    flying robot with camera

    Abstract: Flying robot with wireless camera piezo gyro MEMS gyro sensor flying robot Piezoelectric mems accelerometer mobile control robot mems mems sensor for car robot with camera and sensor
    Text: An industrial and applied review of new MEMS devices features Masako Tanaka Epson Toyocom Corporation, Ina Plant, Development Department, Development & Design Management Division 8548, Minowa-machi, Kamiina-gun, Nagano 399-4696 Japan Tel +81-266-79-2216 Fax +81-265-79-0046


    Original     		PDF

    Connector

    Abstract: No abstract text available
    Text: Dear Customers Date: 22 February, 2013 Certification of Non- inclusion Company name: OMRON SANYO Co.,Ltd. Department: Quality and Environmental Management Section Title: Manager Name: Yasushi Tanaka Signature: We hereby certify that to the best of Omron’s knowledge, our products and components below


    Original     		PDF XN2B-1430 XY3A-9605 YO-QE-130222-HK-1A 5-41A 5-31A 45-31AE XF3E-9045-31AE Connector

    Untitled

    Abstract: No abstract text available
    Text: New Core Alignment Fusion Splicer Yoshiaki Tanaka,1 Yoshinori Iwashita,1 Hiroaki Kamitani,1 and Ataru Takahashi1 The number of telecom infrastructure construction has still been on the increase in developing countries. Fusion splicing is a high-reliability method for high-quality optical fiber connection.


    Original     		PDF

    tanaka wire

    Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL


    Original     		PDF G9911-05 KMC184 KMC184VA EME-6730 EME-9730 Mil-Std-883, tanaka wire MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 tanaka wire 10 mils

    ph44

    Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark


    Original     		PDF G9911-04 Mil-Std-883, S-7390) S-7383 ph44 Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025

    AC-7088

    Abstract: tanaka AL wire ELF-4C6 42-10a C850-6 4210a tanaka wire T-1001 C-850-6 hl-011mg
    Text: EVERLIGHT ELECTRONICS CO.,LTD. Device Number : DDF-4C6-071 REV: 1.0 Page: 1/6 0.39" Quadruple Digit Displays ELF-4C6-1GWB PART NO. : ECN : █ Features : █ Applications: ● Industrial standard size. ● Audio equipment ● Low power consumption. ● Instrument panels


    Original     		PDF DDF-4C6-071 Emitt-4C6-071 T-1001 LT-010OG HL-011MG OS-4210A OS-4210B AC-7088 C-850-6 25mil AC-7088 tanaka AL wire ELF-4C6 42-10a C850-6 4210a tanaka wire T-1001 C-850-6 hl-011mg

    T3007

    Abstract: T3007-20 EVERLIGHT LED PART NUMBER LIST tanaka epoxy tanaka tanaka wire bond for LED RH95 epifine
    Text: EVERLIGHT ELECTRONICS CO.,LTD. DATA SHEET SHARP PART NO. : PART NO. ： DATE ： DEPARTMENT： RH-PX0105SEZZ 333EC/F45-54 2001/6/19 CHR&D1 . REVISION ： 2 RECEIVED • MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NUMBER : PAGE : 5 CUSTOMER 2


    Original     		PDF RH-PX0105SEZZ 333EC/F45-54 CDLE-033-796 LT-010OG 25mil T3007-20 T3007 T3007-20 EVERLIGHT LED PART NUMBER LIST tanaka epoxy tanaka tanaka wire bond for LED RH95 epifine

    tanaka TS3332LD epoxy

    Abstract: tanaka TS3332LD tanaka epoxy dm6030hk CMM-2-BD-000X CMM-2-BD tanaka gold wire tanaka gold wire data sheet TS3332LD DM6030HK-Pt
    Text: 2.0-10.0 GHz GaAs MMIC Amplifier CMM-2-BD August 2007 - Rev 06-Aug-07 CMM-2-BD 2.0 to 10.0 GHz GaAs MMIC Amplifier Mimix CMM-2-BD GaAs MMIC Amplifier 10 Mimix Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com


    Original     		PDF 06-Aug-07 CMM-2-BD-000X tanaka TS3332LD epoxy tanaka TS3332LD tanaka epoxy dm6030hk CMM-2-BD-000X CMM-2-BD tanaka gold wire tanaka gold wire data sheet TS3332LD DM6030HK-Pt

    tanaka TS3332LD

    Abstract: XP1032-BD-EV1 tanaka TS3332LD epoxy DM6030HK XP1032-BD
    Text: 32.0-36.0 GHz GaAs MMIC Power Amplifier P1032-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 2W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +32.5 dBm P1dB Compression Point +33.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing


    Original     		PDF 12-May-08 P1032-BD MIL-STD-883 parD-000V XP1032-BD-EV1 XP1032-BD tanaka TS3332LD XP1032-BD-EV1 tanaka TS3332LD epoxy DM6030HK

    tanaka gold wire

    Abstract: tanaka TS3332LD epoxy XP1056-BD XP1056-BD-EV1 XP1056-BD-000V tanaka TS3332LD
    Text: 34.5-38.0 GHz GaAs MMIC Power Amplifier P1056-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram High Efficiency Power Amplifier >35% PAE 13 dB Small Signal Gain +25.0 dBm P1dB Compression Point +26.0 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing


    Original     		PDF 12-May-08 P1056-BD MIL-STD-883 bD-000V XP1056-BD-EV1 XP1056-BD tanaka gold wire tanaka TS3332LD epoxy XP1056-BD-EV1 XP1056-BD-000V tanaka TS3332LD

    XP1054-BD

    Abstract: XP1054-BD-000V XP1054-BD-EV1 DM6030HK tanaka TS3332LD
    Text: 33.0-36.0 GHz GaAs MMIC Power Amplifier P1054-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 3W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +33.5 dBm P1dB Compression Point +34.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing


    Original     		PDF 12-May-08 P1054-BD MIL-STD-883 parD-000V XP1054-BD-EV1 XP1054-BD XP1054-BD-000V XP1054-BD-EV1 DM6030HK tanaka TS3332LD

    Untitled

    Abstract: No abstract text available
    Text: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD May 2008 - Rev 28-May-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power


    Original     		PDF 28-May-08 P1057-BD MIL-STD-883 surfaD-000V XP1057-BD-EV1 XP1057-BD

    tanaka gold wire

    Abstract: tanaka wire XP1057-BD DM6030HK tanaka TS3332LD tanaka TS3332LD epoxy
    Text: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 18 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power


    Original     		PDF 12-May-08 P1057-BD MIL-STD-883 surfaD-000V XP1057-BD-EV1 XP1057-BD tanaka gold wire tanaka wire DM6030HK tanaka TS3332LD tanaka TS3332LD epoxy

    tanaka TS3332LD

    Abstract: TS3332LD
    Text: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD October 2008 - Rev 16-Oct-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power


    Original     		PDF 16-Oct-08 P1057-BD MIL-STD-883 sD-000V XP1057-BD-EV1 XP1057-BD tanaka TS3332LD TS3332LD

    tanaka TS3332LD

    Abstract: tanaka TS3332LD epoxy DM6030HK-Pt tanaka gold wire tanaka aluminum wire DM6030HK TS3332LD
    Text: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1070-BD September 2008 - Rev 28-Sep-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power


    Original     		PDF 28-Sep-08 P1070-BD MIL-STD-883 chD-000V XP1070-BD-EV1 XP1070-BD tanaka TS3332LD tanaka TS3332LD epoxy DM6030HK-Pt tanaka gold wire tanaka aluminum wire DM6030HK TS3332LD

    XP1055-BD

    Abstract: tanaka TS3332LD epoxy
    Text: 34.0-36.0 GHz GaAs MMIC Power Amplifier P1055-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 2W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +32.5 dBm P1dB Compression Point +33.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing


    Original     		PDF 12-May-08 P1055-BD MIL-STD-883 parD-000V XP1055-BD-EV1 XP1055-BD tanaka TS3332LD epoxy

    tanaka TS3332LD

    Abstract: tanaka TS3332LD epoxy XP1059 XP1059-BD-000V DM6030HK-Pt tanaka gold wire TS3332LD XP1059-BD-EV1 tanaka gold wire current tanaka wire
    Text: 13.5-15.0 GHz GaAs MMIC Power Amplifier P1059-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 28.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power +38.0 dBm Pulsed Saturated Output Power


    Original     		PDF 12-May-08 P1059-BD MIL-STD-883 passivatiD-000V XP1059-BD-EV1 XP1059-BD tanaka TS3332LD tanaka TS3332LD epoxy XP1059 XP1059-BD-000V DM6030HK-Pt tanaka gold wire TS3332LD XP1059-BD-EV1 tanaka gold wire current tanaka wire

    tanaka wire

    Abstract: dm6030hk tanaka epoxy
    Text: 14.0-16.0 GHz GaAs MMIC Power Amplifier P1058-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 27.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power +38.0 dBm Pulsed Saturated Output Power


    Original     		PDF 12-May-08 P1058-BD MIL-STD-883 passivatiD-000V XP1058-BD-EV1 XP1058-BD tanaka wire dm6030hk tanaka epoxy

    XP1071-BD-000V

    Abstract: tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
    Text: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1071-BD September 2008 - Rev 28-Sep-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 27.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power


    Original     		PDF 28-Sep-08 P1071-BD MIL-STD-883 surfaD-000V XP1071-BD-EV1 XP1071-BD XP1071-BD-000V tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy

    20N3

    Abstract: tanaka wire
    Text: DWG. NO. DO NOT SCALE DRAWING SD-55340-0 Z 3 EC NO. DRWN: CH'K: APPR: REVISED EC NQID200I-II02 DRWN; M TANAKA '01/02/15 CH 'K: MSASAO '01/ 02/15 APPR: H IK E S U G 1 '01/ 02/15 REVISED • - JD90523 EC NO, DRWN: M TANAKA '98/ 10/13 CH'K: MSASAO '98/10/13 APPRs


    OCR Scan     		PDF SD-55340-0 NQID200I-II02 JD90523 90I36 EN-02JI097) MXJ-54 20N3 tanaka wire

    Untitled

    Abstract: No abstract text available
    Text: 7678E0PS onimvhq PITC H ( ’ON (2 ^1" ID CM xi NOTE 1. THE QUANTITY OF 7,000 PIECES AND PART NUMBER M31S07K4FB ARE MARKED IN THE PACKING LABEL INDICATED AT THE REEL BOARD. D O F —0 —2 1 2 0 ( 9 8 . 0 2 ) 2. THE WIRE TO BE USED IS A STRANDED WIRE OF 0.22mm SQUARE


    OCR Scan     		PDF 7678E0PS M31S07K4FB S07K4FB M31S07K4FB

    SJ035503

    Abstract: 200B JN1-22-22S-PK0100
    Text: %-n a JK & DON DATE REV. * NO. K & & 2 10.A p r . 2001 479G4 ADDED NOT E 1 . 3 4.J u n . 200 3 52239 ADDED ITEM 059590 REVISED APPLICABLE CONTACTS. E.MATSUMOTO M.NITTA 1. 8 5» M APPD. S.NANAO M.MAJ IME E.MATSUMOTO S.NANAO 1 . 6 L T A M AX ±0 . 5 1 1 . 6 5


    OCR Scan     		PDF 479S4 JN1-22-20S-R-PKG100 JN1-22-22S-PK0100 AvJAHL-51 JN1-22-2 -PKG100 SJ035503 SJ035503 200B

    Untitled

    Abstract: No abstract text available
    Text: 999S 'ON E 0PS ONlM vaa -è-#M E! WH I T E MARKI NG AS INDICATED 'ap&'/i; J N 1 D S 0 4 F A ^POLARIZING K E Y POS I TI ON ( N 0 T E 4 ) NO MARK : N OR MA L P O S I T I O N X M AX MB : T POSITION 11 : J - l H ' SCREW 5 2 (£4) ( MODIFICATION NUMBER( N O T E B )


    OCR Scan     		PDF SJ0B5649 SJ035666