TANAKA EPOXY Search Results

tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD TS3332LD tanaka epoxy remix capacitors Die Attach epoxy stamping tanaka free circuit diagram of rf id Broadband Amplifiers Application Notes, appendix 3 Thermal Epoxy
Contextual Info: Epoxy Die Attach Considerations for HPA MMICs 1 Scope MMICs have been traditionally mounted on a RF circuit board, or directly to a plated metal carrier, using a wide range of conductive epoxies, or eutectic solder (e.g. AuGe, AuSn). Eutectic and epoxy has been used in both

ph44

Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark

AC-7088

Abstract: tanaka AL wire ELF-4C6 42-10a C850-6 4210a tanaka wire T-1001 C-850-6 hl-011mg
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Device Number : DDF-4C6-071 REV: 1.0 Page: 1/6 0.39" Quadruple Digit Displays ELF-4C6-1GWB PART NO. : ECN : █ Features : █ Applications: ● Industrial standard size. ● Audio equipment ● Low power consumption. ● Instrument panels

T3007

Abstract: T3007-20 EVERLIGHT LED PART NUMBER LIST tanaka epoxy tanaka tanaka wire bond for LED RH95 epifine
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. DATA SHEET SHARP PART NO. : PART NO. ： DATE ： DEPARTMENT： RH-PX0105SEZZ 333EC/F45-54 2001/6/19 CHR&D1 . REVISION ： 2 RECEIVED • MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NUMBER : PAGE : 5 CUSTOMER 2

TK15430V

Contextual Info: TK15430V Electrical Specification 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Table of Contents Purpose TOKO Part Number Functions Applications Structure Package Outline Absolute Maximum Ratings Electrical Characteristics Test Circuit Block Diagram Pin Assignment

tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD tanaka epoxy dm6030hk CMM-2-BD-000X CMM-2-BD tanaka gold wire tanaka gold wire data sheet TS3332LD DM6030HK-Pt
Contextual Info: 2.0-10.0 GHz GaAs MMIC Amplifier CMM-2-BD August 2007 - Rev 06-Aug-07 CMM-2-BD 2.0 to 10.0 GHz GaAs MMIC Amplifier Mimix CMM-2-BD GaAs MMIC Amplifier 10 Mimix Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

tanaka TS3332LD

Abstract: XP1032-BD-EV1 tanaka TS3332LD epoxy DM6030HK XP1032-BD
Contextual Info: 32.0-36.0 GHz GaAs MMIC Power Amplifier P1032-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 2W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +32.5 dBm P1dB Compression Point +33.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing

tanaka gold wire

Abstract: tanaka TS3332LD epoxy XP1056-BD XP1056-BD-EV1 XP1056-BD-000V tanaka TS3332LD
Contextual Info: 34.5-38.0 GHz GaAs MMIC Power Amplifier P1056-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram High Efficiency Power Amplifier >35% PAE 13 dB Small Signal Gain +25.0 dBm P1dB Compression Point +26.0 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing

XP1054-BD

Abstract: XP1054-BD-000V XP1054-BD-EV1 DM6030HK tanaka TS3332LD
Contextual Info: 33.0-36.0 GHz GaAs MMIC Power Amplifier P1054-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 3W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +33.5 dBm P1dB Compression Point +34.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing

Contextual Info: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD May 2008 - Rev 28-May-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka gold wire

Abstract: tanaka wire XP1057-BD DM6030HK tanaka TS3332LD tanaka TS3332LD epoxy
Contextual Info: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 18 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka gold wire

Abstract: tanaka au wire DM6030HK tanaka TS3332LD
Contextual Info: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1070-BD October 2008 - Rev 16-Oct-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka TS3332LD

Abstract: TS3332LD
Contextual Info: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD October 2008 - Rev 16-Oct-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka TS3332LD

Abstract: tanaka TS3332LD epoxy DM6030HK-Pt tanaka gold wire tanaka aluminum wire DM6030HK TS3332LD
Contextual Info: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1070-BD September 2008 - Rev 28-Sep-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka TS3332LD

Abstract: tanaka TS3332LD epoxy XP1059 XP1059-BD-000V DM6030HK-Pt tanaka gold wire TS3332LD XP1059-BD-EV1 tanaka gold wire current tanaka wire
Contextual Info: 13.5-15.0 GHz GaAs MMIC Power Amplifier P1059-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 28.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power +38.0 dBm Pulsed Saturated Output Power

tanaka wire

Abstract: dm6030hk tanaka epoxy
Contextual Info: 14.0-16.0 GHz GaAs MMIC Power Amplifier P1058-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 27.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power +38.0 dBm Pulsed Saturated Output Power

XP1071-BD-000V

Abstract: tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
Contextual Info: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1071-BD September 2008 - Rev 28-Sep-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 27.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power

tanaka gold wire 1.0 mil

Abstract: tanaka wire DM6030HK tanaka epoxy CMM-5-BD-000X TS3332LD Mimix Broadband tanaka au wire tanaka material safety tanaka bonding wire
Contextual Info: 2.0-6.0 GHz GaAs MMIC Amplifier CMM-5-BD January 2007 - Rev 15-Jan-07 Features Chip Diagram High Gain: 16.5 dB 18 dBm P1dB Small Size: 39x40 mils Directly Cascadable Self-Biased Single Power Supply General Description Mimix Broadband's CMM-5 is a 2 to 6 GHz GaAs MMIC

tanaka bonding wire

Contextual Info: 2.0-6.0 GHz GaAs MMIC Amplifier CMM-5-BD January 2007 - Rev 15-Jan-07 Features Chip Diagram High Gain: 16.5 dB 18 dBm P1dB Small Size: 39x40 mils Directly Cascadable Self-Biased Single Power Supply General Description Mimix Broadband's CMM-5 is a 2 to 6 GHz GaAs MMIC

0118-B

Abstract: 0118b tanaka gold wire 1.0 mil ts333 tanaka TS3332LD tanaka CSW0118-BD DM6030HK TS3332LD DM6030HK-Pt
Contextual Info: 0.5-18 GHz GaAs pHEMT MMIC SPDT Switch CSW0118-BD January 2007 - Rev 22-Jan-07 Features Chip Diagram Broadband Coverage: 0.5 to 18.0 GHz Insertion Loss: 1.8 dB Typ. @ 10 GHz Isolation: 35 dB P1dB: +20 dBm, Typical Current Consumption: 50 µA, Typ. with Control Voltage of -7.0V, 0.0V

0118-B

Abstract: 0118B tanaka gold wire 1.0 mil CSW0118-BD DM6030HK TS3332LD tanaka epoxy
Contextual Info: 0.5-18 GHz GaAs pHEMT MMIC SPDT Switch CSW0118-BD January 2007 - Rev 22-Jan-07 Features Chip Diagram Broadband Coverage: 0.5 to 18.0 GHz Insertion Loss: 1.8 dB Typ. @ 10 GHz Isolation: 35 dB P1dB: +20 dBm, Typical Current Consumption: 50 µA, Typ. with Control Voltage of -7.0V, 0.0V

Contextual Info: 13.5-17.0/27.0-34.0 GHz GaAs MMIC Active Doubler X1007-BD February 2008 - Rev 13-Feb-08 Features Integrated Gain, Doubler and Driver Stages Self-biased Architecture +21.0 dBm Output Saturated Power 40.0 dBc Fundamental Suppression On-Chip ESD Protection 100% On-Wafer RF, DC and Output Power Testing

XX1007-BD

Abstract: tanaka TS3332LD DM6030HK TS3332LD XX1007-BD-000V XX1007-BD-EV1 tanaka epoxy
Contextual Info: 13.5-17.0/27.0-34.0 GHz GaAs MMIC Active Doubler X1007-BD August 2007 - Rev 29-Aug-07 Features Integrated Gain, Doubler and Driver Stages Self-biased Architecture +21.0 dBm Output Saturated Power 40.0 dBc Fundamental Suppression On-Chip ESD Protection 100% On-Wafer RF, DC and Output Power Testing

tanaka gold wire current

Abstract: DM6030HK TS3332LD XX1007-BD XX1007-BD-000V XX1007-BD-EV1 tanaka
Contextual Info: 13.5-17.0/27.0-34.0 GHz GaAs MMIC Active Doubler X1007-BD January 2009 - Rev 14-Jan-09 Features Integrated Gain, Doubler and Driver Stages Self-biased Architecture +21.0 dBm Output Saturated Power 40.0 dBc Fundamental Suppression On-Chip ESD Protection 100% On-Wafer RF, DC and Output Power Testing