STENCIL LAYOUT Search Results

Contextual Info: RECOMMENDED P.C. BOARD LAYOUT ROR INl/INL STANDARD MERSIO REV. A 0.1400 0.0770(PLATED THRU HOLE * FOR STENCIL * FOR BOARD .0020 [.04] —— SOLDER LOCKS CARD LENGTH - .085 0.2000 40" 0 . 1100 - MISC\MKTG\FOOTPRNT (PLATED THRU HOLE) * FOR STENCIL * INLSTAND ARD

Contextual Info: Philips Semiconductors Video Transistors and Modules for Monitors General MOUNTING AND SOLDERING Stencilling Mounting methods In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste that is deposited on the

stencil tension

Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
Contextual Info: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning

JESD30E

Abstract: JESD-30 QFN footprint AN1152 PQFN footprint AN-1152
Contextual Info: Application Note AN-1152 Dual 5x6 Power QFN Technology Inspection and Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 2

IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM micro solder ball AN-1112 WLCSP stencil design BGA and CSP
Contextual Info: National Semiconductor Application Note 1112 March 2002 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning

PQFN footprint

Abstract: IRFH7911PbF PQFN AN-1154 JESD-30 JESD30E
Contextual Info: Application Note AN-1154 Power QFN Technology Footprint / Stencil Recommendation Application Note By Behnia Barzegarian Table of Contents Page Inspection Techniques . 3 Examples of Proper Mounting . 3

TEXAS INSTRUMENTS, Mold Compound QFN

Abstract: SLUA271 SLOA122 dsp layout guidelines QFN PACKAGE thermal resistance
Contextual Info: Application Report SLOA122 – July 2006 QFN Layout Guidelines Yang Boon Quek . HPL Audio Power Amplifiers 1 Introduction Board layout and stencil information for most Texas Instruments TI Quad Flat No-Lead (QFN) devices is

3SD4-90

Contextual Info: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-90 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces

BGA-3000

Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
Contextual Info: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste

s2083

Abstract: PQFN IPC-SM-782 MO-220
Contextual Info: Surface Mount Instructions for PQFN Packages S2083 V6 Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil

Contextual Info: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-145 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces

surge arrester Ac

Abstract: MARKING L2E
Contextual Info: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-200 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces

Contextual Info: Surface Mount Package Information The following pages contain information about ON Semiconductor’s Surface Mount Pacakages including: • Mimium Recommended Footprint • Power Dissipation • Soldering Precautions • Solder Stencil Guidelines • Typical Solder Heating Profile

Sankosha USA

Contextual Info: Surface Mount Gas Tube Surge Arrester Part Number: 3SD4-230 Units: mm 7.2 4.4 1.2 0.6 2.9 2.9 4.4 φ 3.8 0.6 Recommended Pad Layout 4.5 2.4 4.8 8.4 Applications: 150µm 0.006" Stencil Recommended Transient Voltage Surge Suppression Telephone Network Interfaces

Contextual Info: 8 7 THIS DRAWING IS UNPUBLISHED. RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. W-C COPYRIGHT - 6 - D C TYP RECOMMENDED PCB LAYOUT B A RECOMMENDED PCB LAYOUT LOR USE WITH .008 THICK STENCIL AMP 4805 REV 31MAR2000 5 f 4 3 2 1

IR 423f

Abstract: 30392 stencil Layout AV01-0210EN stencil MGA-635T6 JEDEC SMT reflow profile solder powder a/IR 423f
Contextual Info: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an economical ,easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach

QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Contextual Info: Optimum PCB and Stencil Layout for WirelessUSB QFN Package Introduction When designing a system board using the WirelessUSB™ LS/LR QFN chip for wireless product applications, there are several important factors to consider. It is advised to pay critical attention to PCB design and assembly aspects when

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. A REF B SPACES 2.54 : [.100 ] D 4.88 [.192] C 2A TYP B A RECOMM ENDED PCB LAYOUT FOR USE WITH .0 0 8 THICK STENCIL AMP 4805 REV 31MAR2000

1-146134-7

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. A REF B SPACES @ 2.54 = [.1 0 0 ] C D 4.Í [.1 92] C 2A TYP RECOMMENDED PCB LAYOUT B A R ECOM MENDED PCB LAYOUT ROR USE WITH .0 0 8 THICK STENCIL

Contextual Info: RECOMMENDED P.C. BOARD & STENCIL LAYOUT FOR S Q T / E S Q T WITH - M W OPTION REV. B - NO OF POS X .07874 - .07874[ 2.00] [ 2.00] (NO OF POS X .07874) [ 2.00] ,063±.003 DIA [1.60±.08] ,034±.003 DIA [,86±.08] PLATED THRU HOLES .07874 [ 2.00] PCB LAYOUT

sot89 stencil

Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
Contextual Info: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins Figure 1 package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm

Contextual Info: RECOMMENDED P.C. BOARD/STENCIL LAYOUT FOR MB1 SINGLE SURFACE MOUNT REV. A BOARD LAYOUT ST E N C IL L A Y O U T + .003 +.08 -0.053-,000 [01.52-,00] PLATED THROUGH (TYP 2 PLCS) .044 [1.12]- 40' 0 £^_ 0.0600 40° o+ o OO [01.524] 0.1400 [03.556](No OF POS) x .03937 [1.00] + .1137 [2.0

30392

Abstract: ALM-1106 stencil Layout JEDEC SMT reflow profile stencil
Contextual Info: ALM-1106 MCOB Package Packge Application Note 5282 Introduction PCB Land Pattern and Stencil Design Avago Technologies’s ALM-1106 MCOB 2.0x2.0x1.1mm is an economical , easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach paddle acts as device grounding,

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. Ew COPYRIGHT - By - RELEASED FOR PUBLICATION - ALL RIGHTS RESERVED. c B A RECOMMENDED PCB LAYOUT EOR USE WITH .008 THICK STENCIL 4805 3/ 11 6 5 4 3 2 1 LOC DIST AD 00 R E V IS IO N S P LTR H3 DESCRIPTION REVISED PER DATE