d 5072
Abstract: d 5072 transistor elco 4.62 ELCO plug 56 PIN 09 69 201 5072 ST PER 852 C 818 001-120 plug 3.5mm 3226f 1-14-2B
Text: ELCO Microleaf Board to Board Connectors Contents ELCO A Family of Microleaf Connectors Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
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6/95/25M
d 5072
d 5072 transistor
elco 4.62
ELCO plug 56 PIN
09 69 201 5072
ST PER 852 C 818
001-120
plug 3.5mm
3226f
1-14-2B
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Tyco 108-25007
Abstract: 102387-3 tyco 114-25003 tyco 108-25020 82007 1-87666-6 104479-8 crimper 567297-2 1-104479-3 91516-1
Text: AMPMODU Interconnection System Wire-to-Board, .100 [2.54] Centerline Products Wire Sizes Contact Platings Wire-to-Board Products Mating Post Lengths Wire Size AWG [mm2] 20 0.5-0.6 22-30 0.3-0.05 32 0.03 Platings .000015 [0.00038] Gold .000030 [0.00076] Gold
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Untitled
Abstract: No abstract text available
Text: SN54HC808, SN74HC808 HEX 2-INPUT AND DRIVERS D 2804, MARCH 1 9 8 4 -R E V IS E D SEPTEM BER 1987 High-Current Outputs Can Drive Up to 15 LSTTL Loads SN S4H C808 . . . J PACKAG E S N 7 4 H C 8 0 8 . . . DW OR N P A C K A G E TO P V IEW 1A C 1CJ20 D vCc IB C
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SN54HC808,
SN74HC808
1CJ20
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Untitled
Abstract: No abstract text available
Text: Dura-Con High Reliability Metal Shell .050" 1.27mm Density Solder Cup/Wire D-Microminiature • Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. FEATURES ■ Several styles of mounting are available for cable-to-cable, cable-to-panel
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MIL-C-83513
choicJPRM063
DCJPRM047
DCJPRM031
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MIL-PRF-83513
Abstract: MIL-PRF-83513-D jackscrew airborne socket 775 MIL-C-835 M83513/MIL-W-16878/4-BCB
Text: Micro-D High Reliability Metal Shell 1.27mm Density Solder Cup/Wire D-Microminiature • Both plug and socket available in 9, 15, 21, 25, 31, 37, 51, and 100 positions. FEATURES ■ Several styles of mounting are available for cable-to-cable, cable-to-panel
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MIL-PRF-83513-D
MIL-PRF-83513-D
M83513/5-02
M83513/5-03
M83513/5-05
M83513/5-06
M83513/5-07
M83513/5-12
M83513/5-13
M83513/5-15
MIL-PRF-83513
jackscrew airborne
socket 775
MIL-C-835
M83513/MIL-W-16878/4-BCB
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3 x 4 membrane keypad
Abstract: Digital Displays BOS 753 BOS 600 BOS 602 material abs 757
Text: n^ Nr D U j Handgehäuse-Serie. hand-held enclosure series mà B O PL A G E H Ä U S E SYSTEME Das Gehäuse für mobile Datenerfassung/-Übertragung The enclosure for mobile data acquisition/transmission BOS 500 Digital-Handgehäuse aus ABS mit Panoramascheibe
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Digitalanz55000
3 x 4 membrane keypad
Digital Displays
BOS 753
BOS 600
BOS 602
material abs 757
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HC20K1000
Abstract: HC20K1500 HC20K400 HC20K600
Text: 15. Introduction to HardCopy APEX Devices H51006-2.2 Introduction HardCopy APEXTM devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and
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H51006-2
HC20K1000
HC20K1500
HC20K400
HC20K600
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"Content Addressable Memory"
Abstract: HC20K1000 HC20K1500 HC20K400 HC20K600
Text: 7. Introduction to HardCopy APEX Devices H51006-2.3 Introduction HardCopy APEXTM devices enable high-density APEX 20KE device technology to be used in high-volume applications where significant cost reduction is desired. HardCopy APEX devices are physically and
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H51006-2
"Content Addressable Memory"
HC20K1000
HC20K1500
HC20K400
HC20K600
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479 SOCKET PINOUT
Abstract: 476 10k 615 EP610 ORDERING apex complex 478 SOCKET PINOUT ep20k200 PINOUT ALTERA+MAX+5000+programming
Text: Index 16 Numerics 2.5-V device support APEX 20K devices 71 FLEX 10K devices 128,138,273 FLEX 6000 devices 446 MAX® 7000 devices 616 MAX 3000A devices 683 3.3-V device support configuration devices 810 FLEX 10K devices 128,133,138,273 FLEX 8000 devices 376
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Untitled
Abstract: No abstract text available
Text: i DRAWING MADS IN AM ERICAN PRO JECTIO N 1 9 7 2 «V AM R INCORPORATED. A U RIG H TS R ESERV ED * AM R PRODUCT* COVERED BY P A T E N T S A N D /O R ^ P A T E N T S PENDING. ' R E V IS IO N S S M B MB M l HTIV MMMEL R HfFff II BE IM W s m mn m m tom mmm mans
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Untitled
Abstract: No abstract text available
Text: Series 75 Metal-Core Conduit 750-196 Flexible Metal-Core EMI/RFI Conduit with 3 External Braids and Jacket Triple braided shield and jacket for high dB shielding requirements, environmental How To Order Basic No. SYM B C N SYM B C T N S A L D M E F N H E V
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750-196
Abstract: No abstract text available
Text: Series 75 Metal-Core Conduit 750-196 Flexible Metal-Core EMI/RFI Conduit with 3 External Braids and Jacket Triple braided shield and jacket for high dB shielding requirements, environmental How To Order Basic No. SYM B C N SYM B C T N S A L D M E F N H E V
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ABR800
Abstract: ABR810 BR10
Text: ABR800 - ABR810 AVALANCHE BRIDGE RECTIFIERS PRV : 50 - 1000 Volts Io : 8.0 Amperes BR10 0.520 13.20 0.480 (12.20) FEATURES : * * * * * * * 0.158 (4.00) 0.142 (3.60) High case dielectric strength High surge current capability High reliability Low reverse current
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ABR800
ABR810
UL94V-O
ABR810
BR10
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Untitled
Abstract: No abstract text available
Text: PAN-TERM Wire Joints Part Number System for PAN-TERM Wire Joints Type J = Wire Joint Non-Insulated JN = Wire Joint (Nylon Insulated) JN418-212-C Package Size X = 10 L = 50 C = 100 T = 200 D 500 M 1000 Wire Range: J Types: JN Types: 214-312 = two #14 or three #12
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JN418-212-C
J214-312-T
J318-412-T
JN224-318-C
J216-410-L
JN314-412
J216-410
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Untitled
Abstract: No abstract text available
Text: /T\l h r t 3 ~ n f ? \ Z A I J zU - E J u A a Configuration Devices , Contents Configuration Devices for APEX & FLEX Devices Data Sheet Features. 789
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V59C1G01168
Abstract: No abstract text available
Text: V59C1G01 808/168 QC HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns
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V59C1G01
16Mbit
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
V59C1G01168
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Untitled
Abstract: No abstract text available
Text: V59C1G01 808/168 QC HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns
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V59C1G01
16Mbit
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
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Untitled
Abstract: No abstract text available
Text: V59C1G01 808/168 QC HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns
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V59C1G01
16Mbit
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
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Untitled
Abstract: No abstract text available
Text: V59C1G01 408/808 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4) 3.75ns 3.75ns 3.75ns
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V59C1G01
32Mbit
16Mbit
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
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V59C1G01
Abstract: No abstract text available
Text: V59C1G01 408/808/168 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)
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V59C1G01
32Mbit
16Mbit
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY V59C1G01 408/808/168 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 3 25A 25 19A DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)
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V59C1G01
32Mbit
16Mbit
DDR2-667
DDR2-800
DDR2-1066
875ns
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PDF
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V59C1
Abstract: No abstract text available
Text: PRELIMINARY V59C1G01 408/808/168 QA HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 5 37 3 25A 25 18 DDR2-400 DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns
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V59C1G01
32Mbit
16Mbit
DDR2-400
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
V59C1
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY V59C1G01 408/808/168 QA HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 3 25A 25 18 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)
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V59C1G01
32Mbit
16Mbit
DDR2-667
DDR2-800
DDR2-1066
875ns
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TDA 70000 pin
Abstract: No abstract text available
Text: V59C1G01 408/808/168 QB HIGH PERFORMANCE 1Gbit DDR2 SDRAM 8 BANKS X 32Mbit X 4 (408) 8 BANKS X 16Mbit X 8 (808) 8 BANKS X 8Mbit X 16 (168) 37 3 25A 25 19A DDR2-533 DDR2-667 DDR2-800 DDR2-800 DDR2-1066 Clock Cycle Time (tCK3) 5ns 5ns 5ns 5ns 5ns Clock Cycle Time (tCK4)
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V59C1G01
32Mbit
16Mbit
DDR2-533
DDR2-667
DDR2-800
DDR2-1066
875ns
TDA 70000 pin
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