SQFP160C
Abstract: No abstract text available
Text: SQFP160C LSI Assembly Units : mm • SQFP160C 120 31.2 28.0 81 80 160 41 31.2 28.0 121 1 H=3.5Max. The contents described herein are subject to change without notice. 40 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SQFP160C
SQFP160C
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SQFP160
Abstract: SQFP160C
Text: SQFP160 / SQFP160C LSI Assembly Units : mm • SQFP160 / SQFP160C 31.2±0.3 28.0±0.2 81 121 80 160 41 1 0.8 28.0±0.2 31.2±0.3 120 3.3±0.1 40 0.1 0.15±0.1 0.65 0.3±0.1 ∗ The contents described herein are subject to change without notice. 0.15
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SQFP160
SQFP160C
SQFP160C
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SQFP160C
Abstract: No abstract text available
Text: SQFP160C LSI Assembly • SQFP160C 31.2±0.3 28.0±0.2 81 120 80 160 41 1 0.8 28.0±0.2 31.2±0.3 121 3.3±0.1 40 0.1 0.15±0.1 0.65 0.3±0.1 0.15 Units : mm The contents described herein are subject to change without notice. Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any
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SQFP160C
SQFP160C
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vqfp100 package
Abstract: TO220CP-3 TQFP128U SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100
Text: Product Designation Company info Page 1 of 2 Products > LSIs Lineup • LSI Packages > Product Designation Sales Products LSIs ROHM LSI Solution General-purpose LSIs Mobile Phone LSIs Product Designation •When ordering, specify the part number. •Check each code against the tables shown below.
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copyQFP80V,
HTQFP64V
UQFP64,
UQFP80,
UQFP100,
TQFP64U,
TQFP80U,
TQFP100U
UQFP120,
TQFP128U
vqfp100 package
TO220CP-3
SOP8 package tray
VSOF5
TQFP176U
TSSOP-B8J
TSSOP-B14
tl 32 icp
VQFP100
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vqfp100 package
Abstract: TQFP128U SSOP-A20 Contact Image Sensor VQFP100
Text: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request
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descrQFP80V,
HTQFP64V
UQFP64,
UQFP80,
UQFP100,
TQFP64U,
TQFP80U,
TQFP100U
UQFP120,
TQFP128U
vqfp100 package
SSOP-A20
Contact Image Sensor
VQFP100
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vqfp100 package
Abstract: No abstract text available
Text: ravim •BU12200 series Parameter Integrated counts BU12206 BU12207 DU12208 BU12209 BU12210 Total No. of gates 5760 10476 13888 20100 25200 43560 Usable gates 3168 5762 7638 11055 13B60 23958 Total No. of PADs 88 108 128 152 168 216 No. of l/Os 78 98 118 142
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array/BU12200
BU12200
BU12206
BU12207
DU12208
BU12209
BU12210
13B60
BU12211
SQFP160
vqfp100 package
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Untitled
Abstract: No abstract text available
Text: Dimensions m h #SIP/HSIP POW ER T Y P E /ZIP/SZIP (Unit : mm) TO-22QFP TO-92 0.510.1 0 .4 5 ± 0 .l 2.54 ± 0.5 SIPS FTR I I -8 ± 0 .2 I6 .8 ± 0 .2 2 .8 ± 0 .2 I9 .3 ± 0 .2 j_ 0 .3 ± 0 . I 38 2 .4 ± 0 .Z SIP8 SIP7 SIP9 ° - 55i S : o s SIP 10 Z .8 ± 0 .2
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O-22QFP
HSIP10
SIP-M12
HSIP-B12
SZIP24
SQFP144
SQFP160
VQFP48
VQFP64
VQFP80
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BU12108
Abstract: BU12101 BU12100 vqfp100 package
Text: CMOS Gate array CM OS gate array/BU12100 series high integration # BUI2100 series BU12101 BUI2102 BUI2103 BUI2104 BU12105 BU12155 BU12106 BUI2107 BU12108 BUI2109 BU12H0 BU12YH BU12«3 Parameter Integrated counts Total No. of gates 1224 2496 3240 4352 5616
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array/BU12100
BUI2100
BU12101
BUI2102
BUI2103
BUI2104
BU12105
BU12155
BU12106
BUI2107
BU12108
BU12100
vqfp100 package
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03mn
Abstract: No abstract text available
Text: Introduction Standard IC packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-220FP 3.7i 0 7 U iO ? r ' □ _ 0 S ID I I 21 f 1 128 üi p 0 45 tO. I _ Q [?.3 10.8 3 1.27 2 .5 4 1 0 .5 FTR JI [? .5 4 ± 0 .5 SIP5 2. 0 . 0.2 I I . B i d .2 2M 2.bä^ SIP7 SIP8 16 .8 10 .2
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O-220FP
SIP10
HSIP10
SIP-M12
HSIP-B12
ZIP12
ZIP16
SQFP56
SQFP80
SQFP-T80
03mn
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SIP10
Abstract: No abstract text available
Text: Introduction Standard 1C packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-22QFP □ w O .S I O .I 0 .« ± 0 .l FTR SIP5 I l.8 ± 0 .2 n tv - I i ] I 0.5 5 ± 0 ,1 2.54 r 2 .4 ± 0 .2 1 n □ i H 0 .6 0.8 1 o .3 ± 0 . > I ¿J SIP7 SIP8 uwii) wii; w Jtr v ll lil U
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O-22QFP
SIP10
HSIP10
SIP-M12
HSIP-B12
ZIP12
ZIP16
ZIP18
SZIP24
SQFP56
SIP10
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BU12101
Abstract: BU12110 BU16503 BU12300 BU12104 vqfp100 package BU16515 8038 function generator application 16x4 ram vhdl BU242
Text: Introduction Microcontrollers and CMOS gate arrays Following is a summary of the microcontrollers and CMOS gate arrays offered by ROHM. For further details and data sheets for these devices, please contact your local representative. 4-bit single chip microcontrollers
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DIP22,
SDIP22
BU2458,
BU24592
28x28
BU12311
BU12101
BU12110
BU16503
BU12300
BU12104
vqfp100 package
BU16515
8038 function generator application
16x4 ram vhdl
BU242
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ZM 1182
Abstract: 03IJH
Text: Standard 1C packages SIP/HSIP Power type /ZIP/SZIP TO-92 TO-22QFP FTR SIP5 11.8±0.2 3 — b B 2.4±0.2 i ¥ 0.6 0.8 SIP7 SIP8 SIP9 SIP10 Audio Integrated Circuits MHrn n |0 .3 ± 0 . I 21 HSIP10 SIP-M12 3.6±02 HSIP-B12 ZIP9 J t t e ZIP12 ZIP16 I 0.5±0. I
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O-22QFP
SIP10
HSIP10
SIP-M12
HSIP-B12
ZIP12
ZIP16
ZIP18
SZIP24
DIP20
ZM 1182
03IJH
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SOP42
Abstract: No abstract text available
Text: SIP-M12 HSIP10 +\ +i L_ ' HSIP-B12 ZIP9 3 0 .0 + 0 .3 I l.8±0.2 2 8 .5 + 0 .2 r~ H ¥i| • '“ i J I J ^ o .s t o . 2 8 ZIP 16 ZIP 12 I r r I9 .3 ± 0 .2 -1 | 0 .5 5 ± 0 . I 0 .5 + 0 . I I 2 .7 5 ± D .25 E 5 2 H 2 S 5 D 2 12 Z F 18 SZIP24 1,0.5610.:
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HSIP10
SIP-M12
HSIP-B12
SZIP24
DIP22
HSOP25
HSOP28
SQFP-T100
SQFP144
SQFP160
SOP42
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BU163
Abstract: 63536
Text: ranún •BU16300 series BU16308 BÜ16309 BU16310 BU163H Total No. of gates 33220 49312 63536 110400 Usable gates 14392 21269 27343 47489 Total No. of PADs 120 144 160 208 No. of l/O s 104 128 144 192 Parameter Integrated counts 5.0V±5% I/0 only , 5.0V±10%(I/0 only), 2.7V~3.6V
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array/BU16300
BU16300
BU16308
BU16310
BU163H
250MHz
28X28
BU16508
BU16509
BU165K)
BU163
63536
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vqfp100 package
Abstract: S2P24 BA4558F-T1
Text: Packaging Packaging type Package DIP/SDIP Tube SIP/HSIP/ZtP/SZIP Tube Packaging code Tube SOP/SSOP/HSOP QFP/SQFP/VQFP Paper taping T l, T2 Difference in taping direction Embossed taping E1, E2 (Difference in taping direction) Tray VP Tray (dry pack) FTR/TO-92/TO-220/TO-220FP
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FTR/TO-92/TO-220/TO-220FP
vqfp100 package
S2P24
BA4558F-T1
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SOp28 J6
Abstract: No abstract text available
Text: •SIP/HSIP POWER TYPE /ZIP/SZIP TO-92 T0-220FP 4 . 8 + 0 .2 r 3 .7 ± 0 .2 r i i □ 0 .5 + 0 .1 Q. 45+0.1 FTR SIPS ll. 8 ± 0 . 2 2 .4 ± 0 .2 ‘ 2 .5 4 j SIP7 | 0 !S j n 0 .6 J o . 3 ± D. I SIP8 I6 .8 ± 0 .2 2 .8 ± 0 .2 n 0.6 I! 0 .3 ± 0 . I SIP9 SIP 10
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T0-220FP
HSIP10
SIP-M12
HSIP-B12
SZIP24
SQFP-T80
SQFP100
SQFP-T100
SQFP144
SQFP160
SOp28 J6
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BU12101
Abstract: BU12300 vqfp100 package
Text: CMOS Gate array CMOS gate array/BU12100 series high integration •BU12100 series BU12101 BU12102 BU12103 BUI2104 BU12105 BU12155 BU12106 BLM2107 BUI2108 BUI2109 BU12ÎIO BU12ÎI1 BU12113 Param eter T otal No. o f gates 1224 2496 3240 4352 5616 7216 9200
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array/BU12100
BU12100
BU12101
BU12102
BU12103
BUI2104
BU12105
BU12155
BU12106
BLM2107
BU12300
vqfp100 package
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vqfp100 package
Abstract: VQFP-100 Tray SOP24 065j SCHP30 p04m BA4558F-T1 SQFP-144
Text: Dimensions I l l II I I I I Dimensions •DIP/SDIP/SK-DIP Unit : mm DIP 14 DIP8 o o 0. 5+ 0. I O’ - |[o's±o. 15" 1 O' ~ I 5 ' DIP 18 DIP 16 o 19 . 4 ± 0. 3 l?6_ ' o 9 -t-i I l;.5±o, I ’o" DIP22 DIP20 22 O 12 () ) o O H J v °.5 .± 0 . I 0.5± 0. I
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DIP20
DIP22
DIP24
DIP28
SQFP56
VQFP80
FP-A64
FP-T80
SQFP-T80
SQFP100
vqfp100 package
VQFP-100
Tray SOP24
065j
SCHP30
p04m
BA4558F-T1
SQFP-144
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Untitled
Abstract: No abstract text available
Text: •SIP/HSIP{POWER TYPE /ZIP/SZIP T0220FP TO-92 ¿ 3 .2 ± 0 .1 n I 2.8 ?T 0.5±0.1 1.27 ! I 0 .45±D. I 1.27 2 .5 4 ± 0 .5 [2 .5 4 ± 0 . 5 Q‘ S ^ a SIPS P ll.8±0.2 2.d±0.2 □ U °-6 U 3 _c I °_'._55±0-1 I I 0.8 0 45±Q. I I".3 2.54 ]2.64 ^ SIPS SIP7
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T0220FP
DIP22
DIP24
DIP28
VQFP64
VQFP80
VQFP100
VQFP144
VQFP208
UQFP160
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68fl
Abstract: No abstract text available
Text: Introduction Standard IC packages SIP/HSIP Power typey/ZIP/SZIP TO-220FP TO-92 10-0 ? 4>3 .2 ± 0 .1 I I 2 .8 _ TÏ— ? 1.3 0.8 3 2 .s * ± 0 . s \ [ ¡, 2 . 5 4 * 0.5 SIP5 FTR r H .B ± 0 .2 UÎ-jJiÜ 1 I q 2 .4 ± 0 .2 Î 0.6 0.8 Uj a SIP8 SIP7 I6 .8 ± 0 .2
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O-220FP
SIP10
HSIP10
SIP-M12
HSIP-B12
ZIP12
ZIP16
ZIP18
SZIP24
DIP14
68fl
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BU12307
Abstract: vqfp100 package BU12310
Text: CMOS Gate array CMOS gate array/BU12300 series ultra multiple pin type •BU12300 seríes BU12307 Parameter Integrated counts BU12308 BU1230Q BU12310 BU123Î1 Total No. of gates 4650 6660 10282 12744 22152 Usable gates 2502 3764 5655 7009 12183 Total No. of PADs
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array/BU12300
BU12300
BU12307
BU12308
BU1230Q
BU12310
BU123
3VSQFP160
28x28
20X20
BU12307
vqfp100 package
BU12310
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