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    SOT81 Price and Stock

    Nexperia 74LVC8T245BQ,118

    Bus Transceivers SOT815-1 BUS TRANSCEIVER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC8T245BQ,118 Reel 15,000 3,000
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    • 10000 $0.374
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    Nexperia 74AVC8T245BQ,118

    Bus Transceivers SOT815-1 BUS TRANSCEIVER
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC8T245BQ,118 Reel 15,000 3,000
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    • 10000 $0.495
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    Nexperia 74LVCH8T245BQ,118

    Translation - Voltage Levels SOT815-1 DUAL TRANSCVER 8-BIT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVCH8T245BQ,118 Reel 6,000 3,000
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    • 10000 $0.48
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    Nexperia 74AVC8T245BQ-Q100J

    Bus Transceivers 8-bit dual supply translating transceiver with configurable voltage translation; 3-state
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC8T245BQ-Q100J Reel 3,000
    • 1 -
    • 10 -
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    • 1000 -
    • 10000 $0.474
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    Nexperia 74LVC8T245BQ-Q100J

    Bus Transceivers 8-bit dual supply translating transceiver; 3-state
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC8T245BQ-Q100J Reel 3,000
    • 1 -
    • 10 -
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    • 1000 -
    • 10000 $0.497
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    SOT81 Datasheets (16)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT810-1 NXP Semiconductors Plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm Original PDF
    SOT810-1 NXP Semiconductors Footprint for reflow soldering SOT810-1 Original PDF
    SOT811-1 NXP Semiconductors Plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm Original PDF
    SOT811-1 NXP Semiconductors Footprint for reflow soldering SOT811-1 Original PDF
    SOT812-1 NXP Semiconductors Plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm Original PDF
    SOT813-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 72 terminals Original PDF
    SOT813-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 72 terminals Original PDF
    SOT813-4 NXP Semiconductors Footprint for reflow soldering SOT813-4 Original PDF
    SOT813-5 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 72 terminals Original PDF
    SOT815-1 NXP Semiconductors Footprint for reflow soldering SOT815-1 Original PDF
    SOT815-1_118 NXP Semiconductors DHVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT817-1 NXP Semiconductors HVQFN100: plastic thermal enhanced very thin quad flat package Original PDF
    SOT817-1 NXP Semiconductors Footprint for reflow soldering SOT817-1 Original PDF
    SOT818-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm Original PDF
    SOT818-1 NXP Semiconductors Footprint for reflow soldering SOT818-1 Original PDF
    SOT819-1 NXP Semiconductors Plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm Original PDF

    SOT81 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HSSON18 package SOT810-1 0.55 1.55 1.00 11x 2.55 4.80 6.40 9.00 9.25 8.30 3.40 1.50 0.95 1.05 1.80 3.40 4.60 7.00 solder lands 7.80 10.20 solder resist 0.075 clearance


    Original     		HSSON18 OT810-1 OT810-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: 24 DH VQ FN SOT815-1 DHVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel


    Original     		OT815-1 DHVQFN24; 001aak603 OT815-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e


    Original     		BGA256: OT811-1 MS-034 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLLGA28R: plastic thermal enhanced low profile land grid array package; 28 lands; resin based; body 6 x 6 x 1.4 mm D SOT819-1 A B land 1 index area E e1 L1 v w b e 8 M M y1 C C A B C A C y 14 L 15 7 e e2 Eh 21 1 land 1 index area 28 22 Dh 2.5


    Original     		HLLGA28R: OT819-1 PDF

    HVQFN72

    Abstract: MO-220 EE19 sot813
    Text: Package outline Philips Semiconductors HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-2 terminal 1 index area A A1 E c detail X C e1 1/2 e e 19 36 L y y1 C v M C A B w M C b 37 18


    Original     		HVQFN72: OT813-2 MO-220 HVQFN72 MO-220 EE19 sot813 PDF

    BGA288

    Abstract: MS-034 sot812
    Text: PDF: 2003 May 20 Philips Semiconductors Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e ∅v M b ∅w M AB AA Y W V U T R P N M L K J H G F E


    Original     		BGA288: OT812-1 MS-034 BGA288 MS-034 sot812 PDF

    HVQFN36

    Abstract: MO-220 sot818
    Text: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm SOT818-1 B D A terminal 1 index area A E A1 c detail X C e1 e y1 C v M C A B w M C b 10 y 18


    Original     		HVQFN36: OT818-1 MO-220 HVQFN36 MO-220 sot818 PDF

    BGA256 17 X 17

    Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
    Text: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape


    Original     		BGA256: OT811-1 MS-034 BGA256 17 X 17 BGA256 MS-034 BGA-256 sot811 BGA256 17 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN72 package SOT813-4 Hx Gx D P 0.105 SPx tot drill 0.3 mm (x45) SPx SPy Hy SPy tot Gy SLy By Ay (0.065) 0.55 mm SLx Bx Ax solder land solder resist solder paste deposit occupied area


    Original     		HVQFN72 OT813-4 sot813-4 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		BGA256 OT811-1 OT811-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-2 terminal 1 index area A E A1 c detail X C e1 1/2 e e 19 L 36 y y1 C v M C A B w M C b 37 18 e e2 Eh 1/2 e 1 terminal 1


    Original     		HVQFN72: OT813-2 pro75 MO-220 PDF

    HVQFN36

    Abstract: No abstract text available
    Text: Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 5 x 5 x 0.85 mm SOT818-1 B D A terminal 1 index area A E A1 c detail X C e1 e y1 C v M C A B w M C b 10 y 18 L 19 9 e e2 Eh 1 27 terminal 1 index area


    Original     		HVQFN36: OT818-1 MO-220 HVQFN36 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b v M C A B w M C 9 y y1 C L terminal 1 index area Eh


    Original     		HSSON18: OT810-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e 26 y1 C v M C A B w M C b 50 L y 51 25 e e2 Eh 1 terminal 1


    Original     		HVQFN100: OT817-1 MO-220 PDF

    MO-220

    Abstract: sot817
    Text: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e y1 C v M C A B w M C


    Original     		HVQFN100: OT817-1 MO-220 MO-220 sot817 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm B D SOT813-5 A terminal 1 index area A E A1 c detail X e1 Ds L C A B C v w b C Dt 19 36 37 18 y y1 C L1 Et e Eh 1/2 e e2 Es 1 terminal 1


    Original     		HVQFN72: OT813-5 sot813-5 PDF

    HVQFN36

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN36 package SOT818-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		HVQFN36 OT818-1 OT818-1 PDF

    SOT815-1

    Abstract: No abstract text available
    Text: SOT815-1 Standard product orientation 12NC ending 118 Rev. 01 — 23 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT815-1 118


    Original     		OT815-1 OT815-1 SOT815-1 PDF

    DHVQFN24

    Abstract: SOT815-1 L121 sot815
    Text: PDF: 2003 Apr 29 Philips Semiconductors Package outline DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm B D SOT815-1 A A E A1 c detail X terminal 1 index area C e1 terminal 1


    Original     		DHVQFN24: OT815-1 DHVQFN24 SOT815-1 L121 sot815 PDF

    HSSON18

    Abstract: sot810
    Text: Package outline Philips Semiconductors HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area detail X e1 C e2 e3 b2 1 e b1 b 9 y y1 C v M C A B w M C L terminal 1


    Original     		HSSON18: OT810-1 HSSON18 sot810 PDF

    MO-220

    Abstract: HVQFN72 sot813
    Text: PDF: 2003 Jul 16 Philips Semiconductors Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm A B D SOT813-1 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 36 L y y1 C v M C A B


    Original     		HVQFN72: OT813-1 MO-220 MO-220 HVQFN72 sot813 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of DHVQFN24 package SOT815-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		DHVQFN24 OT815-1 OT815-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e y1 C ∅v M C A B b y ∅w M C AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 shape


    Original     		BGA288: OT812-1 MS-034 PDF

    sot814

    Abstract: No abstract text available
    Text: PDF: 2003 Nov 24 Philips Semiconductors Package outline HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 6.6 x 5.2 x 1.1 mm SOT814-1 X D D1 D2 B A A E2 E1 E c detail X terminal 1 index area C e1


    Original     		HTSSON16T: OT814-1 sot814 PDF