SOT513 Search Results

SOT513 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT513-1		NXP Semiconductors	Plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink		Original	PDF

SOT513 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1 20 w M bp e ZD v M A D B	Original	HTQFP80: OT513-1	PDF
HTQFP80 Abstract: sot513 Text: PDF: 1999 Nov 23 Philips Semiconductors Package outline HTQFP80: plastic, heatsink thin quad flat package; 80 leads; body 14 x 14 x 1.0 mm SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X 21 80 1	Original	HTQFP80: OT513-1 HTQFP80 sot513	PDF
HTQFP80 Abstract: No abstract text available Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e E HE Eh A 3 A A2 A1 w M θ bp Lp L pin 1 index detail X	Original	HTQFP80: OT513-1 HTQFP80	PDF
SOT411 Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050 Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which	Original		PDF
Untitled Abstract: No abstract text available Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in	Original	HTQFP32 OT547-2 HTQFP48 OT545-2 HTQFP80 OT513-1	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package	PDF