SOT11 Search Results

BGY67A

Abstract: DIN45004B
Contextual Info: BGY67A 200 MHz, 24 dB gain reverse amplifier Rev. 04 — 14 March 2005 Product data sheet 1. Product profile 1.1 General description Hybrid high dynamic range amplifier module in a SOT115J package operating at a voltage supply of 24 V DC . CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken

CGD942C

Contextual Info: CGD942C 870 MHz, 23 dB gain power doubler amplifier Rev. 01 — 7 June 2007 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V DC , employing Hetero Field Effect Transistor (HFET) GaAs dies.

sot1138

Contextual Info: Package outline HSOP4F: plastic, heatsink small outline package; 4 leads flat SOT1138-1 B D A E X c y v HE A D1 D2 e 4 3 E2 E1 A A2 A1 pin 1 index Q1 detail X 1 2 w b B 10 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A A1 3.9 0.2

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm

HVSON12

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-1 Gx D 0.105 P C SPx nSPx SPy Hy Gy SLy nSPy By Ay SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit

hxqfn60u

Abstract: SOT1134-1 sot1134
Contextual Info: Package outline HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm B D SOT1134-1 A terminal 1 index area E A A1 detail X e2 e1 1/2 e e C A B C v w L1 D2 D6 A11 B8 B10 A16 D7 A10 L eR

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper

catv amplifier

Abstract: CATV amplifier transistor 6-32UNC-2A BGY687 SC16 5965
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET BGY687 CATV amplifier module Product specification Supersedes data of February 1995 File under Discrete Semiconductors, SC16 1995 Sep 11 Philips Semiconductors Product specification CATV amplifier module FEATURES BGY687 PINNING - SOT115J

Contextual Info:        CGD942C 870 MHz, 23 dB gain power doubler amplifier Rev. 4 — 25 June 2014 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V DC , employing Hetero Field Effect Transistor (HFET) GaAs dies.

CGD1044H

Contextual Info: CGD1044H 1 GHz, 25 dB gain high output power doubler Rev. 3 — 29 September 2010 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V DC , employing Hetero junction Field Effect Transistor (HFET) GaAs dies.

BGR269

Abstract: DIN45004B
Contextual Info: BGR269 200 MHz, 35 dB gain reverse amplifier Rev. 6 — 5 August 2010 Product data sheet 1. Product profile 1.1 General description High performance amplifier in a SOT115J package, operating at a voltage supply of 24 V DC . CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken

TFBGA-296

Contextual Info: Package outline TFBGA296: plastic thin low profile fine-pitch ball grid array package; 296 balls A B D SOT1107-1 ball A1 index area E A2 A A1 detail X e1 e Y V T P M K H F D B 1/2 e ∅v ∅w b M M C C A B C y1 C y W U R e N L e2 J 1/2 e G E C A ball A1 index area

Contextual Info: Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads SOT115V D N2 E S2 Z N1 N3 p M M1 M3 M2 A2 1 2 3 4 5

Contextual Info: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w

Contextual Info: Package outline HSOP4F: OMP 4 leads flat SOT1138 B D A E C X y E1 HE w A D1 D2 H1 w B e1 E3 A2 E2 Q1 detail X w b B e 5 Dimensions Unit(1) 10 mm scale A2 b c D D1 D2 e e1 E E1 E2 E3 HE H1 Q1 w v 10.01 9.83 8.18 5.89 19.68 12.77 1.6 max 3.86 5.92 0.27 20.62 19.00 16.05

Contextual Info: Package outline DFN2626-10: plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals; body 2.6 x 2.6 x 0.5 mm SOT1197-1 X A B D A E A1 A3 terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y y1 C L k

Contextual Info: Package outline HVQFN32R: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based; body 7 x 7 x 0.8 mm B D SOT1152-1 A terminal 1 index area A E detail X e1 e ∅v ∅w b C A B C C 1/2 e L1 9 y y1 C 16 L 8 17 e Eh e2 1/2 e

Contextual Info: Package outline HSOP14F: plastic, heatsink small outline package; 14 leads flat SOT1186-1 A E E2 D c X y HE v A D1 e2 bp2 (2x) w 14 D2 13 E1 A A2 A1 pin 1 index Q detail X 1 12 z w bp1 (12×) e1 e (10×) 5 Dimensions Unit mm 10 mm scale A max 3.50 nom 3.25

Contextual Info: Package outline HWQFN32: plastic thermal enhanced very very thin quad flat package; no leads; 32 terminals; 3 x 6 x 0.75 mm A B D SOT1180-1 terminal 1 index area E A A1 c detail X e e1 12 16 C C A B C v w b y y1 C L 17 11 e e2 Eh 27 1 terminal 1 index area

Contextual Info: Package outline HXSON12: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.2 x 2.5 x 0.5 mm SOT1158-1 X A B D E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 6 C C A B C y1 C y L k E2

Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D252 BGE787B CATV amplifier module Preliminary specification 2000 Oct 03 Philips Semiconductors Preliminary specification CATV amplifier module BGE787B PINNING - SOT115J FEATURES • Excellent linearity PIN

Contextual Info: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.0 x 1.7 x 0.5 mm SOT1177-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L1 k L 10 5 1 Dimensions Unit 1

Contextual Info: Package outline HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1 X A B D E A A1 c terminal 1 index area detail X terminal 1 index area e1 e v w b 1 8 C C A B C y1 C y L k Eh 16

Contextual Info: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-2 X A B D A E A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L K Eh 12