Untitled
Abstract: No abstract text available
Text: Package outline HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.75 mm SOT1069-2 X A B D A E A2 A1 A3 terminal 1 index area detail X e1 terminal 1 index area e 1 4 C C A B C v w b y y1 C L K E2 8
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OT1069-2
MO-229
sot1069-2
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SOT1069-1
Abstract: MO-229 footprint
Text: Package outline HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.8 mm X b v SOT1069-1 A B B D A E A2 A A1 A3 terminal 1 index area detail X C 1/2 e terminal 1 index area y1 C e 1 y 4 L 8x K E2
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OT1069-1
MO229
MO-229
sot1069-1
MO-229 footprint
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HWSON8 package SOT1069-2 Gx D P C nSPx Hy SPy Gy SLy By Ay nSPy SPx SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By C D SLx SLy
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OT1069-2
sot1069-2
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High-precision temp sensors for us with DDR2 and DDR3 DIMMs
Abstract: Temperature sensors
Text: NXP SO-DIMM and RDIMM temperature sensors SE97B and SE98A High-precision temp sensors for us with DDR2 and DDR3 DIMMs Accurate to within ±1 °C max , these high-precision temp sensors are designed to monitor the temperature of a DDR2/DDR3 SO-DIMM or RDIMM or UDIMM-ECC including an optional 2 kbit
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SE97B
SE98A
SE97B
High-precision temp sensors for us with DDR2 and DDR3 DIMMs
Temperature sensors
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se97btp
Abstract: SE97B hwson8 footprint SE97 JESD22-A114 JESD22-A115 JESD78 TSE2002B1
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
se97btp
hwson8 footprint
SE97
JESD22-A114
JESD22-A115
JESD78
TSE2002B1
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P2075
Abstract: nxp pct2075 smd 3F7
Text: PCT2075 I2C-bus Fm+, 1 degree C accuracy, digital temperature sensor and thermal watchdog Rev. 3 — 21 May 2013 Product data sheet 1. General description The PCT2075 is a temperature-to-digital converter featuring 1 C accuracy over 25 C to +100 C range. It uses an on-chip band gap temperature sensor and Sigma-Delta
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PCT2075
PCT2075
P2075
nxp pct2075
smd 3F7
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Untitled
Abstract: No abstract text available
Text: PCT2075 I2C-bus Fm+, 1 degree C accuracy, digital temperature sensor and thermal watchdog Rev. 6 — 24 January 2014 Product data sheet 1. General description The PCT2075 is a temperature-to-digital converter featuring 1 C accuracy over 25 C to +100 C range. It uses an on-chip band gap temperature sensor and Sigma-Delta
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PCT2075
PCT2075
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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CI 4069
Abstract: No abstract text available
Text: PCF85063TP Tiny Real-Time Clock/calendar Rev. 3 — 11 July 2013 Product data sheet 1. General description The PCF85063TP is a CMOS1 Real-Time Clock RTC and calendar optimized for low power consumption. An offset register allows fine-tuning of the clock. All addresses and
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PCF85063TP
PCF85063TP
CI 4069
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Untitled
Abstract: No abstract text available
Text: NTAG203F NFC Forum Type 2 Tag compliant IC with 144 bytes user memory and field detection Rev. 3.0 — 15 December 2011 221530 Product short data sheet COMPANY PUBLIC 1. General description NXP Semiconductors has developed NTAG203F - NFC Forum Type 2 Tag compliant IC to be used with NFC enabled devices according to NFC Forum technical specifications
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NTAG203F
NTAG203F
4443A
4443A
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AN11276
Abstract: AN11276, NTAG Antenna Design Guide NTAG203F nfc antenna design guide NTAG203 NXP antenna design guide mifare NxP NFC antenna AN1303 Ultralight as Type 2 Tag AN11141 MF0ICU1 Functional specification MIFARE Ultralight
Text: NTAG203F NFC Forum Type 2 Tag compliant IC with 144 bytes user memory and field detection Rev. 3.3 — 12 February 2013 220632 Product data sheet COMPANY PUBLIC 1. General description NXP Semiconductors has developed NTAG203F - NFC Forum Type 2 Tag compliant IC to be used with NFC enabled devices according to NFC Forum technical specifications
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NTAG203F
NTAG203F
4443A
4443A
AN11276
AN11276, NTAG Antenna Design Guide
nfc antenna design guide
NTAG203
NXP antenna design guide mifare
NxP NFC antenna
AN1303 Ultralight as Type 2 Tag
AN11141
MF0ICU1 Functional specification MIFARE Ultralight
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hwson8 footprint
Abstract: SE97 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 Diode BAW 62 SE98B
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 03 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
hwson8 footprint
SE97
1E70H
JESD22-A114
JESD22-A115
JESD78
SE98
Diode BAW 62
SE98B
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SE97A
Abstract: SE97B DDR3 DIMM SE97 SE97PW jedec MO229 JESD22-A114 JESD22-A115 JESD78 SE97TK
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 04 — 30 January 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE97A
SE97B
DDR3 DIMM
SE97
SE97PW
jedec MO229
JESD22-A114
JESD22-A115
JESD78
SE97TK
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Silicon Tuners
Abstract: Temperature sensors TDA18272 tda18273 TDA20136 convert sata to usb cable diagram tda19997 usb to sata converter circuit diagram TDA20142 TDA19995
Text: Application guide Flat-panel TV sets Contents Your partner for flat-panel TV sets 3 1. Power solutions 4 1.1 1.2 1.3 1.4 Primary AC/DC controllers Main power supply: secondary synchronous rectification ICs Standby power supply Discretes 2. RF reception stage
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Untitled
Abstract: No abstract text available
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 02 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
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TDA5051AT
Abstract: PCA9541A LM75AD SA630D
Text: Technical Information Technical Information for Breakout Boards OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Preliminary 1 — 9/6/2013 Document information Info Content Keywords Abstract Fm+, I2C-bus, Surface Mount Package, Breakout Board
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OM13491,
OM13492,
OM13493,
OM13494,
OM13495,
OM13496,
OM13497
TDA5051AT
PCA9541A
LM75AD
SA630D
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SE97
Abstract: S98A 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 SE98APW jedec MO229 INTEL nehalem CPU
Text: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 01 — 5 March 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the
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SE98A
SE98A
JC-42
SE97
S98A
1E70H
JESD22-A114
JESD22-A115
JESD78
SE98
SE98APW
jedec MO229
INTEL nehalem CPU
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SE97BTP
Abstract: DDR3 memory SE97 SE97B
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
771-SE97BTP547
SE97BTP
DDR3 memory
SE97
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PA9517
Abstract: 9517a body mark 9517A i2c
Text: PCA9517A Level translating I2C-bus repeater Rev. 4 — 9 May 2012 Product data sheet 1. General description The PCA9517A is a CMOS integrated circuit that provides level shifting between low voltage down to 0.9 V and higher voltage (2.7 V to 5.5 V) I2C-bus or SMBus
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PCA9517A
PCA9517A
PA9517
9517a body mark
9517A i2c
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Untitled
Abstract: No abstract text available
Text: LM75B Digital temperature sensor and thermal watchdog Rev. 3 — 27 December 2011 Product data sheet 1. General description The LM75B is a temperature-to-digital converter using an on-chip band gap temperature sensor and Sigma-Delta A-to-D conversion technique with an overtemperature detection
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LM75B
LM75B
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Untitled
Abstract: No abstract text available
Text: SE97B DDR memory module temp sensor with integrated SPD Rev. 01 — 27 January 2010 Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C
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SE97B
TSE2002B1,
SE97B
JC-42
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SE975
Abstract: INTEL nehalem CPU SE97 SE97B
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 05 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
SE975
INTEL nehalem CPU
SE97
SE97B
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hwson8 footprint
Abstract: SE97 SE97B JESD22-A114 JESD22-A115 JESD78 SE97PW SE97TK SE97TL DDR3 SODIMM SPD JEDEC
Text: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 07 — 29 January 2010 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes
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JC-42
hwson8 footprint
SE97
SE97B
JESD22-A114
JESD22-A115
JESD78
SE97PW
SE97TK
SE97TL
DDR3 SODIMM SPD JEDEC
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CI 4069
Abstract: No abstract text available
Text: PCF85063TP Tiny Real-Time Clock/calendar Rev. 2 — 15 April 2013 Product data sheet 1. General description The PCF85063TP is a CMOS1 Real-Time Clock RTC and calendar optimized for low power consumption. An offset register allows fine-tuning of the clock. All addresses and
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PCF85063TP
PCF85063TP
CI 4069
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