SOT105 Search Results

HVSON14

Contextual Info: PC board footprint NXP Semiconductors Footprint for reflow soldering of HVSON14 package SOT1054-1 4.200 pa + oa 3.500 0.500 oa 0.500 4.150 1.800 1.500 sr 0.800 0.250 2.350 3.200 3.900 pa + oa 0.500 0.800 2.100 3.200 sr 0.0150 3.500 solder land + solder paste

IP4282CZ6

Abstract: "ESD Protection" IP4221CZ6-S IP4283CZ10 IP4280CZ10 IP4281CZ10 SOT1059
Contextual Info: NXP high-speed ESD protection in ultra-thin leadless packages IP4221/42 < 1.0 pF and IP4281/2/3 (< 0.7 pF) Bring ESD protection closer to the data lines These integrated ESD protection devices, housed in leadless SOT886 and SOT1059 packages, simplify circuit design, reduce routing design times, and cut pick-and-place costs. They’re cost

Contextual Info: Package outline HXSON8: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm X b v M A B B D SOT1052-1 A A E A1 detail X terminal 1 index area C 1/2 e terminal 1 index area y1 C e 1 y 4 L 8x Eh 8 5 Dh

Contextual Info: Package outline TFBGA273: plastic thin fine-pitch ball grid array package; 273 balls A B D SOT1051-1 ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9

Contextual Info: Package outline USON6: plastic ultra thin small outline package; no leads; 6 terminals; body 1.5 x 2.1 x 0.55 mm SOT1050 X B D A E A A1 detail X terminal 1 index area b v M A B C y1 C e terminal 1 index area 1 y 3 L eE 6 4 1 2 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm SOT1059-1 B D A E A A1 terminal 1 index area detail X e1 e L1 v w b 1 5 M M C C A B C y1 C y L2 e2 L 10 6 X 0.5 1 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline HVQFN38R: plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm B D SOT1056-1 A terminal 1 index area E A detail X e1 e L L1 D2 D5 1/2 e A7 B3 B6 v w b A12 M M C C A B C y1 C y D3 D6

Contextual Info: Package outline LFBGA136: plastic low profile fine-pitch ball grid array package; 136 balls B D SOT1058-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e 1/2 e C C A B C M M y1 C y P N M L K J H G F E D C B A e e2 1/2 e ball A1 index area 1 2 3 4

HVSON14

Contextual Info: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm SOT1054-1 X A B D E A A1 c detail X terminal 1 index area e1 terminal 1 index area e v w b 1 7 M M C C A B C y1 C y L Eh 14 8 Dh

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA273 package SOT1051-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline HVQFN41: plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm B D SOT1055-1 A terminal 1 index area E A A1 c detail X e1 e 1/2 e L v w b 2e 10 20 9 M M C C A B C y y1 C 21 Ej 2e e2 1/2 e Eh e 1

prtr5v0u6s

Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Contextual Info: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years

IP4283CZ10

Abstract: TSSOP10 XSON10U IP4220CZ6 SOT1059-1 sot552-1
Contextual Info: IP4283CZ10 series ESD protection for ultra high-speed interfaces Rev. 2 — 27 August 2010 Product data sheet 1. Product profile 1.1 General description The devices are designed to protect high-speed interfaces such as High-Definition Multimedia Interface HDMI , DisplayPort, external Serial Advanced Technology

AC128 transistor

Abstract: bc649 BC646 AC188 ac187 BCS48 bc660 AC188 transistor transistor AC128 AC188 AC187
Contextual Info: Transistors germanium low/medium power transistors Dwg. ref. O utline •b z -0 ?î book 1 parts 1 and 2 V CBO V V ceo (V) M axim um Ratings lCM IC(AV) (A ) (A) Ptot at 25PC (°C> <mW) Tj m in. at •c fT ty p . (m A i (MHz) 2.5 h FE max. Special Features

SSM3J307T

Abstract: SSM3J328R SSM3J334R
Contextual Info: 2011-5 PRODUCT GUIDE General-Purpose Small-Signal Surface-Mount Devices Transistors, MOSFETs, ESD-Protection Diodes, Schottky Barrier Diodes, L-MOS 1- to 3-Gate Logic ICs , LDOs, Operational Amplifiers, Digital-Output Magnetic Sensors SEMICONDUCTOR h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g

Contextual Info: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 04 — 25 November 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the

Arduino Mega2560

Abstract: 13001 S 6D TRANSISTOR arduino uno rev 3 agilent optical encoder 9988 MZ 13001 TRANSISTOR arduino mega 2650 skiip 613 gb 123 ct arduino sound sensor module pic arduino nano mc34063l
Contextual Info: ND3% BASE1 XXXX2108-0010-1-P 10 TSQ: 3001 CMS: CMS-USM TS host OP: NN COMP: 15-07-11 Hour: 13:07 TS:TS date TS time MCUS, MPUS, DSPS & DEVELOPMENT TOOLS Find Datasheets Online 8-BIT MCUS & DEVELOPMENT TOOLS 1 PSoC 3 DEVELOPMENT KITS ARDUINO MCU DEVLOPMENT PLATFORM

hwson8 footprint

Abstract: SE97 1E70H JESD22-A114 JESD22-A115 JESD78 SE98 Diode BAW 62 SE98B
Contextual Info: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 03 — 17 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the

SE97A

Abstract: SE97B DDR3 DIMM SE97 SE97PW jedec MO229 JESD22-A114 JESD22-A115 JESD78 SE97TK
Contextual Info: SE97 DDR memory module temp sensor with integrated SPD, 3.3 V Rev. 04 — 30 January 2009 Product data sheet 1. General description The NXP Semiconductors SE97 measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C and also provide 256 bytes

IP4056

Abstract: SIMCARD Schematic Hdmi to micro usb wiring diagram ip4065cx11 SD-Card MMC IP4826CX12 IP4056CX8 IP4058CX8 IP5002CX8 back2back diode
Contextual Info: Integrated Discretes Interface conditioning and interface protection in mobile appliances Rev. 8.1 — 9 March 2011 Brochure Document information Info Content Keywords Integrated Discretes, EMI filter, ESD protection, chip scale package CSP , level shifting, memory card, SD memory card, MMC, T-flash,

Silicon Tuners

Abstract: Temperature sensors TDA18272 tda18273 TDA20136 convert sata to usb cable diagram tda19997 usb to sata converter circuit diagram TDA20142 TDA19995
Contextual Info: Application guide Flat-panel TV sets Contents Your partner for flat-panel TV sets 3 1. Power solutions 4 1.1 1.2 1.3 1.4 Primary AC/DC controllers Main power supply: secondary synchronous rectification ICs Standby power supply Discretes 2. RF reception stage

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products

RPY 86

Abstract: valvo halbleiter RPY94 CQY 24 BV EI 30-20 3001 LDR 03 diode byx 64 600 valvo transistoren KP101A BAV99-1
Contextual Info: Elektronik. Wir bauen die Elemente. v a i v D Halbleiterbauelemente Produktprogramm DH, April 1984 Elektronik. Wir bauen die Elemente Unser Arbeitsgebiet - besonders die Mikroelektronik - entwickelt sich immer rascher zum Motor für eine Vielzahl von Innovationen. Mit gründ­

Contextual Info: SE98A DDR memory module temp sensor, 1.7 V to 3.6 V Rev. 02 — 6 August 2009 Product data sheet 1. General description The NXP Semiconductors SE98A measures temperature from −40 °C and +125 °C with JEDEC Grade B ±1 °C accuracy between +75 °C and +95 °C communicating via the