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    SOT-74 Search Results

    SOT-74 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MKZ6V2 Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.2 V, SOT-23 Visit Toshiba Electronic Devices & Storage Corporation
    MSZ6V8 Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.8 V, SOT-346 Visit Toshiba Electronic Devices & Storage Corporation
    MUZ20V Toshiba Electronic Devices & Storage Corporation Zener Diode, 20 V, SOT-323 Visit Toshiba Electronic Devices & Storage Corporation
    MKZ6V8 Toshiba Electronic Devices & Storage Corporation Zener Diode, 6.8 V, SOT-23 Visit Toshiba Electronic Devices & Storage Corporation
    MSZ12V Toshiba Electronic Devices & Storage Corporation Zener Diode, 12 V, SOT-346 Visit Toshiba Electronic Devices & Storage Corporation

    SOT-74 Datasheets (16)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT740-1 NXP Semiconductors Footprint for reflow soldering SOT740-1 Original PDF
    SOT740-1 NXP Semiconductors Plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm Original PDF
    SOT740-2 NXP Semiconductors Plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm Original PDF
    SOT741-1 NXP Semiconductors Footprint for reflow soldering SOT741-1 Original PDF
    SOT741-1 NXP Semiconductors Plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm Original PDF
    SOT744-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm Original PDF
    SOT745-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm Original PDF
    SOT745-1 NXP Semiconductors Footprint for reflow soldering SOT745-1 Original PDF
    SOT746-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm Original PDF
    SOT746-1 NXP Semiconductors Footprint for reflow soldering SOT746-1 Original PDF
    SOT747-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm Original PDF
    SOT747-1 NXP Semiconductors Footprint for reflow soldering SOT747-1 Original PDF
    SOT748-1 NXP Semiconductors Plastic chip on foil package; 35 mm wide tape Original PDF
    SOT748-2 NXP Semiconductors Plastic chip on foil package; 35 mm wide tape Original PDF
    SOT748-3 NXP Semiconductors Plastic chip on foil package; 48 mm wide tape Original PDF
    SOT748-4 NXP Semiconductors Plastic chip on foil package; 48 mm wide tape Original PDF