SOT261-2 |
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NXP Semiconductors
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Footprint for wave soldering |
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Original |
PDF
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SOT261-2 |
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NXP Semiconductors
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Plastic leaded chip carrier; 28 leads |
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Original |
PDF
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SOT261-3 |
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NXP Semiconductors
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Footprint for wave soldering |
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Original |
PDF
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SOT261-3 |
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NXP Semiconductors
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Plastic leaded chip carrier; 28 leads; pedestal |
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Original |
PDF
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SOT262A1 |
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NXP Semiconductors
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Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT262A2 |
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NXP Semiconductors
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Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT262B |
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NXP Semiconductors
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Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT263 |
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Philips Semiconductors
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Package outline |
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Original |
PDF
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SOT263-01 |
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NXP Semiconductors
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Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option |
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Original |
PDF
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SOT263B |
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NXP Semiconductors
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Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 |
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Original |
PDF
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SOT263B-01 |
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NXP Semiconductors
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Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option |
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Original |
PDF
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SOT266-1 |
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NXP Semiconductors
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Footprint for reflow soldering |
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Original |
PDF
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SOT266-1 |
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NXP Semiconductors
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Plastic shrink small outline package; 20 leads; body width 4.4 mm |
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Original |
PDF
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SOT266-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT266-1 |
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Original |
PDF
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SOT266-1_118 |
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NXP Semiconductors
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SSOP20; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
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Original |
PDF
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SOT268A |
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NXP Semiconductors
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Flanged double-ended ceramic package; 2 mounting holes; 4 leads |
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Original |
PDF
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SOT268A_112 |
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NXP Semiconductors
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CDFM4; blister pack; standard product orientation 12NC ending 112 |
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Original |
PDF
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